JPS5838988Y2 - 半導体装置用保護素子 - Google Patents
半導体装置用保護素子Info
- Publication number
- JPS5838988Y2 JPS5838988Y2 JP17446879U JP17446879U JPS5838988Y2 JP S5838988 Y2 JPS5838988 Y2 JP S5838988Y2 JP 17446879 U JP17446879 U JP 17446879U JP 17446879 U JP17446879 U JP 17446879U JP S5838988 Y2 JPS5838988 Y2 JP S5838988Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal wire
- package
- resin
- semiconductor device
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 13
- 239000002184 metal Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 5
- 230000015556 catabolic process Effects 0.000 claims description 5
- 239000003063 flame retardant Substances 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Fuses (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17446879U JPS5838988Y2 (ja) | 1979-12-17 | 1979-12-17 | 半導体装置用保護素子 |
| DE19803033323 DE3033323A1 (de) | 1979-09-11 | 1980-09-04 | Schutzvorrichtung fuer eine halbleitervorrichtung |
| DE3051177A DE3051177C2 (enrdf_load_stackoverflow) | 1979-09-11 | 1980-09-04 | |
| US06/537,161 US4547830A (en) | 1979-09-11 | 1983-09-30 | Device for protection of a semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17446879U JPS5838988Y2 (ja) | 1979-12-17 | 1979-12-17 | 半導体装置用保護素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5692347U JPS5692347U (enrdf_load_stackoverflow) | 1981-07-23 |
| JPS5838988Y2 true JPS5838988Y2 (ja) | 1983-09-02 |
Family
ID=29685199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17446879U Expired JPS5838988Y2 (ja) | 1979-09-11 | 1979-12-17 | 半導体装置用保護素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5838988Y2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0736315B2 (ja) * | 1982-11-01 | 1995-04-19 | 松下電器産業株式会社 | 角型チツプ状ヒユ−ズ部品 |
| JPS6016546U (ja) * | 1983-07-09 | 1985-02-04 | ロ−ム株式会社 | 半導体装置用保護素子 |
| JPH0524108Y2 (enrdf_load_stackoverflow) * | 1988-10-05 | 1993-06-18 | ||
| JP6660278B2 (ja) * | 2016-10-26 | 2020-03-11 | 三菱電機株式会社 | 樹脂封止型半導体装置 |
-
1979
- 1979-12-17 JP JP17446879U patent/JPS5838988Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5692347U (enrdf_load_stackoverflow) | 1981-07-23 |
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