JPS58207048A - マスクの製造方法 - Google Patents
マスクの製造方法Info
- Publication number
- JPS58207048A JPS58207048A JP57090286A JP9028682A JPS58207048A JP S58207048 A JPS58207048 A JP S58207048A JP 57090286 A JP57090286 A JP 57090286A JP 9028682 A JP9028682 A JP 9028682A JP S58207048 A JPS58207048 A JP S58207048A
- Authority
- JP
- Japan
- Prior art keywords
- film
- mask
- frame
- quartz
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000010453 quartz Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 229920003002 synthetic resin Polymers 0.000 claims description 8
- 239000000057 synthetic resin Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57090286A JPS58207048A (ja) | 1982-05-27 | 1982-05-27 | マスクの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57090286A JPS58207048A (ja) | 1982-05-27 | 1982-05-27 | マスクの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58207048A true JPS58207048A (ja) | 1983-12-02 |
JPH0322686B2 JPH0322686B2 (enrdf_load_stackoverflow) | 1991-03-27 |
Family
ID=13994275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57090286A Granted JPS58207048A (ja) | 1982-05-27 | 1982-05-27 | マスクの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58207048A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100674991B1 (ko) * | 2005-09-02 | 2007-01-29 | 삼성전자주식회사 | 토폴로지를 갖는 보상층을 구비한 바이너리 포토 마스크 및그 제조방법 |
US7745072B2 (en) | 2006-06-06 | 2010-06-29 | Samsung Electronics Co., Ltd. | Method of correcting critical dimension in photomask and photomask having corrected critical dimension using the method |
-
1982
- 1982-05-27 JP JP57090286A patent/JPS58207048A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100674991B1 (ko) * | 2005-09-02 | 2007-01-29 | 삼성전자주식회사 | 토폴로지를 갖는 보상층을 구비한 바이너리 포토 마스크 및그 제조방법 |
US7745068B2 (en) | 2005-09-02 | 2010-06-29 | Samsung Electronics Co., Ltd. | Binary photomask having a compensation layer |
US7745072B2 (en) | 2006-06-06 | 2010-06-29 | Samsung Electronics Co., Ltd. | Method of correcting critical dimension in photomask and photomask having corrected critical dimension using the method |
Also Published As
Publication number | Publication date |
---|---|
JPH0322686B2 (enrdf_load_stackoverflow) | 1991-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4873163A (en) | Photomask material | |
JPS6345092B2 (enrdf_load_stackoverflow) | ||
JPH0562404A (ja) | 磁気ヘツド用スライダーの製造方法 | |
JPS5851412B2 (ja) | 半導体装置の微細加工方法 | |
JPS63173053A (ja) | 多層構造体とその製造方法 | |
JPS58207048A (ja) | マスクの製造方法 | |
JPS6240458A (ja) | 薄膜パタ−ンの露光方法 | |
JPS5990852A (ja) | フオトマスクブランク | |
JPS62119924A (ja) | 透過マスクの作製方法 | |
JPS641926B2 (enrdf_load_stackoverflow) | ||
JPS58215024A (ja) | X線マスクの製造方法 | |
JPS613489A (ja) | 半導体装置の製造方法 | |
JPS63214754A (ja) | フオトマスク | |
JPH04324613A (ja) | ウエハの貼り合わせ方法 | |
JPS60231331A (ja) | リフトオフ・パタ−ンの形成方法 | |
JPS62144328A (ja) | X線マスク及びその製造方法 | |
JPH0653922B2 (ja) | 金属膜のパタ−ン化方法 | |
JPS63202748A (ja) | フオトマスク材料 | |
JPS5931027A (ja) | X線マスクの製造方法 | |
JPS5934632A (ja) | X線マスクの製造方法 | |
JPH02251851A (ja) | フォトマスク | |
JPS5929420A (ja) | X線マスクの製造方法 | |
JPS61245161A (ja) | X線用マスクの製造方法 | |
JPH05265189A (ja) | フォトマスク及びその製造方法 | |
JPS582027A (ja) | X線露光用マスク |