JPS58202556A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58202556A
JPS58202556A JP57084825A JP8482582A JPS58202556A JP S58202556 A JPS58202556 A JP S58202556A JP 57084825 A JP57084825 A JP 57084825A JP 8482582 A JP8482582 A JP 8482582A JP S58202556 A JPS58202556 A JP S58202556A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
metal alkoxide
semiconductor element
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57084825A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6322616B2 (enrdf_load_stackoverflow
Inventor
Akio Nishikawa
西川　昭夫
Yasuhide Sugawara
菅原　泰英
Norimasa Kamezawa
亀沢　範正
Junji Mukai
淳二 向井
Mikio Sato
幹夫 佐藤
Kunihiro Tsubosaki
邦宏 坪崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57084825A priority Critical patent/JPS58202556A/ja
Publication of JPS58202556A publication Critical patent/JPS58202556A/ja
Publication of JPS6322616B2 publication Critical patent/JPS6322616B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57084825A 1982-05-21 1982-05-21 半導体装置 Granted JPS58202556A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57084825A JPS58202556A (ja) 1982-05-21 1982-05-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57084825A JPS58202556A (ja) 1982-05-21 1982-05-21 半導体装置

Publications (2)

Publication Number Publication Date
JPS58202556A true JPS58202556A (ja) 1983-11-25
JPS6322616B2 JPS6322616B2 (enrdf_load_stackoverflow) 1988-05-12

Family

ID=13841528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57084825A Granted JPS58202556A (ja) 1982-05-21 1982-05-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS58202556A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61287155A (ja) * 1985-06-14 1986-12-17 Hitachi Ltd 半導体装置及び半導体装置の製造方法
JPS6325972A (ja) * 1986-07-18 1988-02-03 Toshiba Components Kk 半導体装置
JP2009182159A (ja) * 2008-01-31 2009-08-13 Hitachi Ltd 金属／樹脂接着構造体及び樹脂封止型半導体装置とその製造方法
US20120075810A1 (en) * 2009-06-11 2012-03-29 Sinfonia Technology Co., Ltd. Method of producing electronic module, and electronic module
US8629352B2 (en) 2009-07-29 2014-01-14 Hitachi Cable, Ltd. Enameled insulated wire and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52119863A (en) * 1976-04-02 1977-10-07 Hitachi Ltd Manufacture of semi-conductor device
JPS56160055A (en) * 1980-05-15 1981-12-09 Toshiba Corp Resin sealing type semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52119863A (en) * 1976-04-02 1977-10-07 Hitachi Ltd Manufacture of semi-conductor device
JPS56160055A (en) * 1980-05-15 1981-12-09 Toshiba Corp Resin sealing type semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61287155A (ja) * 1985-06-14 1986-12-17 Hitachi Ltd 半導体装置及び半導体装置の製造方法
JPS6325972A (ja) * 1986-07-18 1988-02-03 Toshiba Components Kk 半導体装置
JP2009182159A (ja) * 2008-01-31 2009-08-13 Hitachi Ltd 金属／樹脂接着構造体及び樹脂封止型半導体装置とその製造方法
US7964975B2 (en) 2008-01-31 2011-06-21 Hitachi, Ltd. Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them
US8313983B2 (en) 2008-01-31 2012-11-20 Hitachi, Ltd. Fabrication method for resin-encapsulated semiconductor device
US20120075810A1 (en) * 2009-06-11 2012-03-29 Sinfonia Technology Co., Ltd. Method of producing electronic module, and electronic module
US8629352B2 (en) 2009-07-29 2014-01-14 Hitachi Cable, Ltd. Enameled insulated wire and manufacturing method thereof

Also Published As

Publication number Publication date
JPS6322616B2 (enrdf_load_stackoverflow) 1988-05-12

Similar Documents

Publication Publication Date Title
JPS58202556A (ja) 半導体装置
JPS6218565B2 (enrdf_load_stackoverflow)
JP4201925B2 (ja) 樹脂封止型電子・電気部品及びその製造方法
JP2001288334A (ja) モールドコイル及びその製造方法
JPH09235357A (ja) 封止用液状エポキシ樹脂組成物及び半導体装置
JPH08301978A (ja) 半導体素子封止用エポキシ樹脂組成物と樹脂封止型半導体装置
JPS60147141A (ja) 樹脂封止型半導体装置
JPS59112637A (ja) 半導体装置の樹脂封止方法
JPS6369255A (ja) 半導体装置
JPS62111453A (ja) 半導体装置
JPS6357632A (ja) エポキシ樹脂組成物、半導体装置用封止剤及び積層板用材料
JPS6079032A (ja) 半導体封止用樹脂組成物
JPH05259315A (ja) 樹脂封止型半導体装置
JPS6080259A (ja) 半導体装置
JPH0721048B2 (ja) エポキシ樹脂組成物、及びその用途
JPS62150860A (ja) 半導体装置
JPS61182248A (ja) 樹脂封止型半導体装置
JPS62108556A (ja) 半導体装置
JPH0732149B2 (ja) 半導体装置
JPS62109346A (ja) 半導体装置
JPS6218055A (ja) 半導体装置
JPH0788419B2 (ja) エポキシ樹脂組成物
JPS61265847A (ja) 樹脂封止型半導体装置
JPS58167614A (ja) 半導体封止用樹脂組成物
JPS641049B2 (enrdf_load_stackoverflow)