JPS5822739U - 半導体集積回路の整列取付装置 - Google Patents

半導体集積回路の整列取付装置

Info

Publication number
JPS5822739U
JPS5822739U JP1981116867U JP11686781U JPS5822739U JP S5822739 U JPS5822739 U JP S5822739U JP 1981116867 U JP1981116867 U JP 1981116867U JP 11686781 U JP11686781 U JP 11686781U JP S5822739 U JPS5822739 U JP S5822739U
Authority
JP
Japan
Prior art keywords
semiconductor integrated
integrated circuit
mounting equipment
circuit alignment
integrated circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981116867U
Other languages
English (en)
Japanese (ja)
Other versions
JPS645890Y2 (enExample
Inventor
平沢　克彦
Original Assignee
セイコー京葉工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコー京葉工業株式会社 filed Critical セイコー京葉工業株式会社
Priority to JP1981116867U priority Critical patent/JPS5822739U/ja
Publication of JPS5822739U publication Critical patent/JPS5822739U/ja
Application granted granted Critical
Publication of JPS645890Y2 publication Critical patent/JPS645890Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1981116867U 1981-08-06 1981-08-06 半導体集積回路の整列取付装置 Granted JPS5822739U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981116867U JPS5822739U (ja) 1981-08-06 1981-08-06 半導体集積回路の整列取付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981116867U JPS5822739U (ja) 1981-08-06 1981-08-06 半導体集積回路の整列取付装置

Publications (2)

Publication Number Publication Date
JPS5822739U true JPS5822739U (ja) 1983-02-12
JPS645890Y2 JPS645890Y2 (enExample) 1989-02-14

Family

ID=29911073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981116867U Granted JPS5822739U (ja) 1981-08-06 1981-08-06 半導体集積回路の整列取付装置

Country Status (1)

Country Link
JP (1) JPS5822739U (enExample)

Also Published As

Publication number Publication date
JPS645890Y2 (enExample) 1989-02-14

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