JPS58196043A - Manufacture of brazed lead pin - Google Patents
Manufacture of brazed lead pinInfo
- Publication number
- JPS58196043A JPS58196043A JP7935582A JP7935582A JPS58196043A JP S58196043 A JPS58196043 A JP S58196043A JP 7935582 A JP7935582 A JP 7935582A JP 7935582 A JP7935582 A JP 7935582A JP S58196043 A JPS58196043 A JP S58196043A
- Authority
- JP
- Japan
- Prior art keywords
- cut
- brazing material
- brazing
- lead
- wire rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000005219 brazing Methods 0.000 claims abstract description 43
- 239000000463 material Substances 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 230000004927 fusion Effects 0.000 abstract 3
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000000945 filler Substances 0.000 description 14
- 239000000919 ceramic Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 238000005253 cladding Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、セラミックス基板等への接合の為にその端面
にろう材を有する集積回路装置用リードビンの製造方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a lead bin for an integrated circuit device, which has a brazing material on its end face for bonding to a ceramic substrate or the like.
一般にメタライズされたセラミックス基板等にリードビ
ンをろう付する場合、第１図に示す如くコパール又はＦ
ｅ−Ｎ１合金より成るリードビン！及びろう材２を、第
２図に示す如くセラミックス基板３上に治具４を用いて
セットしてろう付が行なわれていた。Generally, when brazing a lead bottle to a metallized ceramic substrate, etc., copper or F as shown in Figure 1 is used.
Lead bin made of e-N1 alloy! Brazing was performed by setting the soldering material 2 and the brazing filler metal 2 on the ceramic substrate 3 using a jig 4 as shown in FIG.
（１）
而して、第２図に示す様にセラミックス基１１ｉ３にリ
ードビンｌをろう材２を介してろう仁する場合、ろう材
の挿入を往々にして忘れることがあつた。これを防止す
る為に第３図に示す様に、予めろう材２をリードビン１
に取６付けたリードビン１１が用いられているが、リー
ドビン１にろう材２を取り付けるには、リードビン１と
ろう材２とを重ねた状態で加熱し、ろう材２を溶融して
リードビンｌにクラフトする所ｉ溶融クラッドにより行
なわれていた。(1) When the lead bottle 1 is soldered to the ceramic base 11i3 through the brazing material 2 as shown in FIG. 2, insertion of the brazing material is often forgotten. To prevent this, as shown in Figure 3, the brazing filler metal 2 is placed in the lead bin 1
A lead bin 11 is used, which is attached to the lead bin 1. To attach the brazing filler metal 2 to the lead bin 1, heat the lead bin 1 and the brazing filler metal 2 in a stacked state, melting the brazing filler metal 2, and attaching the brazing filler metal 2 to the lead bin L. Crafting was done using fused cladding.
然し乍ら、この様な方法では、第４図に示す如くリード
ビンｌのセラミックス基板等との接合面１ａ以外の部分
即ちその側面１ｂにまでろう材２が回り込んでしまう場
合があった。この様にろう材２がリードビンｌの側面１
ｂにまで回り込んだ状態でろう材２が溶融クラッドされ
ると、セラミックス基板３とのろう付に必要な量だけし
か使用されていないろう材２が、接合面１ａ以外の不必
要な部分にろうが流れ、そのろう付強度が低下してしま
うと共にその後の表面処理工程で事故を誘（２）
発する場合があった。However, in this method, as shown in FIG. 4, the brazing filler metal 2 sometimes wraps around to a portion of the lead bin l other than the bonding surface 1a with the ceramic substrate or the like, that is, to the side surface 1b thereof. In this way, the brazing filler metal 2 is placed on the side 1 of the lead bin l.
When the brazing filler metal 2 is melted and clad in a state where it has spread to the ceramic substrate 3, the amount of brazing filler metal 2 used is only the amount necessary for brazing with the ceramic substrate 3, and it spreads to unnecessary parts other than the joint surface 1a. There were cases where the wax flowed, reducing the brazing strength and causing accidents during the subsequent surface treatment process (2).
本発明は、上述した諸事情に鑑みて成されたものであり
、ろう材がリードビンのセラミックス基板等との接合面
以外の部分即ちリードビンの側面にまで回り込むことの
ないろうつきリードビンの製造方法を提供せんとするも
のである。The present invention has been made in view of the above-mentioned circumstances, and provides a method for manufacturing a brazed lead bin in which the brazing material does not go around to parts other than the bonding surface of the lead bin with a ceramic substrate, etc., that is, to the side surface of the lead bin. This is what we intend to provide.
本発明はコバール又はＦ ｅ −Ｎ ｉ合金等より成る
長尺の線材を酸化性雰囲気中にて加熱する工程と、この
線材を所定の長さに切断する工程と、切断した線材の切
断面に真空中若しくは不活性雰囲気中でろう材を溶融ク
ラッドする工程とから成ることを特徴とするものである
。The present invention involves the steps of heating a long wire made of Kovar or Fe-Ni alloy in an oxidizing atmosphere, cutting the wire into a predetermined length, and cutting the cut surface of the cut wire into a predetermined length. This method is characterized by the step of melting and cladding the brazing filler metal in a vacuum or an inert atmosphere.
然るに第５図ａに示す如くコバール又はＦｅ−Ｎ１合金
等より成る線材５を長尺の状態で酸化性雰囲気中で加熱
することにより線材５の表面には酸化皮膜６が生成され
ることになる６次にこの線材５を第５図すに示す如く所
定の長さに切断しリードビン５１とする。その切断面５
ａは酸化されておらず、その後この切断面５ａにろう材
２を溶融クラッドする場合その切断面５ａに容易にろう
（３）
材２を溶融クラッドすることが出来る。更にこの時リー
ドビン５１の側面には酸化皮１１６が生成されている為
にろう材２が側面に流れることがなく、従ってろう材２
はり−ドビン５′の切断面５ａのみにクラッドすること
が出来るものである。尚、この時リードビン５１へのろ
う材２の溶融クラッドを真空中若しくは不活性雰囲気中
で行なうのはリードビン５′の切断面５ａを酸化させず
かつ側面の酸化物を還元させない為である。However, as shown in FIG. 5a, when a long wire 5 made of Kovar or Fe-N1 alloy is heated in an oxidizing atmosphere, an oxide film 6 is formed on the surface of the wire 5. 6. Next, this wire 5 is cut into a predetermined length as shown in FIG. 5 to form a lead bin 51. Its cut surface 5
a is not oxidized, and when the cut surface 5a is then melted and clad with the brazing material 2, the cut surface 5a can be easily melted and clad with the solder material 2 (3). Furthermore, at this time, since the oxide skin 116 is formed on the side surface of the lead bin 51, the brazing material 2 does not flow to the side surface.
It is possible to clad only the cut surface 5a of the beam dobbin 5'. The reason why the melt cladding of the brazing material 2 onto the lead bin 51 is carried out in a vacuum or in an inert atmosphere is to prevent the cut surface 5a of the lead bin 5' from being oxidized and the oxide on the side surface from being reduced.
次に本発明を更に明瞭ならしむるべく、その具体的な実
施例及び従来例について述べる。Next, in order to further clarify the present invention, specific examples and conventional examples thereof will be described.
０．８ｍφのＦｅ−１５％Ｎｉより成る線材５をコイル
状にて大気中５００℃、５分間加熱することにより第５
図ａに示す如くその表面に酸化皮膜６を生成させた。然
る後この線材５を２０日の長さに切断して第５図すに示
す如くリードビン５゜とし、これをＡｇ−２８％Ｃｕよ
り成るろう材２と一緒に専用の治具に挿入し、Ｎｌ雰囲
気中８５０℃にて１分間加熱することにより第５図Ｃ（
４）
に示す如く一側端にろう材２を溶融クラッドしたろうつ
きリードビン５ ＩＩを得た。A fifth wire rod 5 made of Fe-15%Ni with a diameter of 0.8 m is heated in the air at 500°C for 5 minutes in a coil shape.
As shown in Figure a, an oxide film 6 was formed on the surface. Thereafter, this wire 5 was cut into a length of 20 days to form a lead bin 5° as shown in Figure 5, and this was inserted into a special jig together with a brazing material 2 made of Ag-28% Cu. , Fig. 5C (
4) As shown in FIG. 4, a brazed lead bottle 5 II having one side end clad with melted brazing material 2 was obtained.
０．８■φ（ＤＦｅ−１５％Ｎｉより成る線材を２０鶴
の長さに切断して第１図に示す如くリードビン１とし、
これをＡｇ−２８％Ｃｕより成るろう材２と一緒に専用
治具に挿入しＮｚ雰囲気中８５０℃、１分間加熱するこ
とにより、当該リードピン１の一側端にろう材２を有す
るリードビン１１を得た。A wire rod made of 0.8■φ (DFe-15%Ni) was cut into 20 lengths to make a lead bin 1 as shown in Fig. 1.
By inserting this into a special jig together with the brazing material 2 made of Ag-28% Cu and heating it at 850° C. for 1 minute in a Nz atmosphere, a lead bin 11 having the brazing material 2 at one end of the lead pin 1 is formed. Obtained.
この様にして得られたろうつきリードビン各１．０００
個についてろう材のクラッド状態を調査したところ、本
発明の製造方法にて得られたろうっきり−ドビンに於い
ては、ろう材がその側面にまで回り込んでいるものは皆
無であったが、従来の方法にて得られたろうっきり−ド
ビンに於いては全てろう材が側面にまて回り込んでいた
。1.000 each of the brazed lead bottles obtained in this way
When we investigated the cladding state of the brazing filler metal in each piece, we found that none of the dobbins obtained using the manufacturing method of the present invention had the brazing filler metal wrapping around the sides. In all solder dobbins obtained by conventional methods, the filler metal was wrapped around the sides.
尚、本発明によって得られたろうつきリードビンは、セ
ラミックス基板等とのろう付前あるいはろう行中に側面
の酸化物を還元するようにして使（５）
用すればより理想的である。It is more ideal if the brazed lead bin obtained according to the present invention is used (5) in such a way that oxides on the side surfaces are reduced before or during brazing with a ceramic substrate or the like.
以上詳細に説明した通り本発明より成る製造方法に於い
ては、長尺の線材の状態に於いてその表面に酸化皮膜を
生成させそれを切断し、その切断面にろう材を溶融クラ
ッドする為に、ろう材は酸化皮膜が生成されているリー
ドビンの側面に回り込むことなく、セラミックス基板と
の接合面のみにクラ゛フドされることになり、セラミッ
クス基板等とリードビンのろう付に於いて充分なるろう
付強度をもつろうつきり−ドピンが容易に得られる。As explained in detail above, in the manufacturing method according to the present invention, an oxide film is formed on the surface of a long wire, the film is cut, and the cut surface is clad with melted brazing material. In addition, the brazing material is cradled only on the joint surface with the ceramic substrate, without going around the side of the lead bottle where an oxide film is formed, which is sufficient for brazing the ceramic substrate, etc. and the lead bottle. A brazed pin with brazing strength can be easily obtained.
第１図は従来のり−ドビン及びろう材の斜視図、第２図
は従来のリードビンのろう打直前の状態を示す断面図、
第３図は従来のリードビンの良品を示す断面図、第４図
は従来のリードビンの不良品を示す断面図、第５図ａ乃
至Ｃは本発明の工程を示す断面図である。
２−−−−−・ろう材、５−・・・−線材、５ａ−−−
−−一切断面、５ ”−−−−−−リードビン、５ ａ
＋ −・−ろう付リードビン、・６−・−酸化皮膜
（６）
第５図Ｑ 第５図す
第５図ＣFIG. 1 is a perspective view of a conventional glue dobbin and brazing material, and FIG. 2 is a sectional view showing the state of a conventional lead bin just before soldering.
FIG. 3 is a sectional view showing a conventional lead bin that is good, FIG. 4 is a sectional view showing a defective conventional lead bin, and FIGS. 5A to 5C are sectional views showing the steps of the present invention. 2-----Brazing metal, 5--Wire rod, 5a---
---All sections, 5"----Lead bin, 5 a
+ -・-Brazing lead bin, ・6-・-Oxide film (6) Fig. 5 Q Fig. 5 Fig. 5 C
Claims (1)
線材を所定の長さに切断する工程と、切断した線材の切
断面に真空中若しくは、不活性雰囲気中でろう材を溶融
クランドする工程とから成ることを特徴とするろうつき
リードビンの製造方法。A step of heating a long wire rod in an oxidizing atmosphere, a step of cutting the wire rod into a predetermined length, and a step of melting brazing material on the cut surface of the cut wire rod in a vacuum or an inert atmosphere. A method for manufacturing a brazed lead bin, comprising the steps of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7935582A JPS58196043A (en) | 1982-05-12 | 1982-05-12 | Manufacture of brazed lead pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7935582A JPS58196043A (en) | 1982-05-12 | 1982-05-12 | Manufacture of brazed lead pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58196043A true JPS58196043A (en) | 1983-11-15 |
| JPH0141035B2 JPH0141035B2 (en) | 1989-09-01 |
Family
ID=13687588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7935582A Granted JPS58196043A (en) | 1982-05-12 | 1982-05-12 | Manufacture of brazed lead pin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58196043A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177554A (en) * | 1988-12-28 | 1990-07-10 | Tokuriki Honten Co Ltd | Method and apparatus for producing lead pin provided with solder |
-
1982
- 1982-05-12 JP JP7935582A patent/JPS58196043A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177554A (en) * | 1988-12-28 | 1990-07-10 | Tokuriki Honten Co Ltd | Method and apparatus for producing lead pin provided with solder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0141035B2 (en) | 1989-09-01 |
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