JPS5818347U - Can case type semiconductor device - Google Patents
Can case type semiconductor deviceInfo
- Publication number
- JPS5818347U JPS5818347U JP11283181U JP11283181U JPS5818347U JP S5818347 U JPS5818347 U JP S5818347U JP 11283181 U JP11283181 U JP 11283181U JP 11283181 U JP11283181 U JP 11283181U JP S5818347 U JPS5818347 U JP S5818347U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- case type
- type semiconductor
- substrate
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、従来よりの罐ケース型パワートランジスタの
断面図、第2図はその要部拡大断面図、第3図は、この
考案の第1実施例を示す罐ケース型パワートランジスタ
の断面図、第4図はその円A部の拡大断面図、第5図は
この考案の第2実施例を示す第4図に対応させた罐ケー
ス型パワートランジスタの要部断面図である。
訃・・・・・半導体ペレット、16・・・・・・金属キ
ャップ、17・・・・・・筒状部、18・・・・・・フ
ランジ部、19・・・・・・境界縁部、20・・・・・
・ステム基板、21.23・・・・・・凹溝。Fig. 1 is a sectional view of a conventional can case type power transistor, Fig. 2 is an enlarged sectional view of its main parts, and Fig. 3 is a sectional view of a can case type power transistor showing the first embodiment of this invention. , FIG. 4 is an enlarged sectional view of the circle A section, and FIG. 5 is a sectional view of the main part of a can case type power transistor corresponding to FIG. 4 showing a second embodiment of this invention. Death: Semiconductor pellet, 16: Metal cap, 17: Cylindrical portion, 18: Flange portion, 19: Boundary edge , 20...
・Stem board, 21.23...concave groove.
Claims (1)
む主要部をノ1ット状金属キャップにて被冠して溶接封
止した半導体装置において、前記キャップの溶接封止用
フランジ部と筒状壁部との境界縁部を突出折曲げ形成す
るとともに、前記境界縁部と対応する基板上に凹溝を設
け、基板上の凹溝よりも外方の部分とフランジ部とを溶
接封止したことを特徴とする罐ケース型半導体装置。In a semiconductor device in which a semiconductor pellet is fixed on a substrate and the main part including the semiconductor pellet is covered with a knot-shaped metal cap and welded and sealed, the welding and sealing flange part of the cap and the cylindrical wall are provided. A boundary edge between the base plate and the base plate is formed by protruding and bent, a groove is provided on the substrate corresponding to the boundary edge, and a portion outside the groove on the substrate and the flange are sealed by welding. A can case type semiconductor device featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11283181U JPS5818347U (en) | 1981-07-27 | 1981-07-27 | Can case type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11283181U JPS5818347U (en) | 1981-07-27 | 1981-07-27 | Can case type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5818347U true JPS5818347U (en) | 1983-02-04 |
Family
ID=29907145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11283181U Pending JPS5818347U (en) | 1981-07-27 | 1981-07-27 | Can case type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5818347U (en) |
-
1981
- 1981-07-27 JP JP11283181U patent/JPS5818347U/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5818347U (en) | Can case type semiconductor device | |
JPS5821546U (en) | Airtight container with removable lid | |
JPS594857U (en) | Gasket for vacuum sealing | |
JPS5827939U (en) | Ceramic package | |
JPS60130685U (en) | sealed housing | |
JPS60121650U (en) | Chippukiyariya | |
JPS593473U (en) | dry battery | |
JPS5842946U (en) | Can case type semiconductor device | |
JPS591931U (en) | Sealed rolling bearing | |
JPS613664U (en) | sealed battery | |
JPS5933224U (en) | capacitor case | |
JPS5939863U (en) | battery | |
JPS5889989U (en) | Hybrid integrated circuit device | |
JPS60145665U (en) | metal gasket | |
JPS5858337U (en) | semiconductor equipment | |
JPS5879863U (en) | battery | |
JPS5815350U (en) | semiconductor equipment | |
JPS6115778U (en) | Structure of external conductive surface of electronic device housing | |
JPS5837073U (en) | heat pipe | |
JPS5846451U (en) | Pressure contact type semiconductor device | |
JPS5829849U (en) | semiconductor equipment | |
JPS6079830U (en) | Sealing structure of surface acoustic wave device | |
JPS60190078U (en) | Sealed welded structure of electronic equipment storage container | |
JPS5819523U (en) | Airtight package for circuit elements | |
JPS5895641U (en) | Resin-encapsulated semiconductor device |