JPS5825479A - エッチング加工用装置 - Google Patents

エッチング加工用装置

Info

Publication number
JPS5825479A
JPS5825479A JP13507982A JP13507982A JPS5825479A JP S5825479 A JPS5825479 A JP S5825479A JP 13507982 A JP13507982 A JP 13507982A JP 13507982 A JP13507982 A JP 13507982A JP S5825479 A JPS5825479 A JP S5825479A
Authority
JP
Japan
Prior art keywords
etching
soln
holes
plate
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13507982A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6245313B2 (enrdf_load_stackoverflow
Inventor
Hiroshige Sawa
沢　広成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SAWA HYOMEN GIKEN KK
Original Assignee
SAWA HYOMEN GIKEN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SAWA HYOMEN GIKEN KK filed Critical SAWA HYOMEN GIKEN KK
Priority to JP13507982A priority Critical patent/JPS5825479A/ja
Publication of JPS5825479A publication Critical patent/JPS5825479A/ja
Publication of JPS6245313B2 publication Critical patent/JPS6245313B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits

Landscapes

  • ing And Chemical Polishing (AREA)
JP13507982A 1982-08-04 1982-08-04 エッチング加工用装置 Granted JPS5825479A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13507982A JPS5825479A (ja) 1982-08-04 1982-08-04 エッチング加工用装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13507982A JPS5825479A (ja) 1982-08-04 1982-08-04 エッチング加工用装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP3887980A Division JPS58759B2 (ja) 1980-03-28 1980-03-28 鍍金加工用装置

Publications (2)

Publication Number Publication Date
JPS5825479A true JPS5825479A (ja) 1983-02-15
JPS6245313B2 JPS6245313B2 (enrdf_load_stackoverflow) 1987-09-25

Family

ID=15143342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13507982A Granted JPS5825479A (ja) 1982-08-04 1982-08-04 エッチング加工用装置

Country Status (1)

Country Link
JP (1) JPS5825479A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7789969B2 (en) 2006-11-01 2010-09-07 Applied Materials, Inc. Methods and apparatus for cleaning chamber components
WO2017076640A1 (de) * 2015-11-04 2017-05-11 Gebr. Schmid Gmbh Behandlungsfluid-absaugvorrichtung und diese enthaltende ätzvorrichtung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7789969B2 (en) 2006-11-01 2010-09-07 Applied Materials, Inc. Methods and apparatus for cleaning chamber components
WO2017076640A1 (de) * 2015-11-04 2017-05-11 Gebr. Schmid Gmbh Behandlungsfluid-absaugvorrichtung und diese enthaltende ätzvorrichtung

Also Published As

Publication number Publication date
JPS6245313B2 (enrdf_load_stackoverflow) 1987-09-25

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