JPS58197797A - 多層配線の形成方法 - Google Patents

多層配線の形成方法

Info

Publication number
JPS58197797A
JPS58197797A JP57080514A JP8051482A JPS58197797A JP S58197797 A JPS58197797 A JP S58197797A JP 57080514 A JP57080514 A JP 57080514A JP 8051482 A JP8051482 A JP 8051482A JP S58197797 A JPS58197797 A JP S58197797A
Authority
JP
Japan
Prior art keywords
wiring
wiring conductor
resin
adhesive tape
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57080514A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62600B2 (enExample
Inventor
修 市川
定政　哲雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP57080514A priority Critical patent/JPS58197797A/ja
Publication of JPS58197797A publication Critical patent/JPS58197797A/ja
Publication of JPS62600B2 publication Critical patent/JPS62600B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP57080514A 1982-05-13 1982-05-13 多層配線の形成方法 Granted JPS58197797A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57080514A JPS58197797A (ja) 1982-05-13 1982-05-13 多層配線の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57080514A JPS58197797A (ja) 1982-05-13 1982-05-13 多層配線の形成方法

Publications (2)

Publication Number Publication Date
JPS58197797A true JPS58197797A (ja) 1983-11-17
JPS62600B2 JPS62600B2 (enExample) 1987-01-08

Family

ID=13720420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57080514A Granted JPS58197797A (ja) 1982-05-13 1982-05-13 多層配線の形成方法

Country Status (1)

Country Link
JP (1) JPS58197797A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119288A (ja) * 1986-11-06 1988-05-23 株式会社村田製作所 回路基板
JP2014016469A (ja) * 2012-07-09 2014-01-30 Sony Corp 実装基板および光学装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119288A (ja) * 1986-11-06 1988-05-23 株式会社村田製作所 回路基板
JP2014016469A (ja) * 2012-07-09 2014-01-30 Sony Corp 実装基板および光学装置

Also Published As

Publication number Publication date
JPS62600B2 (enExample) 1987-01-08

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