JPS5866640U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5866640U
JPS5866640U JP1981160265U JP16026581U JPS5866640U JP S5866640 U JPS5866640 U JP S5866640U JP 1981160265 U JP1981160265 U JP 1981160265U JP 16026581 U JP16026581 U JP 16026581U JP S5866640 U JPS5866640 U JP S5866640U
Authority
JP
Japan
Prior art keywords
semiconductor device
utility
model registration
external lead
lead plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981160265U
Other languages
English (en)
Japanese (ja)
Other versions
JPS642440Y2 (enrdf_load_html_response
Inventor
一夫 小林
達哉 新井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP1981160265U priority Critical patent/JPS5866640U/ja
Publication of JPS5866640U publication Critical patent/JPS5866640U/ja
Application granted granted Critical
Publication of JPS642440Y2 publication Critical patent/JPS642440Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1981160265U 1981-10-29 1981-10-29 半導体装置 Granted JPS5866640U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981160265U JPS5866640U (ja) 1981-10-29 1981-10-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981160265U JPS5866640U (ja) 1981-10-29 1981-10-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS5866640U true JPS5866640U (ja) 1983-05-06
JPS642440Y2 JPS642440Y2 (enrdf_load_html_response) 1989-01-20

Family

ID=29952680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981160265U Granted JPS5866640U (ja) 1981-10-29 1981-10-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS5866640U (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01255257A (ja) * 1988-04-05 1989-10-12 Toshiba Corp 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5384556A (en) * 1976-12-29 1978-07-26 Fujitsu Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5384556A (en) * 1976-12-29 1978-07-26 Fujitsu Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01255257A (ja) * 1988-04-05 1989-10-12 Toshiba Corp 半導体装置

Also Published As

Publication number Publication date
JPS642440Y2 (enrdf_load_html_response) 1989-01-20

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