JPS5822738U - 回路基板 - Google Patents

回路基板

Info

Publication number
JPS5822738U
JPS5822738U JP11686581U JP11686581U JPS5822738U JP S5822738 U JPS5822738 U JP S5822738U JP 11686581 U JP11686581 U JP 11686581U JP 11686581 U JP11686581 U JP 11686581U JP S5822738 U JPS5822738 U JP S5822738U
Authority
JP
Japan
Prior art keywords
circuit board
pattern
recorded
electronic filing
before electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11686581U
Other languages
English (en)
Inventor
斉藤　四郎
Original Assignee
セイコ−京葉工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコ−京葉工業株式会社 filed Critical セイコ−京葉工業株式会社
Priority to JP11686581U priority Critical patent/JPS5822738U/ja
Publication of JPS5822738U publication Critical patent/JPS5822738U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の回路基板の半導体素子搭載の平面図、第
２図は従来の回路基板のパターンの断面図、第３図は本
考案の一実施例に係る回路基板のパターンの断面図であ
る。 １・・・・・・基材、２・・・・・・半導体素子、３・
・・・・・半導体素子のパッド、４・・・・・・パター
ン、４１・・・・・・第二ボンディング会エリア、５・
・・・・・ワイヤー、７１゜８１・・・・・−Ｃｕ箔、
７２．８２・・・・・・Ｎｉメッキ層、７３．８３・・
・・・・Ａｕメッキ層。

Claims (1)

    【実用新案登録請求の範囲】
  1. パターンの金属がＣｕ、　ＮｉそしてＡｕで構成された
    回路基板において、前記パターン上金属のＨｉが２〜５
    μの厚みであることを特徴とする回路基板。
JP11686581U 1981-08-06 1981-08-06 回路基板 Pending JPS5822738U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11686581U JPS5822738U (ja) 1981-08-06 1981-08-06 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11686581U JPS5822738U (ja) 1981-08-06 1981-08-06 回路基板

Publications (1)

Publication Number Publication Date
JPS5822738U true JPS5822738U (ja) 1983-02-12

Family

ID=29911071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11686581U Pending JPS5822738U (ja) 1981-08-06 1981-08-06 回路基板

Country Status (1)

Country Link
JP (1) JPS5822738U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166227U (ja) * 1987-04-16 1988-10-28
JPH0648658U (ja) * 1991-02-14 1994-07-05 京都機械工具株式会社 入浴補助装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54162464A (en) * 1978-06-13 1979-12-24 Sanyo Electric Co Ltd Wire bonding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54162464A (en) * 1978-06-13 1979-12-24 Sanyo Electric Co Ltd Wire bonding method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166227U (ja) * 1987-04-16 1988-10-28
JPH0648658U (ja) * 1991-02-14 1994-07-05 京都機械工具株式会社 入浴補助装置

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