JPS5824445Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS5824445Y2 JPS5824445Y2 JP1977145103U JP14510377U JPS5824445Y2 JP S5824445 Y2 JPS5824445 Y2 JP S5824445Y2 JP 1977145103 U JP1977145103 U JP 1977145103U JP 14510377 U JP14510377 U JP 14510377U JP S5824445 Y2 JPS5824445 Y2 JP S5824445Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- stem
- cap
- electrode lead
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977145103U JPS5824445Y2 (ja) | 1977-10-31 | 1977-10-31 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977145103U JPS5824445Y2 (ja) | 1977-10-31 | 1977-10-31 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5471967U JPS5471967U (enExample) | 1979-05-22 |
| JPS5824445Y2 true JPS5824445Y2 (ja) | 1983-05-25 |
Family
ID=29124344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977145103U Expired JPS5824445Y2 (ja) | 1977-10-31 | 1977-10-31 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5824445Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6913421B2 (ja) * | 2015-10-16 | 2021-08-04 | HOYA Technosurgical株式会社 | インプラント |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5420667U (enExample) * | 1977-07-14 | 1979-02-09 |
-
1977
- 1977-10-31 JP JP1977145103U patent/JPS5824445Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5471967U (enExample) | 1979-05-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3577633A (en) | Method of making a semiconductor device | |
| JPS5824445Y2 (ja) | 半導体装置 | |
| US3449640A (en) | Simplified stacked semiconductor device | |
| US3009012A (en) | Header construction | |
| JPH04230001A (ja) | 改良ハウジングアセンブリー | |
| JPS5856357A (ja) | 半導体装置用パツケ−ジ | |
| JPS6322678Y2 (enExample) | ||
| JPH06169109A (ja) | 熱電素子 | |
| JPS5821216Y2 (ja) | 小型圧電振動子の支持構造 | |
| JPH0635382Y2 (ja) | 混成集積回路のリード端子取付構造 | |
| JPH0328511Y2 (enExample) | ||
| JPS63208250A (ja) | 集積回路のパツケ−ジ構造 | |
| JPH06132766A (ja) | 圧電発振子 | |
| JP3671771B2 (ja) | 平型半導体装置のパッケージ | |
| JPH039324Y2 (enExample) | ||
| JPS63299101A (ja) | 高温センサ用リ−ド端子 | |
| US2096156A (en) | Electric discharge tube | |
| JPS5915080Y2 (ja) | 半導体装置 | |
| JPH0638432Y2 (ja) | 半導体気密封止パッケージ | |
| JPH0414939Y2 (enExample) | ||
| JPS5852685Y2 (ja) | 電子部品の金属製外囲器 | |
| JPH01235304A (ja) | ガラス封入形サーミスタの製造法 | |
| JPH0122260Y2 (enExample) | ||
| JPH0328518Y2 (enExample) | ||
| JPH0556605B2 (enExample) |