JPS5663275A - Lead testing device for semiconductor device - Google Patents

Lead testing device for semiconductor device

Info

Publication number
JPS5663275A
JPS5663275A JP14063379A JP14063379A JPS5663275A JP S5663275 A JPS5663275 A JP S5663275A JP 14063379 A JP14063379 A JP 14063379A JP 14063379 A JP14063379 A JP 14063379A JP S5663275 A JPS5663275 A JP S5663275A
Authority
JP
Japan
Prior art keywords
pitch
wires
shift
bend
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14063379A
Other languages
Japanese (ja)
Inventor
Noriaki Horibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP14063379A priority Critical patent/JPS5663275A/en
Publication of JPS5663275A publication Critical patent/JPS5663275A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: To ensure a steady test of a wide range including the flaw and bend, by detecting the image according to the reflected light of the lead wire of a semiconductor device which is set still at the fixed position by the intermittent shift with every specified pitch.
CONSTITUTION: An intermittent shift is given with every pitch to several semiconductor devices 1 having the specified pitch by the slit plate 6 containing the slits with every pitch and the stopper 5. With this shift, the lead wires 2 and 2' of the device 1 which is set still at the fixed position are irradiated by the external light sources 3 and 3'. And the reflected light images from the wires 2 and 2' are detected through the video cameras 4 and 4'. In such constitution, not only the bend but the flaws and others can be tested for the wires 2 and 2', thus ensuring a steady and accurate test over a wide range.
COPYRIGHT: (C)1981,JPO&Japio
JP14063379A 1979-10-30 1979-10-30 Lead testing device for semiconductor device Pending JPS5663275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14063379A JPS5663275A (en) 1979-10-30 1979-10-30 Lead testing device for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14063379A JPS5663275A (en) 1979-10-30 1979-10-30 Lead testing device for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5663275A true JPS5663275A (en) 1981-05-29

Family

ID=15273221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14063379A Pending JPS5663275A (en) 1979-10-30 1979-10-30 Lead testing device for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5663275A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5870110A (en) * 1981-08-03 1983-04-26 マイクロコンポ−ネント　テクノロジ−　インコ−ポレ−テツド Device for inspecting state of arrangement of reed
JPS60160137A (en) * 1984-01-30 1985-08-21 Nec Kyushu Ltd Bent lead detection process
JPS60229355A (en) * 1984-04-27 1985-11-14 Sanwa Electron Kk Detection for condition of pin of ic
JPS6279644A (en) * 1985-10-02 1987-04-13 Sanwa Electron Kk Inspecting device for ic pin
JPS63196053A (en) * 1987-02-09 1988-08-15 Datsuku Eng Kk Visual inspection of ic

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5870110A (en) * 1981-08-03 1983-04-26 マイクロコンポ−ネント　テクノロジ−　インコ−ポレ−テツド Device for inspecting state of arrangement of reed
JPH0337682B2 (en) * 1981-08-03 1991-06-06 Maikuro Konhoonento Tekunorojii Inc
JPS60160137A (en) * 1984-01-30 1985-08-21 Nec Kyushu Ltd Bent lead detection process
JPH0340944B2 (en) * 1984-01-30 1991-06-20
JPS60229355A (en) * 1984-04-27 1985-11-14 Sanwa Electron Kk Detection for condition of pin of ic
JPS6279644A (en) * 1985-10-02 1987-04-13 Sanwa Electron Kk Inspecting device for ic pin
JPS63196053A (en) * 1987-02-09 1988-08-15 Datsuku Eng Kk Visual inspection of ic

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