JPS5843235Y2 - Ｄｈｄ形ダイオ−ド - Google Patents
Ｄｈｄ形ダイオ−ドInfo
- Publication number
- JPS5843235Y2 JPS5843235Y2 JP11820378U JP11820378U JPS5843235Y2 JP S5843235 Y2 JPS5843235 Y2 JP S5843235Y2 JP 11820378 U JP11820378 U JP 11820378U JP 11820378 U JP11820378 U JP 11820378U JP S5843235 Y2 JPS5843235 Y2 JP S5843235Y2
- Authority
- JP
- Japan
- Prior art keywords
- diode
- conductor
- glass
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical group [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11820378U JPS5843235Y2 (ja) | 1978-08-28 | 1978-08-28 | Ｄｈｄ形ダイオ−ド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11820378U JPS5843235Y2 (ja) | 1978-08-28 | 1978-08-28 | Ｄｈｄ形ダイオ−ド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5534683U JPS5534683U (enrdf_load_stackoverflow) | 1980-03-06 |
| JPS5843235Y2 true JPS5843235Y2 (ja) | 1983-09-30 |
Family
ID=29072319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11820378U Expired JPS5843235Y2 (ja) | 1978-08-28 | 1978-08-28 | Ｄｈｄ形ダイオ−ド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5843235Y2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6050339B2 (ja) * | 1980-02-26 | 1985-11-08 | ソニー株式会社 | 半導体素子 |
| JPS6240439Y2 (enrdf_load_stackoverflow) * | 1980-03-06 | 1987-10-16 | ||
| JPS5828859A (ja) * | 1981-08-13 | 1983-02-19 | Matsushita Electronics Corp | リ−ドレスガラス封止ダイオ−ド |
| JPS62142336A (ja) * | 1986-08-29 | 1987-06-25 | Matsushita Electronics Corp | リ−ドレスガラス封止ダイオ−ド |
-
1978
- 1978-08-28 JP JP11820378U patent/JPS5843235Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5534683U (enrdf_load_stackoverflow) | 1980-03-06 |
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