JPS645890Y2 - - Google Patents

Info

Publication number
JPS645890Y2
JPS645890Y2 JP1981116867U JP11686781U JPS645890Y2 JP S645890 Y2 JPS645890 Y2 JP S645890Y2 JP 1981116867 U JP1981116867 U JP 1981116867U JP 11686781 U JP11686781 U JP 11686781U JP S645890 Y2 JPS645890 Y2 JP S645890Y2
Authority
JP
Japan
Prior art keywords
semiconductor integrated
bonding
wax
wafer
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981116867U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5822739U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981116867U priority Critical patent/JPS5822739U/ja
Publication of JPS5822739U publication Critical patent/JPS5822739U/ja
Application granted granted Critical
Publication of JPS645890Y2 publication Critical patent/JPS645890Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1981116867U 1981-08-06 1981-08-06 半導体集積回路の整列取付装置 Granted JPS5822739U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981116867U JPS5822739U (ja) 1981-08-06 1981-08-06 半導体集積回路の整列取付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981116867U JPS5822739U (ja) 1981-08-06 1981-08-06 半導体集積回路の整列取付装置

Publications (2)

Publication Number Publication Date
JPS5822739U JPS5822739U (ja) 1983-02-12
JPS645890Y2 true JPS645890Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-02-14

Family

ID=29911073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981116867U Granted JPS5822739U (ja) 1981-08-06 1981-08-06 半導体集積回路の整列取付装置

Country Status (1)

Country Link
JP (1) JPS5822739U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPS5822739U (ja) 1983-02-12

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