JPS58202590A - プリント配線用基板の製造方法 - Google Patents
プリント配線用基板の製造方法Info
- Publication number
- JPS58202590A JPS58202590A JP8496682A JP8496682A JPS58202590A JP S58202590 A JPS58202590 A JP S58202590A JP 8496682 A JP8496682 A JP 8496682A JP 8496682 A JP8496682 A JP 8496682A JP S58202590 A JPS58202590 A JP S58202590A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- aluminum oxide
- solution
- treatment
- polyimide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 29
- 238000000034 method Methods 0.000 title claims description 14
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 52
- 238000011282 treatment Methods 0.000 claims description 48
- 239000000243 solution Substances 0.000 claims description 42
- 229920001721 polyimide Polymers 0.000 claims description 32
- 239000009719 polyimide resin Substances 0.000 claims description 31
- 238000007743 anodising Methods 0.000 claims description 30
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 28
- 229910052782 aluminium Inorganic materials 0.000 claims description 28
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 22
- 230000003647 oxidation Effects 0.000 claims description 19
- 238000007254 oxidation reaction Methods 0.000 claims description 19
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 230000002950 deficient Effects 0.000 claims description 13
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 8
- 239000007864 aqueous solution Substances 0.000 claims description 7
- NGPGDYLVALNKEG-UHFFFAOYSA-N azanium;azane;2,3,4-trihydroxy-4-oxobutanoate Chemical compound [NH4+].[NH4+].[O-]C(=O)C(O)C(O)C([O-])=O NGPGDYLVALNKEG-UHFFFAOYSA-N 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims description 4
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims 1
- WYXIGTJNYDDFFH-UHFFFAOYSA-Q triazanium;borate Chemical compound [NH4+].[NH4+].[NH4+].[O-]B([O-])[O-] WYXIGTJNYDDFFH-UHFFFAOYSA-Q 0.000 claims 1
- 239000010408 film Substances 0.000 description 64
- 239000007788 liquid Substances 0.000 description 19
- 230000007547 defect Effects 0.000 description 18
- 238000007654 immersion Methods 0.000 description 11
- 239000011148 porous material Substances 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 10
- 235000011007 phosphoric acid Nutrition 0.000 description 10
- AUTNMGCKBXKHNV-UHFFFAOYSA-P diazanium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [NH4+].[NH4+].O1B([O-])OB2OB([O-])OB1O2 AUTNMGCKBXKHNV-UHFFFAOYSA-P 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 241001655798 Taku Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8496682A JPS58202590A (ja) | 1982-05-21 | 1982-05-21 | プリント配線用基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8496682A JPS58202590A (ja) | 1982-05-21 | 1982-05-21 | プリント配線用基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58202590A true JPS58202590A (ja) | 1983-11-25 |
| JPH0128514B2 JPH0128514B2 (enrdf_load_stackoverflow) | 1989-06-02 |
Family
ID=13845359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8496682A Granted JPS58202590A (ja) | 1982-05-21 | 1982-05-21 | プリント配線用基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58202590A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61264784A (ja) * | 1985-05-20 | 1986-11-22 | 伊勢電子工業株式会社 | プリント配線基板の製造方法 |
| JPH0318088A (ja) * | 1989-04-24 | 1991-01-25 | Pechiney Rech | 絶縁金属基板及びその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5336670A (en) * | 1976-09-17 | 1978-04-05 | Oki Electric Ind Co Ltd | Method of producing printed circuit board using alumite film |
| JPS554954A (en) * | 1978-06-28 | 1980-01-14 | Oki Electric Ind Co Ltd | Method of manufacturing alumite printed circuit board |
-
1982
- 1982-05-21 JP JP8496682A patent/JPS58202590A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5336670A (en) * | 1976-09-17 | 1978-04-05 | Oki Electric Ind Co Ltd | Method of producing printed circuit board using alumite film |
| JPS554954A (en) * | 1978-06-28 | 1980-01-14 | Oki Electric Ind Co Ltd | Method of manufacturing alumite printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61264784A (ja) * | 1985-05-20 | 1986-11-22 | 伊勢電子工業株式会社 | プリント配線基板の製造方法 |
| JPH0318088A (ja) * | 1989-04-24 | 1991-01-25 | Pechiney Rech | 絶縁金属基板及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0128514B2 (enrdf_load_stackoverflow) | 1989-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2003124068A (ja) | コンデンサ用陽極箔、該陽極箔の製造方法及び該陽極箔を用いた固体電解コンデンサ | |
| DE69026131T2 (de) | Isolierte metallische Substrate und Verfahren zur Herstellung dieser Substrate | |
| JPS58202590A (ja) | プリント配線用基板の製造方法 | |
| US4003772A (en) | Method for preparing thin film integrated circuit | |
| JPS63195294A (ja) | アルミニウム合金への絶縁膜の形成方法 | |
| JPH114056A (ja) | 印刷抵抗プリント配線板及びその製作方法 | |
| JPS59142138A (ja) | 絶縁放熱シートの製造方法 | |
| JPS59123297A (ja) | プリント回路板のための基板の形成方法 | |
| JPH0487317A (ja) | コンデンサ | |
| JP2008153556A (ja) | 電気回路用放熱基板の製造方法 | |
| JPH0245356B2 (ja) | Aruminiumushinpurintohaisenyokibannoseizohoho | |
| JPS61154095A (ja) | 印刷配線基板の酸化膜の製法 | |
| JPS59121896A (ja) | アルミニウム芯プリント配線基板の製造方法 | |
| DE2221072A1 (de) | Duennfilm-Metallisierungsverfahren fuer Mikroschaltungen | |
| JPH09246106A (ja) | 固体コンデンサ及びその導電性機能高分子膜の形成方法 | |
| JP3669191B2 (ja) | 固体電解コンデンサの製造方法 | |
| KR20080067853A (ko) | 인쇄회로기판용 알루미늄절연피막의 제조방법 및 이에 의해제조된 알루미늄절연피막 | |
| JPS62126623A (ja) | 固体電解コンデンサの製造法 | |
| JPS5819157B2 (ja) | 混成集積回路基板の製造方法 | |
| SU1002413A1 (ru) | Способ анодировани алюмини и его сплавов | |
| JP2924252B2 (ja) | 固体電解コンデンサの製造方法 | |
| JPS62185307A (ja) | 固体電解コンデンサの製造法 | |
| JPS59124118A (ja) | 固体電解コンデンサの製造方法 | |
| JP2000216051A (ja) | 薄膜コンデンサ内蔵電子回路基板及びその製造方法 | |
| SU956631A1 (ru) | Электролит дл анодировани алюмини и его сплавов |