JPS6113370B2 - - Google Patents
Info
- Publication number
- JPS6113370B2 JPS6113370B2 JP15258881A JP15258881A JPS6113370B2 JP S6113370 B2 JPS6113370 B2 JP S6113370B2 JP 15258881 A JP15258881 A JP 15258881A JP 15258881 A JP15258881 A JP 15258881A JP S6113370 B2 JPS6113370 B2 JP S6113370B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- adhesive
- solid electrolytic
- electrolytic capacitor
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 14
- 239000003990 capacitor Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 239000007787 solid Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 4
- 238000005422 blasting Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 229920002050 silicone resin Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15258881A JPS5853818A (ja) | 1981-09-26 | 1981-09-26 | チップ状固体電解コンデンサおよびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15258881A JPS5853818A (ja) | 1981-09-26 | 1981-09-26 | チップ状固体電解コンデンサおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5853818A JPS5853818A (ja) | 1983-03-30 |
JPS6113370B2 true JPS6113370B2 (enrdf_load_stackoverflow) | 1986-04-12 |
Family
ID=15543730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15258881A Granted JPS5853818A (ja) | 1981-09-26 | 1981-09-26 | チップ状固体電解コンデンサおよびその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5853818A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01230218A (ja) * | 1988-03-10 | 1989-09-13 | Matsuo Denki Kk | 固体電解コンデンサの端子の処理方法 |
JP2006173383A (ja) | 2004-12-16 | 2006-06-29 | Rohm Co Ltd | 固体電解コンデンサ及びこの固体電解コンデンサの基板への実装構造 |
-
1981
- 1981-09-26 JP JP15258881A patent/JPS5853818A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5853818A (ja) | 1983-03-30 |
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