JPS5822739U - 半導体集積回路の整列取付装置 - Google Patents
半導体集積回路の整列取付装置Info
- Publication number
- JPS5822739U JPS5822739U JP1981116867U JP11686781U JPS5822739U JP S5822739 U JPS5822739 U JP S5822739U JP 1981116867 U JP1981116867 U JP 1981116867U JP 11686781 U JP11686781 U JP 11686781U JP S5822739 U JPS5822739 U JP S5822739U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor integrated
- integrated circuit
- mounting equipment
- circuit alignment
- integrated circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 239000004744 fabric Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981116867U JPS5822739U (ja) | 1981-08-06 | 1981-08-06 | 半導体集積回路の整列取付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981116867U JPS5822739U (ja) | 1981-08-06 | 1981-08-06 | 半導体集積回路の整列取付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5822739U true JPS5822739U (ja) | 1983-02-12 |
JPS645890Y2 JPS645890Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-02-14 |
Family
ID=29911073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981116867U Granted JPS5822739U (ja) | 1981-08-06 | 1981-08-06 | 半導体集積回路の整列取付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5822739U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1981
- 1981-08-06 JP JP1981116867U patent/JPS5822739U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS645890Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-02-14 |
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