JPS5831075A - 局部無電解メツキ方法 - Google Patents
局部無電解メツキ方法Info
- Publication number
- JPS5831075A JPS5831075A JP56130423A JP13042381A JPS5831075A JP S5831075 A JPS5831075 A JP S5831075A JP 56130423 A JP56130423 A JP 56130423A JP 13042381 A JP13042381 A JP 13042381A JP S5831075 A JPS5831075 A JP S5831075A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- paste
- electroless
- organic
- electroless plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56130423A JPS5831075A (ja) | 1981-08-19 | 1981-08-19 | 局部無電解メツキ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56130423A JPS5831075A (ja) | 1981-08-19 | 1981-08-19 | 局部無電解メツキ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5831075A true JPS5831075A (ja) | 1983-02-23 |
| JPS6237112B2 JPS6237112B2 (enrdf_load_stackoverflow) | 1987-08-11 |
Family
ID=15033887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56130423A Granted JPS5831075A (ja) | 1981-08-19 | 1981-08-19 | 局部無電解メツキ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5831075A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60133787A (ja) * | 1983-12-21 | 1985-07-16 | 日立化成工業株式会社 | フレキシブル印刷配線板の製造法 |
| JPS6366994A (ja) * | 1986-09-09 | 1988-03-25 | 日立エーアイシー株式会社 | 多層配線板 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0615219U (ja) * | 1992-07-27 | 1994-02-25 | 住友電気工業株式会社 | ウレタン樹脂被覆電線 |
| JP6466110B2 (ja) * | 2014-09-09 | 2019-02-06 | 住友電気工業株式会社 | プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5713164A (en) * | 1980-06-28 | 1982-01-23 | Matsushita Electric Ind Co Ltd | Paste of activating metallic material for electroless plating and plating method using said paste |
| JPS5713165A (en) * | 1980-06-28 | 1982-01-23 | Matsushita Electric Ind Co Ltd | Paste of activating metallic material for electroless plating and plating method using said paste |
-
1981
- 1981-08-19 JP JP56130423A patent/JPS5831075A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5713164A (en) * | 1980-06-28 | 1982-01-23 | Matsushita Electric Ind Co Ltd | Paste of activating metallic material for electroless plating and plating method using said paste |
| JPS5713165A (en) * | 1980-06-28 | 1982-01-23 | Matsushita Electric Ind Co Ltd | Paste of activating metallic material for electroless plating and plating method using said paste |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60133787A (ja) * | 1983-12-21 | 1985-07-16 | 日立化成工業株式会社 | フレキシブル印刷配線板の製造法 |
| JPS6366994A (ja) * | 1986-09-09 | 1988-03-25 | 日立エーアイシー株式会社 | 多層配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6237112B2 (enrdf_load_stackoverflow) | 1987-08-11 |
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