JPS58204559A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58204559A
JPS58204559A JP57086684A JP8668482A JPS58204559A JP S58204559 A JPS58204559 A JP S58204559A JP 57086684 A JP57086684 A JP 57086684A JP 8668482 A JP8668482 A JP 8668482A JP S58204559 A JPS58204559 A JP S58204559A
Authority
JP
Japan
Prior art keywords
base
electrode plate
plate
metal stud
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57086684A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6249739B2 (enExample
Inventor
Shigeyasu Takazuchi
高槌　重靖
Toshiki Kurosu
黒須　俊樹
Masatami Miura
三浦　雅民
Noritoshi Kotsuji
小辻　宣俊
Isao Kotori
小鳥　勲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Minebea Power Semiconductor Device Inc
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Priority to JP57086684A priority Critical patent/JPS58204559A/ja
Publication of JPS58204559A publication Critical patent/JPS58204559A/ja
Publication of JPS6249739B2 publication Critical patent/JPS6249739B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP57086684A 1982-05-24 1982-05-24 半導体装置 Granted JPS58204559A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57086684A JPS58204559A (ja) 1982-05-24 1982-05-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57086684A JPS58204559A (ja) 1982-05-24 1982-05-24 半導体装置

Publications (2)

Publication Number Publication Date
JPS58204559A true JPS58204559A (ja) 1983-11-29
JPS6249739B2 JPS6249739B2 (enExample) 1987-10-21

Family

ID=13893826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57086684A Granted JPS58204559A (ja) 1982-05-24 1982-05-24 半導体装置

Country Status (1)

Country Link
JP (1) JPS58204559A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5150197A (en) * 1989-10-05 1992-09-22 Digital Equipment Corporation Die attach structure and method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6421343U (enExample) * 1987-07-29 1989-02-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5150197A (en) * 1989-10-05 1992-09-22 Digital Equipment Corporation Die attach structure and method

Also Published As

Publication number Publication date
JPS6249739B2 (enExample) 1987-10-21

Similar Documents

Publication Publication Date Title
US5021865A (en) Lead frame for semiconductor device
JP4023032B2 (ja) 半導体装置の実装構造及び実装方法
JPH11265976A (ja) パワー半導体モジュールおよびその製造方法
JPH05121615A (ja) 半導体装置
JPS58204559A (ja) 半導体装置
JP2004111745A (ja) 半導体装置
JP2019009280A (ja) 半導体装置
JP2006332479A (ja) 電力半導体装置
JPH07176664A (ja) 半導体装置およびその製造方法
JP3522975B2 (ja) 半導体装置
JP2016134547A (ja) 半導体装置
JPS63120431A (ja) 電力用半導体装置
JPH06685A (ja) 半田材
JPS615533A (ja) 加圧接触形半導体装置
US3512050A (en) High power semiconductor device
JPH0741164Y2 (ja) 半導体装置
JPS6332269B2 (enExample)
JPH05315491A (ja) 半導体電極とその製造方法及び半導体装置
JPH04283947A (ja) 半導体装置
JP2619155B2 (ja) 混成集積回路装置
JPS5846177B2 (ja) 半導体装置
JP4193423B2 (ja) 半導体装置
JP2006114716A (ja) 電力用半導体装置
JP2005159012A (ja) 半導体装置
JPS5929142B2 (ja) 半導体装置