JPS6245313B2 - - Google Patents
Info
- Publication number
- JPS6245313B2 JPS6245313B2 JP13507982A JP13507982A JPS6245313B2 JP S6245313 B2 JPS6245313 B2 JP S6245313B2 JP 13507982 A JP13507982 A JP 13507982A JP 13507982 A JP13507982 A JP 13507982A JP S6245313 B2 JPS6245313 B2 JP S6245313B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- wiring board
- printed wiring
- processed
- corrosive liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Landscapes
- ing And Chemical Polishing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13507982A JPS5825479A (ja) | 1982-08-04 | 1982-08-04 | エッチング加工用装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13507982A JPS5825479A (ja) | 1982-08-04 | 1982-08-04 | エッチング加工用装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3887980A Division JPS58759B2 (ja) | 1980-03-28 | 1980-03-28 | 鍍金加工用装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5825479A JPS5825479A (ja) | 1983-02-15 |
JPS6245313B2 true JPS6245313B2 (enrdf_load_stackoverflow) | 1987-09-25 |
Family
ID=15143342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13507982A Granted JPS5825479A (ja) | 1982-08-04 | 1982-08-04 | エッチング加工用装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5825479A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101432161B1 (ko) | 2006-11-01 | 2014-08-20 | 퀀텀 글로벌 테크놀로지스, 엘엘씨 | 챔버 부품을 세정하기 위한 방법 및 장치 |
DE102015221646A1 (de) * | 2015-11-04 | 2017-05-04 | Gebr. Schmid Gmbh | Behandlungsfluid-Absaugvorrichtung und diese enthaltende Ätzvorrichtung |
-
1982
- 1982-08-04 JP JP13507982A patent/JPS5825479A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5825479A (ja) | 1983-02-15 |
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