JPS5853818A - チップ状固体電解コンデンサおよびその製造方法 - Google Patents
チップ状固体電解コンデンサおよびその製造方法Info
- Publication number
- JPS5853818A JPS5853818A JP15258881A JP15258881A JPS5853818A JP S5853818 A JPS5853818 A JP S5853818A JP 15258881 A JP15258881 A JP 15258881A JP 15258881 A JP15258881 A JP 15258881A JP S5853818 A JPS5853818 A JP S5853818A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- solid electrolytic
- resin
- shaped solid
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 15
- 239000007787 solid Substances 0.000 title claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000003990 capacitor Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 3
- 238000005422 blasting Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000005476 soldering Methods 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000004544 spot-on Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15258881A JPS5853818A (ja) | 1981-09-26 | 1981-09-26 | チップ状固体電解コンデンサおよびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15258881A JPS5853818A (ja) | 1981-09-26 | 1981-09-26 | チップ状固体電解コンデンサおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5853818A true JPS5853818A (ja) | 1983-03-30 |
| JPS6113370B2 JPS6113370B2 (enrdf_load_stackoverflow) | 1986-04-12 |
Family
ID=15543730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15258881A Granted JPS5853818A (ja) | 1981-09-26 | 1981-09-26 | チップ状固体電解コンデンサおよびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5853818A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01230218A (ja) * | 1988-03-10 | 1989-09-13 | Matsuo Denki Kk | 固体電解コンデンサの端子の処理方法 |
| WO2006064669A1 (ja) * | 2004-12-16 | 2006-06-22 | Rohm Co., Ltd. | 固体電解コンデンサ及びこの固体電解コンデンサの基板への実装構造 |
-
1981
- 1981-09-26 JP JP15258881A patent/JPS5853818A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01230218A (ja) * | 1988-03-10 | 1989-09-13 | Matsuo Denki Kk | 固体電解コンデンサの端子の処理方法 |
| WO2006064669A1 (ja) * | 2004-12-16 | 2006-06-22 | Rohm Co., Ltd. | 固体電解コンデンサ及びこの固体電解コンデンサの基板への実装構造 |
| US7729102B2 (en) | 2004-12-16 | 2010-06-01 | Rohm Co., Ltd. | Solid electrolytic capacitor and structure for mounting this solid electrolytic capacitor on board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6113370B2 (enrdf_load_stackoverflow) | 1986-04-12 |
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