JPS5963436U - 集積回路装置 - Google Patents

集積回路装置

Info

Publication number
JPS5963436U
JPS5963436U JP1982157933U JP15793382U JPS5963436U JP S5963436 U JPS5963436 U JP S5963436U JP 1982157933 U JP1982157933 U JP 1982157933U JP 15793382 U JP15793382 U JP 15793382U JP S5963436 U JPS5963436 U JP S5963436U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
chip
opening
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982157933U
Other languages
English (en)
Inventor
横山　冨士雄
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1982157933U priority Critical patent/JPS5963436U/ja
Publication of JPS5963436U publication Critical patent/JPS5963436U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の一実施例を示す平面図、第２図は従来の
実施例を示す断面図、第３図は本考案の一実施例を示す
平面図、第４図は本考案の一実施例を示す断面図、第５
図は大型化集積回路チップの斜視図、第６図はダンパー
斜視図、第７図はシリコンゴムリング斜視図である。 なお図に於て、１・・・集積回路容器、２・・・集積回
路チップ、３・・・接続リード線、４・・・ロー材、５
・・・ダンパー、６・・・パターン、７・・・ネジ、８
・・・ネジ止め用開孔、９・・・シリコンゴムリング、
である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を内蔵する大型化したシリコン等の集積回路
    チップに於て、該集積回路チップの周囲に開孔を設け、
    ネジ穴を設けた集積回路容器に低融点合金または弾性を
    有するシート等を介して該チップ開孔と該集積回路容器
    のネジ穴とをネジで位置決め固定したこととを特徴とす
    る集積回路装置。
JP1982157933U 1982-10-19 1982-10-19 集積回路装置 Pending JPS5963436U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982157933U JPS5963436U (ja) 1982-10-19 1982-10-19 集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982157933U JPS5963436U (ja) 1982-10-19 1982-10-19 集積回路装置

Publications (1)

Publication Number Publication Date
JPS5963436U true JPS5963436U (ja) 1984-04-26

Family

ID=30348057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982157933U Pending JPS5963436U (ja) 1982-10-19 1982-10-19 集積回路装置

Country Status (1)

Country Link
JP (1) JPS5963436U (ja)

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