JPS5821345A - 電子部品の樹脂封止方法 - Google Patents
電子部品の樹脂封止方法Info
- Publication number
- JPS5821345A JPS5821345A JP11989981A JP11989981A JPS5821345A JP S5821345 A JPS5821345 A JP S5821345A JP 11989981 A JP11989981 A JP 11989981A JP 11989981 A JP11989981 A JP 11989981A JP S5821345 A JPS5821345 A JP S5821345A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- sealing
- cavity
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/25—Solid
- B29K2105/251—Particles, powder or granules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11989981A JPS5821345A (ja) | 1981-07-29 | 1981-07-29 | 電子部品の樹脂封止方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11989981A JPS5821345A (ja) | 1981-07-29 | 1981-07-29 | 電子部品の樹脂封止方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5821345A true JPS5821345A (ja) | 1983-02-08 |
JPS6354218B2 JPS6354218B2 (fr) | 1988-10-27 |
Family
ID=14772972
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11989981A Granted JPS5821345A (ja) | 1981-07-29 | 1981-07-29 | 電子部品の樹脂封止方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5821345A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008221953A (ja) * | 2007-03-09 | 2008-09-25 | Asaba Seisakusho:Kk | 車両用座席のシートクッション |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4517377Y1 (fr) * | 1966-05-30 | 1970-07-17 | ||
JPS5132208U (fr) * | 1974-08-31 | 1976-03-09 | ||
JPS5330228A (en) * | 1976-09-02 | 1978-03-22 | Canon Inc | Recording unit |
JPS5546678U (fr) * | 1978-09-21 | 1980-03-27 | ||
JPS5611236A (en) * | 1979-07-10 | 1981-02-04 | Towa Seimitsu Kogyo Kk | Method and metallic mold for plastic molding |
JPS5630841A (en) * | 1979-08-24 | 1981-03-28 | Towa Seimitsu Kogyo Kk | Plastic molding method and metallic mold therefor |
-
1981
- 1981-07-29 JP JP11989981A patent/JPS5821345A/ja active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4517377Y1 (fr) * | 1966-05-30 | 1970-07-17 | ||
JPS5132208U (fr) * | 1974-08-31 | 1976-03-09 | ||
JPS5330228A (en) * | 1976-09-02 | 1978-03-22 | Canon Inc | Recording unit |
JPS5546678U (fr) * | 1978-09-21 | 1980-03-27 | ||
JPS5611236A (en) * | 1979-07-10 | 1981-02-04 | Towa Seimitsu Kogyo Kk | Method and metallic mold for plastic molding |
JPS5630841A (en) * | 1979-08-24 | 1981-03-28 | Towa Seimitsu Kogyo Kk | Plastic molding method and metallic mold therefor |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008221953A (ja) * | 2007-03-09 | 2008-09-25 | Asaba Seisakusho:Kk | 車両用座席のシートクッション |
Also Published As
Publication number | Publication date |
---|---|
JPS6354218B2 (fr) | 1988-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4480975A (en) | Apparatus for encapsulating electronic components | |
US4915607A (en) | Lead frame assembly for an integrated circuit molding system | |
US6068809A (en) | Method of injection molding elements such as semiconductor elements | |
US5783134A (en) | Method of resin-sealing semiconductor device | |
JPS62122136A (ja) | レジンモールド半導体の製造方法および装置 | |
US4812114A (en) | New IC molding process | |
JPH10199907A (ja) | 樹脂封止方法および樹脂封止金型装置 | |
TW202103886A (zh) | 工件搬入裝置、工件搬出裝置、塑封模具以及包括所述裝置及模具的樹脂塑封裝置 | |
GB2104827A (en) | Molding of electronic components | |
JPS5821345A (ja) | 電子部品の樹脂封止方法 | |
JP2004235530A (ja) | 封止成形装置及びそれを用いた封止成形体の製造方法 | |
JP2567603B2 (ja) | 連続自動樹脂封止方法 | |
JPS6146051B2 (fr) | ||
JPH0257006B2 (fr) | ||
EP1259981B1 (fr) | Dispositif et procede d'encapsulation de composants electroniques montes sur un support | |
JPS6151969B2 (fr) | ||
JPS6146050B2 (fr) | ||
JPS59172241A (ja) | 半導体樹脂封止装置 | |
JP2518661B2 (ja) | 半導体素子の樹脂封止成形方法及び装置 | |
JPH08279525A (ja) | 半導体モールド装置 | |
JP3543742B2 (ja) | 樹脂封止成形装置 | |
JPH0716879A (ja) | 電子部品モールド金型 | |
JPH1140592A (ja) | 封止成形方法およびその装置 | |
JPH0671685A (ja) | 樹脂成形装置 | |
JPH07106361A (ja) | 樹脂パッケージング方法及びその装置 |