JPS5870110A - リ−ド整列状態検査装置 - Google Patents
リ−ド整列状態検査装置Info
- Publication number
- JPS5870110A JPS5870110A JP57134792A JP13479282A JPS5870110A JP S5870110 A JPS5870110 A JP S5870110A JP 57134792 A JP57134792 A JP 57134792A JP 13479282 A JP13479282 A JP 13479282A JP S5870110 A JPS5870110 A JP S5870110A
- Authority
- JP
- Japan
- Prior art keywords
- light beam
- lead
- line
- along
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000014676 Phragmites communis Nutrition 0.000 title description 4
- 230000003287 optical effect Effects 0.000 claims description 108
- 238000001514 detection method Methods 0.000 claims description 32
- 238000005452 bending Methods 0.000 claims description 29
- 238000012545 processing Methods 0.000 claims description 11
- 230000005484 gravity Effects 0.000 claims description 7
- 238000007689 inspection Methods 0.000 claims description 7
- 230000004044 response Effects 0.000 claims description 7
- 238000012360 testing method Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 21
- 238000010586 diagram Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 15
- 238000003908 quality control method Methods 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 241000270666 Testudines Species 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 241000283973 Oryctolagus cuniculus Species 0.000 description 2
- 230000009849 deactivation Effects 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012552 review Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000237519 Bivalvia Species 0.000 description 1
- 235000006693 Cassia laevigata Nutrition 0.000 description 1
- 241000238366 Cephalopoda Species 0.000 description 1
- 244000046038 Ehretia acuminata Species 0.000 description 1
- 235000009300 Ehretia acuminata Nutrition 0.000 description 1
- 241000238413 Octopus Species 0.000 description 1
- 244000086363 Pterocarpus indicus Species 0.000 description 1
- 235000009984 Pterocarpus indicus Nutrition 0.000 description 1
- 241000522641 Senna Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 235000020639 clam Nutrition 0.000 description 1
- 210000001520 comb Anatomy 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229940124513 senna glycoside Drugs 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28992181A | 1981-08-03 | 1981-08-03 | |
| US289921 | 1981-08-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5870110A true JPS5870110A (ja) | 1983-04-26 |
| JPH0337682B2 JPH0337682B2 (enExample) | 1991-06-06 |
Family
ID=23113744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57134792A Granted JPS5870110A (ja) | 1981-08-03 | 1982-08-03 | リ−ド整列状態検査装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5870110A (enExample) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6012800A (ja) * | 1983-04-27 | 1985-01-23 | ユニバ−サル・インストルメンツ・コ−ポレ−シヨン | 電気部品の試験装置 |
| JPS6076134A (ja) * | 1983-09-30 | 1985-04-30 | Nec Kansai Ltd | 軸状部材の外観検査装置 |
| JPS60213041A (ja) * | 1984-04-09 | 1985-10-25 | Sanwa Electron Kk | Ｉｃのピンの状態検出装置 |
| JPS60229355A (ja) * | 1984-04-27 | 1985-11-14 | Sanwa Electron Kk | Ｉｃのピンの状態検出方法 |
| JPS60229356A (ja) * | 1984-04-27 | 1985-11-14 | Sanwa Electron Kk | Ｉｃのピンの曲がり検出方法 |
| JPS6174346A (ja) * | 1984-09-19 | 1986-04-16 | Kokusai Syst Sci Kk | Ｄｉｐタイプのデバイス検査方法 |
| JPS61279146A (ja) * | 1985-06-05 | 1986-12-09 | Nhk Spring Co Ltd | 電子部品の脚片の不良検出装置 |
| JPS61280629A (ja) * | 1985-02-28 | 1986-12-11 | テキサス インスツルメンツ インコーポレイテツド | 電気接続用コネクタピンを自動的に検査する装置ならびに方式 |
| JPS61283200A (ja) * | 1985-06-10 | 1986-12-13 | 国際システムサイエンス株式会社 | Ｉｃのピン曲りチエツカ− |
| JPS63196053A (ja) * | 1987-02-09 | 1988-08-15 | Datsuku Eng Kk | Ｉｃ外観検査方法 |
| EP0222072A3 (en) * | 1985-10-11 | 1989-03-22 | Hitachi, Ltd. | Method of loading surface mounted device and an apparatus therefor |
| US5189707A (en) * | 1985-10-11 | 1993-02-23 | Hitachi, Ltd. | Method of loading surface mounted device and an apparatus therefor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5365071A (en) * | 1976-11-22 | 1978-06-10 | Nec Corp | External lead bend detector of electronic parts |
| JPS5663275A (en) * | 1979-10-30 | 1981-05-29 | Nec Kyushu Ltd | Lead testing device for semiconductor device |
-
1982
- 1982-08-03 JP JP57134792A patent/JPS5870110A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5365071A (en) * | 1976-11-22 | 1978-06-10 | Nec Corp | External lead bend detector of electronic parts |
| JPS5663275A (en) * | 1979-10-30 | 1981-05-29 | Nec Kyushu Ltd | Lead testing device for semiconductor device |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6012800A (ja) * | 1983-04-27 | 1985-01-23 | ユニバ−サル・インストルメンツ・コ−ポレ−シヨン | 電気部品の試験装置 |
| JPS6076134A (ja) * | 1983-09-30 | 1985-04-30 | Nec Kansai Ltd | 軸状部材の外観検査装置 |
| JPS60213041A (ja) * | 1984-04-09 | 1985-10-25 | Sanwa Electron Kk | Ｉｃのピンの状態検出装置 |
| JPS60229355A (ja) * | 1984-04-27 | 1985-11-14 | Sanwa Electron Kk | Ｉｃのピンの状態検出方法 |
| JPS60229356A (ja) * | 1984-04-27 | 1985-11-14 | Sanwa Electron Kk | Ｉｃのピンの曲がり検出方法 |
| JPS6174346A (ja) * | 1984-09-19 | 1986-04-16 | Kokusai Syst Sci Kk | Ｄｉｐタイプのデバイス検査方法 |
| JPS61280629A (ja) * | 1985-02-28 | 1986-12-11 | テキサス インスツルメンツ インコーポレイテツド | 電気接続用コネクタピンを自動的に検査する装置ならびに方式 |
| JPS61279146A (ja) * | 1985-06-05 | 1986-12-09 | Nhk Spring Co Ltd | 電子部品の脚片の不良検出装置 |
| JPS61283200A (ja) * | 1985-06-10 | 1986-12-13 | 国際システムサイエンス株式会社 | Ｉｃのピン曲りチエツカ− |
| EP0222072A3 (en) * | 1985-10-11 | 1989-03-22 | Hitachi, Ltd. | Method of loading surface mounted device and an apparatus therefor |
| US5189707A (en) * | 1985-10-11 | 1993-02-23 | Hitachi, Ltd. | Method of loading surface mounted device and an apparatus therefor |
| JPS63196053A (ja) * | 1987-02-09 | 1988-08-15 | Datsuku Eng Kk | Ｉｃ外観検査方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0337682B2 (enExample) | 1991-06-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5870110A (ja) | リ−ド整列状態検査装置 | |
| US4553843A (en) | Apparatus for determining the alignment of leads on a body | |
| US6144452A (en) | Electronic component mounting apparatus | |
| JPS62195509A (ja) | 電子部品形状検査装置 | |
| US6188784B1 (en) | Split optics arrangement for vision inspection/sorter module | |
| KR100339174B1 (ko) | 검사 장치 및 방법 | |
| JP2978860B2 (ja) | 電子部品の外観検査装置 | |
| US6222629B1 (en) | Procedure and system for inspecting a component with leads to determine its fitness for assembly | |
| JPS6313687A (ja) | レ−ザ−書き込み法におけるシステムの信頼性を向上させる方法とその装置 | |
| US6229608B1 (en) | Procedure and system for inspecting a component with leads to determine its fitness for assembly | |
| JPH0776754B2 (ja) | Ｉｃリード曲り検出方法 | |
| JPS61279143A (ja) | 電子部品の脚片の不良検出装置 | |
| JPH042905A (ja) | Ｉｃリードの曲り検出方法 | |
| JPS61279145A (ja) | 電子部品の脚片の不良検出装置 | |
| JP2758550B2 (ja) | 外観検査装置 | |
| JP2012252003A (ja) | 高速光学センサ検査システム | |
| KR100204827B1 (ko) | 아이씨 패키지의 리드핀 검사장치 및 검사방법 | |
| JPH0777317B2 (ja) | 電子部品のリ−ド曲り検出装置 | |
| JPH06194130A (ja) | Ｉｃパッケージの外観自動検査方法 | |
| JP2726911B2 (ja) | Ｉｃリードの曲り検出方法 | |
| JP2890577B2 (ja) | リード形状検査装置 | |
| JPH0350417B2 (enExample) | ||
| JPH0380547A (ja) | リードフレーム位置検出装置 | |
| JPH06147848A (ja) | 外観検査装置 | |
| JP2005055416A (ja) | Ｉｃチップ等の電子部品を試験するテストハンドラ装置に組み込まれる搬送装置用のラインセンサーｃｃｄカメラを用いた画像処理システム |