JPS5833154A - 検査装置 - Google Patents
検査装置Info
- Publication number
- JPS5833154A JPS5833154A JP13146781A JP13146781A JPS5833154A JP S5833154 A JPS5833154 A JP S5833154A JP 13146781 A JP13146781 A JP 13146781A JP 13146781 A JP13146781 A JP 13146781A JP S5833154 A JPS5833154 A JP S5833154A
- Authority
- JP
- Japan
- Prior art keywords
- defect
- inspection
- wafer
- primary
- defects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13146781A JPS5833154A (ja) | 1981-08-24 | 1981-08-24 | 検査装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13146781A JPS5833154A (ja) | 1981-08-24 | 1981-08-24 | 検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5833154A true JPS5833154A (ja) | 1983-02-26 |
JPH0325738B2 JPH0325738B2 (sv) | 1991-04-08 |
Family
ID=15058637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13146781A Granted JPS5833154A (ja) | 1981-08-24 | 1981-08-24 | 検査装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5833154A (sv) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60194535A (ja) * | 1984-02-22 | 1985-10-03 | ケイエルエイ・インストラメンツ・コ−ポレ−シヨン | ウエハ−検査装置の電気的制御装置 |
JPS60202949A (ja) * | 1984-02-22 | 1985-10-14 | ケイエルエイ・インストラメンツ・コ−ポレ−シヨン | パターン化されたウエハーの自動的な検査装置 |
JPS6199845A (ja) * | 1984-10-22 | 1986-05-17 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 光学的欠陥検出装置 |
JPS61253758A (ja) * | 1985-04-30 | 1986-11-11 | Shimadzu Corp | 微小部分析装置 |
JPS61267246A (ja) * | 1985-05-21 | 1986-11-26 | Hitachi Ltd | 異物検出装置 |
JPS625547A (ja) * | 1985-07-01 | 1987-01-12 | Ulvac Corp | 基板表面上の異物観察装置 |
JPS6391947A (ja) * | 1986-10-03 | 1988-04-22 | Jeol Ltd | X線マイクロアナライザ− |
JPH01147513A (ja) * | 1987-12-04 | 1989-06-09 | Hitachi Ltd | 異物解析装置 |
JPH03181848A (ja) * | 1989-12-12 | 1991-08-07 | Sharp Corp | 半導体材料評価装置 |
EP0685731A1 (en) * | 1994-06-02 | 1995-12-06 | Mitsubishi Denki Kabushiki Kaisha | Positioning method and analysis method of fine foreign matter and analyzer used therefor |
JP2002168793A (ja) * | 2000-11-30 | 2002-06-14 | Fuji Photo Film Co Ltd | 表面欠陥検査装置および表面欠陥検査方法 |
JP2004170092A (ja) * | 2002-11-18 | 2004-06-17 | Hitachi Electronics Eng Co Ltd | 表面検査方法及び表面検査装置 |
JP2008014822A (ja) * | 2006-07-06 | 2008-01-24 | Canon Chemicals Inc | 板状体の検査装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5165362A (sv) * | 1974-11-30 | 1976-06-05 | Nissin Electric Co Ltd | |
JPS5618708A (en) * | 1979-07-23 | 1981-02-21 | Siemens Ag | Optoelectronic inspector |
-
1981
- 1981-08-24 JP JP13146781A patent/JPS5833154A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5165362A (sv) * | 1974-11-30 | 1976-06-05 | Nissin Electric Co Ltd | |
JPS5618708A (en) * | 1979-07-23 | 1981-02-21 | Siemens Ag | Optoelectronic inspector |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60202949A (ja) * | 1984-02-22 | 1985-10-14 | ケイエルエイ・インストラメンツ・コ−ポレ−シヨン | パターン化されたウエハーの自動的な検査装置 |
JPS60194535A (ja) * | 1984-02-22 | 1985-10-03 | ケイエルエイ・インストラメンツ・コ−ポレ−シヨン | ウエハ−検査装置の電気的制御装置 |
JPS6199845A (ja) * | 1984-10-22 | 1986-05-17 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 光学的欠陥検出装置 |
JPS61253758A (ja) * | 1985-04-30 | 1986-11-11 | Shimadzu Corp | 微小部分析装置 |
JPS61267246A (ja) * | 1985-05-21 | 1986-11-26 | Hitachi Ltd | 異物検出装置 |
JPS625547A (ja) * | 1985-07-01 | 1987-01-12 | Ulvac Corp | 基板表面上の異物観察装置 |
JPH0527939B2 (sv) * | 1985-07-01 | 1993-04-22 | Ulvac Corp | |
JPH0528466B2 (sv) * | 1986-10-03 | 1993-04-26 | Nippon Electron Optics Lab | |
JPS6391947A (ja) * | 1986-10-03 | 1988-04-22 | Jeol Ltd | X線マイクロアナライザ− |
JPH01147513A (ja) * | 1987-12-04 | 1989-06-09 | Hitachi Ltd | 異物解析装置 |
JPH03181848A (ja) * | 1989-12-12 | 1991-08-07 | Sharp Corp | 半導体材料評価装置 |
EP0685731A1 (en) * | 1994-06-02 | 1995-12-06 | Mitsubishi Denki Kabushiki Kaisha | Positioning method and analysis method of fine foreign matter and analyzer used therefor |
US5715052A (en) * | 1994-06-02 | 1998-02-03 | Mitsubishi Denki Kabushiki Kaisha | Method of detecting the position and the content of fine foreign matter on substrates and analyzers used therefor |
JP2002168793A (ja) * | 2000-11-30 | 2002-06-14 | Fuji Photo Film Co Ltd | 表面欠陥検査装置および表面欠陥検査方法 |
JP2004170092A (ja) * | 2002-11-18 | 2004-06-17 | Hitachi Electronics Eng Co Ltd | 表面検査方法及び表面検査装置 |
JP2008014822A (ja) * | 2006-07-06 | 2008-01-24 | Canon Chemicals Inc | 板状体の検査装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0325738B2 (sv) | 1991-04-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5493236A (en) | Test analysis apparatus and analysis method for semiconductor wafer using OBIC analysis | |
JPS5833154A (ja) | 検査装置 | |
JP2005017159A (ja) | 欠陥検査装置における検査レシピ設定方法および欠陥検査方法 | |
JPS62173731A (ja) | 被検査物の表面検査装置 | |
KR101777547B1 (ko) | 반도체 pcb 검사장비 및 검사방법 | |
KR20210121263A (ko) | 반도체 적용을 위한 참조 이미지 생성 | |
JP2002188999A (ja) | 異物・欠陥検出装置及び検出方法 | |
KR101104665B1 (ko) | 기판 검사 시스템, 기판 검사 방법 및 기판 검사 장치 | |
JP2004301847A (ja) | 欠陥検査装置およびその方法 | |
JPS5910231A (ja) | パタ−ン欠陥解析装置 | |
US4008967A (en) | Device for testing masks for semiconductor components | |
JPH0441497B2 (sv) | ||
JPH03156947A (ja) | 検査方法 | |
JP2970855B2 (ja) | 半導体記憶装置の検査方法 | |
US7518391B2 (en) | Probe card and a method for detecting defects using a probe card and an additional inspection | |
US5459404A (en) | Apparatus and method for detecting floating nodes | |
WO2024154237A1 (ja) | 放射線ビーム走査光学系及び検査装置 | |
US7457454B1 (en) | Detailed grey scale inspection method and apparatus | |
JPS5851528A (ja) | 半導体装置の製造方法 | |
JPH04225252A (ja) | 半導体装置の検査方法および装置 | |
JPH08102478A (ja) | 結晶欠陥検出装置 | |
JPS62274205A (ja) | リ−ド平坦度検査方法および装置 | |
JPS6165444A (ja) | 被検査チツプの回路パタ−ン外観検査方法並びにその装置 | |
JPH02140605A (ja) | 物体形状検査装置 | |
JPH06181244A (ja) | 半導体装置の検査方法および装置 |