JPS58196043A - ろうつきリ−ドピンの製造方法 - Google Patents

ろうつきリ−ドピンの製造方法

Info

Publication number
JPS58196043A
JPS58196043A JP7935582A JP7935582A JPS58196043A JP S58196043 A JPS58196043 A JP S58196043A JP 7935582 A JP7935582 A JP 7935582A JP 7935582 A JP7935582 A JP 7935582A JP S58196043 A JPS58196043 A JP S58196043A
Authority
JP
Japan
Prior art keywords
lead
brazing
bin
manufacturing
filler metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7935582A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0141035B2 (enrdf_load_stackoverflow
Inventor
Kozo Kashiwagi
孝三 柏木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP7935582A priority Critical patent/JPS58196043A/ja
Publication of JPS58196043A publication Critical patent/JPS58196043A/ja
Publication of JPH0141035B2 publication Critical patent/JPH0141035B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814Conductive parts
    • H01L21/4885Wire-like parts or pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7935582A 1982-05-12 1982-05-12 ろうつきリ−ドピンの製造方法 Granted JPS58196043A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7935582A JPS58196043A (ja) 1982-05-12 1982-05-12 ろうつきリ−ドピンの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7935582A JPS58196043A (ja) 1982-05-12 1982-05-12 ろうつきリ−ドピンの製造方法

Publications (2)

Publication Number Publication Date
JPS58196043A true JPS58196043A (ja) 1983-11-15
JPH0141035B2 JPH0141035B2 (enrdf_load_stackoverflow) 1989-09-01

Family

ID=13687588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7935582A Granted JPS58196043A (ja) 1982-05-12 1982-05-12 ろうつきリ−ドピンの製造方法

Country Status (1)

Country Link
JP (1) JPS58196043A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02177554A (ja) * 1988-12-28 1990-07-10 Tokuriki Honten Co Ltd ろう材付リードピンの製造方法およびその製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02177554A (ja) * 1988-12-28 1990-07-10 Tokuriki Honten Co Ltd ろう材付リードピンの製造方法およびその製造装置

Also Published As

Publication number Publication date
JPH0141035B2 (enrdf_load_stackoverflow) 1989-09-01

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