JPS6115778U - Structure of external conductive surface of electronic device housing - Google Patents
Structure of external conductive surface of electronic device housingInfo
- Publication number
- JPS6115778U JPS6115778U JP10009984U JP10009984U JPS6115778U JP S6115778 U JPS6115778 U JP S6115778U JP 10009984 U JP10009984 U JP 10009984U JP 10009984 U JP10009984 U JP 10009984U JP S6115778 U JPS6115778 U JP S6115778U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- device housing
- external conductive
- conductive surface
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の一実施例を示す断面図、第2図は本考
案の一実施例を示す斜視図、第3図、第4図、第5図は
それそれ従来例を示す斜視図である。
11・・・塩ビ鋼板、12・・・金具、13・・・開口
、14・・・頂上面、15・・・基面、16・・・溶接
部。Fig. 1 is a sectional view showing an embodiment of the present invention, Fig. 2 is a perspective view showing an embodiment of the invention, and Figs. 3, 4, and 5 are perspective views showing conventional examples. It is. DESCRIPTION OF SYMBOLS 11... PVC steel plate, 12... Metal fitting, 13... Opening, 14... Top surface, 15... Base surface, 16... Welding part.
Claims (1)
前記鋼板の厚さとほぼ同じ高さに基面から突出する段差
部を前記開口に嵌合させ前記基面・ を筐体内面に溶接
され頂上面を前記開口から筐体外表面に露出させる金具
とにより構成されることを特徴とする電子機器筐体の外
表部導通面の構造。An opening provided in the PVC steel plate that constitutes the electronic device housing,
A step portion protruding from the base surface at a height approximately the same as the thickness of the steel plate is fitted into the opening, and the base surface is welded to the inner surface of the casing, and the top surface is exposed from the opening to the outer surface of the casing. 1. A structure of an external conductive surface of an electronic device casing, characterized in that:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10009984U JPS6115778U (en) | 1984-07-04 | 1984-07-04 | Structure of external conductive surface of electronic device housing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10009984U JPS6115778U (en) | 1984-07-04 | 1984-07-04 | Structure of external conductive surface of electronic device housing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6115778U true JPS6115778U (en) | 1986-01-29 |
Family
ID=30659567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10009984U Pending JPS6115778U (en) | 1984-07-04 | 1984-07-04 | Structure of external conductive surface of electronic device housing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6115778U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0256479U (en) * | 1988-10-15 | 1990-04-24 |
-
1984
- 1984-07-04 JP JP10009984U patent/JPS6115778U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0256479U (en) * | 1988-10-15 | 1990-04-24 |
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