JPS5846451U - Pressure contact type semiconductor device - Google Patents
Pressure contact type semiconductor deviceInfo
- Publication number
- JPS5846451U JPS5846451U JP14126281U JP14126281U JPS5846451U JP S5846451 U JPS5846451 U JP S5846451U JP 14126281 U JP14126281 U JP 14126281U JP 14126281 U JP14126281 U JP 14126281U JP S5846451 U JPS5846451 U JP S5846451U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- type semiconductor
- contact type
- pressure contact
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
- Thyristors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の圧接型半導体装置の断面部、第２図は第
１図の銅フランジの位置決め用凹部の詳細を示す部分断
面図、第３図は本考案の一実施例の位置決め用凹部を示
す部分断面図である。
１・・・サイリスタ基体、２・・・支持板、３．４・・
・銅ブロック、６．７・・・金属フランジ、８・・・筒
状絶縁体、９・・・外部ゲート端子、１０・・・位置決
め用凹部、１１・・・キャップ状円筒、１２・・・ろう
材、１６・・・ろう材流れ止め用役付き金属フランジ、
１７．１８・・・ろう材流れ止め用段部。FIG. 1 is a cross-sectional view of a conventional press-contact type semiconductor device, FIG. 2 is a partial cross-sectional view showing details of the positioning recess of the copper flange shown in FIG. 1, and FIG. 3 is a positioning recess of an embodiment of the present invention. FIG. 1... Thyristor base, 2... Support plate, 3.4...
- Copper block, 6.7... Metal flange, 8... Cylindrical insulator, 9... External gate terminal, 10... Positioning recess, 11... Cap-shaped cylinder, 12... Brazing filler metal, 16...Metal flange with brazing filler metal flow prevention function,
17.18...Stepped portion for preventing flow of brazing material.
Claims (1)
らに前記銅ブロツク電極の外側に、中央部に位置決め用
の凹部を有する金属フランジがかふせられて、この一対
の金属フランジと筒型絶縁体とにより密封容器を形成し
てなる圧接型半導体装置において、前記金属フランジは
前記凹部の外周を囲んで設けられたろう材流れ止め用段
部を有し、かつ、前記凹部は予じめあけられた穴の周辺
にキャップ状筒の開口部が接着されて形成されて赴るも
のであることを特徴とする圧接型半導体装置。 、A semiconductor substrate is sandwiched between a pair of copper block electrodes, and a metal flange having a positioning recess in the center is covered on the outside of the copper block electrode, and a cylindrical insulator is connected to the pair of metal flanges. In a press-contact type semiconductor device formed by forming a sealed container with a body, the metal flange has a step portion for preventing flow of brazing material provided around the outer periphery of the recess, and the recess is pre-drilled. 1. A pressure contact type semiconductor device, characterized in that an opening of a cap-shaped cylinder is formed around a hole formed by adhesively bonding the opening. ,
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14126281U JPS5846451U (en) | 1981-09-22 | 1981-09-22 | Pressure contact type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14126281U JPS5846451U (en) | 1981-09-22 | 1981-09-22 | Pressure contact type semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5846451U true JPS5846451U (en) | 1983-03-29 |
| JPS626692Y2 JPS626692Y2 (en) | 1987-02-16 |
Family
ID=29934374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14126281U Granted JPS5846451U (en) | 1981-09-22 | 1981-09-22 | Pressure contact type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5846451U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4727471B2 (en) * | 2006-03-22 | 2011-07-20 | 株式会社豊田中央研究所 | Semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4718971U (en) * | 1971-04-01 | 1972-11-02 |
-
1981
- 1981-09-22 JP JP14126281U patent/JPS5846451U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4718971U (en) * | 1971-04-01 | 1972-11-02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS626692Y2 (en) | 1987-02-16 |
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