JPS5826525Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS5826525Y2 JPS5826525Y2 JP1977096121U JP9612177U JPS5826525Y2 JP S5826525 Y2 JPS5826525 Y2 JP S5826525Y2 JP 1977096121 U JP1977096121 U JP 1977096121U JP 9612177 U JP9612177 U JP 9612177U JP S5826525 Y2 JPS5826525 Y2 JP S5826525Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- bonding
- area
- semiconductor substrate
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
Landscapes
- Electrodes Of Semiconductors (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977096121U JPS5826525Y2 (ja) | 1977-07-18 | 1977-07-18 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977096121U JPS5826525Y2 (ja) | 1977-07-18 | 1977-07-18 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5423563U JPS5423563U (enExample) | 1979-02-16 |
| JPS5826525Y2 true JPS5826525Y2 (ja) | 1983-06-08 |
Family
ID=29029706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977096121U Expired JPS5826525Y2 (ja) | 1977-07-18 | 1977-07-18 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5826525Y2 (enExample) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5316278Y2 (enExample) * | 1972-08-25 | 1978-04-28 | ||
| JPS50156874A (enExample) * | 1974-06-06 | 1975-12-18 | ||
| JPS5150661A (enExample) * | 1974-10-30 | 1976-05-04 | Hitachi Ltd |
-
1977
- 1977-07-18 JP JP1977096121U patent/JPS5826525Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5423563U (enExample) | 1979-02-16 |
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