JPS5821417A - 硬化性エポキシ樹脂組成物 - Google Patents

硬化性エポキシ樹脂組成物

Info

Publication number
JPS5821417A
JPS5821417A JP11867081A JP11867081A JPS5821417A JP S5821417 A JPS5821417 A JP S5821417A JP 11867081 A JP11867081 A JP 11867081A JP 11867081 A JP11867081 A JP 11867081A JP S5821417 A JPS5821417 A JP S5821417A
Authority
JP
Japan
Prior art keywords
epoxy resin
block copolymer
curable epoxy
resin composition
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11867081A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6148544B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Kunio Ito
邦雄 伊藤
Akitoshi Komiya
小宮　章年
Toshio Shiobara
利夫 塩原
Kazutoshi Tomiyoshi
富吉　和俊
Yoshio Fujimura
藤村　嘉夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP11867081A priority Critical patent/JPS5821417A/ja
Publication of JPS5821417A publication Critical patent/JPS5821417A/ja
Publication of JPS6148544B2 publication Critical patent/JPS6148544B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP11867081A 1981-07-29 1981-07-29 硬化性エポキシ樹脂組成物 Granted JPS5821417A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11867081A JPS5821417A (ja) 1981-07-29 1981-07-29 硬化性エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11867081A JPS5821417A (ja) 1981-07-29 1981-07-29 硬化性エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS5821417A true JPS5821417A (ja) 1983-02-08
JPS6148544B2 JPS6148544B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-10-24

Family

ID=14742301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11867081A Granted JPS5821417A (ja) 1981-07-29 1981-07-29 硬化性エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS5821417A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918724A (ja) * 1982-07-23 1984-01-31 Nitto Electric Ind Co Ltd 熱硬化性樹脂組成物
JPS5996122A (ja) * 1982-11-22 1984-06-02 Toray Silicone Co Ltd 熱硬化性エポキシ樹脂組成物
JPS59129252A (ja) * 1983-01-14 1984-07-25 Matsushita Electric Works Ltd エポキシ樹脂成形材料
JPS59172541A (ja) * 1983-03-23 1984-09-29 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPS6063951A (ja) * 1983-09-16 1985-04-12 Hitachi Ltd 半導体装置
JPS6069130A (ja) * 1983-09-27 1985-04-19 Toshiba Corp 樹脂封止型半導体装置
JPS61271319A (ja) * 1985-05-24 1986-12-01 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
EP0218228A2 (en) 1985-10-07 1987-04-15 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition
JPS6284147A (ja) * 1985-10-07 1987-04-17 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPS62116654A (ja) * 1985-10-07 1987-05-28 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPS6320325A (ja) * 1986-07-14 1988-01-28 Toshiba Corp 樹脂封止型半導体装置
JPS6322853A (ja) * 1987-02-13 1988-01-30 Hitachi Ltd シリコ−ンフエノ−ル系化合物の組成物、及びその用途
JPS63114243A (ja) * 1986-10-31 1988-05-19 Nitto Electric Ind Co Ltd 半導体装置
US4876298A (en) * 1987-06-03 1989-10-24 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition
JPH01315424A (ja) * 1988-06-15 1989-12-20 Shin Etsu Chem Co Ltd フッ素含有シリコーン変性ノボラック樹脂の製造法
JPH02279758A (ja) * 1989-04-19 1990-11-15 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及びその硬化物
US5006614A (en) * 1988-07-05 1991-04-09 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer
JPH03115321A (ja) * 1990-03-27 1991-05-16 Matsushita Electric Works Ltd エポキシ樹脂成形材料の製造方法
JPH03245558A (ja) * 1990-09-17 1991-11-01 Hitachi Ltd 半導体装置
US5173544A (en) * 1989-05-17 1992-12-22 Shin-Etsu Chemical Co., Ltd. Epoxy resin compositions
JP2003055439A (ja) * 2001-08-16 2003-02-26 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及びこれを用いた半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6260475B2 (ja) * 2013-08-20 2018-01-17 信越化学工業株式会社 オルガノシロキサン変性ノボラック樹脂及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1074179A (en) * 1964-12-09 1967-06-28 Goldschmidt Ag Th Curable epoxy resins
JPS50129699A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1974-03-25 1975-10-14

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1074179A (en) * 1964-12-09 1967-06-28 Goldschmidt Ag Th Curable epoxy resins
JPS50129699A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1974-03-25 1975-10-14

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918724A (ja) * 1982-07-23 1984-01-31 Nitto Electric Ind Co Ltd 熱硬化性樹脂組成物
JPS5996122A (ja) * 1982-11-22 1984-06-02 Toray Silicone Co Ltd 熱硬化性エポキシ樹脂組成物
JPS59129252A (ja) * 1983-01-14 1984-07-25 Matsushita Electric Works Ltd エポキシ樹脂成形材料
JPS59172541A (ja) * 1983-03-23 1984-09-29 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPS6063951A (ja) * 1983-09-16 1985-04-12 Hitachi Ltd 半導体装置
JPS6069130A (ja) * 1983-09-27 1985-04-19 Toshiba Corp 樹脂封止型半導体装置
JPS61271319A (ja) * 1985-05-24 1986-12-01 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
EP0218228A2 (en) 1985-10-07 1987-04-15 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition
JPS6284147A (ja) * 1985-10-07 1987-04-17 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPS62116654A (ja) * 1985-10-07 1987-05-28 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
EP0218228B1 (en) * 1985-10-07 1993-09-15 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition
US4877822A (en) * 1985-10-07 1989-10-31 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition
US5053445A (en) * 1985-10-07 1991-10-01 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition
JPS6320325A (ja) * 1986-07-14 1988-01-28 Toshiba Corp 樹脂封止型半導体装置
JPS63114243A (ja) * 1986-10-31 1988-05-19 Nitto Electric Ind Co Ltd 半導体装置
JPS6322853A (ja) * 1987-02-13 1988-01-30 Hitachi Ltd シリコ−ンフエノ−ル系化合物の組成物、及びその用途
US4876298A (en) * 1987-06-03 1989-10-24 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition
JPH01315424A (ja) * 1988-06-15 1989-12-20 Shin Etsu Chem Co Ltd フッ素含有シリコーン変性ノボラック樹脂の製造法
US5006614A (en) * 1988-07-05 1991-04-09 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer
JPH02279758A (ja) * 1989-04-19 1990-11-15 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及びその硬化物
US5173544A (en) * 1989-05-17 1992-12-22 Shin-Etsu Chemical Co., Ltd. Epoxy resin compositions
JPH03115321A (ja) * 1990-03-27 1991-05-16 Matsushita Electric Works Ltd エポキシ樹脂成形材料の製造方法
JPH03245558A (ja) * 1990-09-17 1991-11-01 Hitachi Ltd 半導体装置
JP2003055439A (ja) * 2001-08-16 2003-02-26 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及びこれを用いた半導体装置

Also Published As

Publication number Publication date
JPS6148544B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-10-24

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