JPS5867034A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS5867034A
JPS5867034A JP56166697A JP16669781A JPS5867034A JP S5867034 A JPS5867034 A JP S5867034A JP 56166697 A JP56166697 A JP 56166697A JP 16669781 A JP16669781 A JP 16669781A JP S5867034 A JPS5867034 A JP S5867034A
Authority
JP
Japan
Prior art keywords
wire
capillary
length
clamper
wire loop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56166697A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347144B2 (OSRAM
Inventor
Takeshi Hasegawa
猛 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56166697A priority Critical patent/JPS5867034A/ja
Publication of JPS5867034A publication Critical patent/JPS5867034A/ja
Publication of JPS6347144B2 publication Critical patent/JPS6347144B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W70/682—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07551—
    • H10W72/07553—
    • H10W72/531—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5366—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP56166697A 1981-10-19 1981-10-19 ワイヤボンデイング方法 Granted JPS5867034A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56166697A JPS5867034A (ja) 1981-10-19 1981-10-19 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56166697A JPS5867034A (ja) 1981-10-19 1981-10-19 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS5867034A true JPS5867034A (ja) 1983-04-21
JPS6347144B2 JPS6347144B2 (OSRAM) 1988-09-20

Family

ID=15836061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56166697A Granted JPS5867034A (ja) 1981-10-19 1981-10-19 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS5867034A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4597522A (en) * 1983-12-26 1986-07-01 Kabushiki Kaisha Toshiba Wire bonding method and device
US20110000951A1 (en) * 2008-03-17 2011-01-06 Kulicke And Soffa Industries, Inc. Wire payout measurement and calibration techniques for a wire bonding machine

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01267143A (ja) * 1988-04-16 1989-10-25 Tohoku Ricoh Co Ltd ラベルプリンタにおけるラベル紙検知方式

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4597522A (en) * 1983-12-26 1986-07-01 Kabushiki Kaisha Toshiba Wire bonding method and device
US20110000951A1 (en) * 2008-03-17 2011-01-06 Kulicke And Soffa Industries, Inc. Wire payout measurement and calibration techniques for a wire bonding machine
US8302841B2 (en) * 2008-03-17 2012-11-06 Kulicke And Soffa Industries Wire payout measurement and calibration techniques for a wire bonding machine

Also Published As

Publication number Publication date
JPS6347144B2 (OSRAM) 1988-09-20

Similar Documents

Publication Publication Date Title
US4932584A (en) Method of wire bonding
US5156323A (en) Wire bonding method
US6062462A (en) Apparatus and method for making predetermined fine wire ball sizes
JPS5867034A (ja) ワイヤボンデイング方法
KR20000022851A (ko) 와이어 본딩방법
KR970067730A (ko) 미리 결정된 형상으로 와이어를 연결하기 위한 방법
JPS5834935A (ja) ボンディング方法
JPS5879727A (ja) ワイヤボンデイング装置及びその方法
JPS5858737A (ja) ワイヤボンデイング方法
JPS58220436A (ja) ワイヤボンデイング方法
JPS62254442A (ja) 超音波ワイヤボンデイング装置
JPS6098634A (ja) ワイヤボンデイング方法
JPS6052030A (ja) ワイヤボンディング装置
JPS5742141A (en) Wire bonding apparatus
JP2000277558A (ja) ワイヤボンディング方法及び装置
JPH0158136B2 (OSRAM)
JPS5919341A (ja) ワイヤボンデイング装置
JPH05326605A (ja) ワイヤボンディング方法およびその装置
JPH06132344A (ja) ワイヤボンディング装置
JPH02166408A (ja) 光ファイバを先細にする装置と方法
JPS6083342A (ja) ワイヤボンデイング方法
JPH0611066B2 (ja) ワイヤボンデイング装置
JPS59220939A (ja) ワイヤボンデイング方法および装置
JPH0147893B2 (OSRAM)
JPS5879728A (ja) ワイヤボンデイング方法