JPS59206187A - Joining method of fine wire - Google Patents
Joining method of fine wireInfo
- Publication number
- JPS59206187A JPS59206187A JP58079546A JP7954683A JPS59206187A JP S59206187 A JPS59206187 A JP S59206187A JP 58079546 A JP58079546 A JP 58079546A JP 7954683 A JP7954683 A JP 7954683A JP S59206187 A JPS59206187 A JP S59206187A
- Authority
- JP
- Japan
- Prior art keywords
- thin wire
- base material
- wire
- dummy
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/0046—Welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/32—Wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
Abstract
Description
【発明の詳細な説明】
この発明は、たとえばレーザ溶接や電子ビーム溶接など
の溶融溶接による細線の接合方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for joining thin wires by fusion welding, such as laser welding or electron beam welding.
従来のこの種の方法として、第１図に示すように、細線
（１）全基材（２）上に載置し、レーザビームまたは電
子ビーム（４）を矢印方向から照射し、細線（１）と基
材（２）の一部を溶融して、細線ｆｉ＋と基材（２）と
を接合していた。As shown in Fig. 1, a conventional method of this type involves placing a thin wire (1) on the entire base material (2) and irradiating the thin wire (1) with a laser beam or an electron beam (4) from the direction of the arrow. ) and a part of the base material (2) were melted to join the thin wire fi+ and the base material (2).
しかしながら、上記のような従来の方法によると、高エ
ネルギのビームが細線Ｉｌｌに直接照射されるため、細
線Ｉｌｌと基材１２】とが溶融接合される条件において
は、細線（１）のビーム照射面が溶融過大となって窪み
を発生する。このため、細線Ｉｌｌの線径が元の寸法よ
りもかなり小さくなって強度低下を引き起こしたシ、極
端な場合には細線＋１１が溶断してしまうという欠点が
あった。However, according to the conventional method as described above, since the high-energy beam is directly irradiated onto the thin wire Ill, under the conditions where the thin wire Ill and the base material 12 are fused and bonded, the beam irradiation on the thin wire (1) is difficult. The surface melts excessively, creating a depression. As a result, the wire diameter of the thin wire Ill became considerably smaller than its original size, resulting in a decrease in strength, and in extreme cases, the thin wire +11 was disadvantageously fused.
この発明は、上記のような従来の欠点を解消する走めに
なされたもので、基ぽ上に細線を配置し、上記基材と上
記細線に接触するようにダミー材を配置し、上記ダミー
材と上記細線の一部を溶融して接合すると共に、上記ダ
ミー材と上記基材の一部を溶融して接合することによシ
、上記ダミー材を介して上記細線と上記基材とを接合し
て、ビーム照射による細線の損傷を軽減できる細線の接
合方法を提供することを目的としている。This invention has been made in an effort to eliminate the above-mentioned conventional drawbacks, and includes arranging a thin wire on a base, arranging a dummy material so as to contact the base material and the thin wire, and By melting and joining the material and a part of the thin wire, and melting and joining the dummy material and a part of the base material, the thin wire and the base material are connected through the dummy material. It is an object of the present invention to provide a method for joining thin wires that can reduce damage to the thin wires due to beam irradiation.
以下、この発明の一実施例を図について説明する。第２
図（ａｌにおいて、（３）は細線ｆｉ＋および基材の両
方に接触するように配置されたダミー材である。なお、
ダミー材（３）の材質、形状および寸法については、と
くに限定するものではない。An embodiment of the present invention will be described below with reference to the drawings. Second
In the figure (al), (3) is a dummy material placed so as to be in contact with both the thin wire fi+ and the base material.
The material, shape, and dimensions of the dummy material (3) are not particularly limited.
このように各部材を配置した後、第２図＋１）ｌのよう
に矢印方向からレーザビームあるいは電子ビーム（４）
を照射すると、ダミー材（３）と細線ｉｌ＋の一部が溶
融して接合すると同時に基材（２）の一部とダミー材（
３）が溶融して接合する。（５）は溶融によって生ずる
溶融金属板である。この時、高エネルギのビームを直接
受けるダミー材（３）のビーム照射面は、溶融過大とな
って窪みが形成され、極端な場合には溶断するが、細線
ｆｉ＋の損傷は少ない。さらに細線ｆｉ＋とダミー材（
３）の材質、形状および寸法関係によって、ビームの照
射位置を矢印よシ網線Ｉｌ＋の反対方向にずらせて照射
することによシ、細線＋１１の損傷を一層少なくし、か
つ良好な溶融接合を得ることができる。After arranging each member in this way, apply a laser beam or electron beam (4) from the direction of the arrow as shown in Figure 2+1)l.
When irradiated with
3) is melted and joined. (5) is a molten metal plate produced by melting. At this time, the beam irradiation surface of the dummy material (3), which directly receives the high-energy beam, melts excessively, forming a depression, and in extreme cases, it melts, but the thin wire fi+ is not damaged much. Furthermore, thin wire fi+ and dummy material (
By shifting the irradiation position of the beam in the direction opposite to the crosshatched line Il+ according to the material, shape, and dimensional relationship of 3), damage to the thin wire +11 can be further reduced and good fusion bonding can be achieved. Obtainable.
他の実施例を第８図ｉａｌ 、 ｊｂｌに示す。この実
施例は基材（２）が棒状であり、細線ｆｉ＋を基材（２
）に巻きつけて配置し、さらにダミー材（３）を細線（
１）に接触するように基材（２）に巻きつける。この後
に第８図［ｂｌに示すようにビーム］４）ラダミー材＋
３１ Ｋ照射して接合する。このような形状においても
上記実施例と同様の効果を得ることができる。Another embodiment is shown in FIG. 8ial and jbl. In this example, the base material (2) is rod-shaped, and the thin wire fi+ is connected to the base material (2).
) and place the dummy material (3) around the thin wire (
Wrap it around the base material (2) so as to make contact with 1). After this, Fig. 8 [beam as shown in bl] 4) Radami material +
31K irradiation and bonding. Even in such a shape, the same effects as in the above embodiment can be obtained.
さらに他の実施例を第４図ｔａｌ 、 ｆＥに示す。図
において（６）はダミー材でこの場合は細線ｉｌ＋の端
部であシ、細線ｆｉｌに接触するように２回以上の多重
巻きの構造になっている。この実施例においては細線の
端部（６）がダミー材と同様の役割りをはたしておシ、
牙４図［ｂｌに示すように、細線の端部（６）にビーム
（４）を照射して接合を行なうものである。このような
方法にすることにより、上記実施例の効果に加えて、ダ
ミー材（３）を供給する手間をはふくことができ、また
細線Ｉｌ＋と細線の端部（６）との相対関係をあらかじ
め精度よく決めておくことができるため、ばらつきの少
ない接合が得られる効果がある。Still another embodiment is shown in FIG. 4, tal, fE. In the figure, (6) is a dummy material, which in this case is the end of the thin wire il+, and has a structure of multiple windings of two or more times so as to contact the thin wire fil. In this embodiment, the end portion (6) of the thin wire plays the same role as the dummy material.
As shown in Figure 4 [bl], the end portion (6) of the thin wire is irradiated with a beam (4) to perform the bonding. By adopting such a method, in addition to the effects of the above-mentioned embodiment, it is possible to eliminate the trouble of supplying the dummy material (3), and the relative relationship between the thin wire Il+ and the end portion (6) of the thin wire can be adjusted. Since it can be determined in advance with high precision, it is possible to obtain bonding with less variation.
また、さらに他の実施例を第５図ｔａ、ｌ 、 （ｂｌ
に示す。この実施例においては平板状の基材（２）であ
シ、ダミー材（３）の代わシに細線の端部を利用して接
合を行なっている。この実施例も上記実施例と同様の効
果全期待できる。Further, still other embodiments are shown in Fig. 5 ta, l, (bl
Shown below. In this embodiment, a flat base material (2) is used, and the end of a thin wire is used instead of a dummy material (3) to perform the joining. This embodiment can also be expected to have all the same effects as the above embodiments.
この発明の一実施例を以下に示す。An embodiment of this invention is shown below.
細線：タングステン線直径０．１８Ｍ
基材：タングステン線直径０．４５ Ｍダミー＋ｔ：タ
ングステン線直径０．１８ｍｍ溶勧法：ＹＡＧレーザ溶
接
溶接条件：出力エネルギー ＪＯｕ／□ｕｚａｅパルス
幅 ＝３ｍ友
ビーム照射位置−ダミー材または細線端部の中心軸から
外寄り０．２〜０，２５朋
の位置
上記条件を用いて、第２図および、ｔ４図に示す実施例
の方法によシ、エネルギを与えて溶融し接合した結果、
細線ｆｉ＋の損傷が極めて少なく、細線（１）と基材（
２１との良好な接合を得ることができた。Thin wire: Tungsten wire diameter 0.18M Base material: Tungsten wire diameter 0.45M dummy +t: Tungsten wire diameter 0.18mm Welding method: YAG laser welding Welding conditions: Output energy JOu/□uzae pulse width = 3m friend beam irradiation Position - A position 0.2 to 0.25 away from the center axis of the dummy material or thin wire end Using the above conditions, apply energy according to the method of the example shown in Fig. 2 and Fig. t4. As a result of melting and joining,
There was very little damage to the thin wire fi+, and the thin wire (1) and the base material (
Good bonding with No. 21 could be obtained.
以上述べたように、この発明によれば、基材上に細線を
配置し、上記基材と上記細線に接触するようにダミー材
を配置し、上記ダミー材と上記細線の一部を溶融して接
合すると共に、上記ダミー材と上記基材の一部を溶融し
て接合することによシ、上記ダミー材を介して上記細線
と上記基材とを接合し、ビニム照射による細線の損傷を
軽減することができ、機械的および電気的に良好にｍ線
と基材を接合する方法を得ることができる。As described above, according to the present invention, a thin wire is placed on a base material, a dummy material is placed in contact with the base material and the thin wire, and a part of the dummy material and the thin wire are melted. At the same time, by melting and joining a part of the dummy material and the base material, the fine wire and the base material are joined through the dummy material, thereby preventing damage to the fine wire due to vinyl irradiation. It is possible to obtain a method of joining the m-line and the base material with good mechanical and electrical properties.
第１図は従来の細線のビーム溶融接合を示す断面図、第
２図（！Ｌ）およびｆｂｌは、この発明の一実施例を示
す斜視図および断面図、第８図＋ａｌおよび（ｂｌはこ
の発明の他の実施例を示す斜視図および断面図、牙４図
ｆｉｌおよび（ｂｌはこの発明のさらに他の実施例を示
す斜視図および断面図、第５図＋ａｌおよびｆｂ＋けこ
の発明のさらに他の実施例を示す斜視図および断面図で
ある。
図において、（ｌ）は細線、（２）は基材、（３）はダ
ミー材、を示す。
なお、図中、同−符Ｊ８−は同一、又は相当部分を示す
。
代理人 大 岩 増 雄
（７）
第１図
第２図
第３図
第４図
（ｂ）
第５図
＜ｂ）
特許庁長官殿
１、事件の表示 特願昭５８−７９５４６号２、発
明の名称
細線の接合方法
３、補正をする者
５、補正の対象
図面
６、 補正の内容
図面の第８図を別紙のとおり訂正する。
？、添付書類の目録
図面（第８図） １通
以上
第３図Fig. 1 is a sectional view showing a conventional thin wire beam fusion welding, Fig. 2 (!L) and fbl are a perspective view and a sectional view showing an embodiment of the present invention, and Fig. 8 A perspective view and a sectional view showing another embodiment of the invention, FIGS. They are a perspective view and a cross-sectional view showing an example of the invention. In the figure, (l) shows a thin wire, (2) shows a base material, and (3) shows a dummy material. In addition, in the figure, the same symbol J8- is The same or equivalent parts are shown. Agent Masuo Oiwa (7) Figure 1 Figure 2 Figure 3 Figure 4 (b) Figure 5<b) Commissioner of the Japan Patent Office 1, Indication of the case Patent application Sho 58-79546 No. 2, Name of the invention, Method of joining thin lines, 3, Person making the amendment, 5, Drawing subject to amendment, 6, Contents of amendment, Figure 8 of the drawing is corrected as shown in the attached sheet.?, Catalog drawing of attached documents ( Figure 8) 1 or more copies Figure 3
Claims (3)
触するようにタ′ミー材を配置し、上記ダミー材と上記
細線の一部を溶融して接合すると共に、上記ダミー材と
上記基材の一部を溶融して接合することによシ、上記ダ
ミー材を介して上記細線と上記基材とを接合する細線の
接合方法。(1) A thin wire is placed on a base material, a tummy material is placed so as to be in contact with the base material and the thin wire, the dummy material and a part of the thin wire are melted and joined, and the dummy material is A method for joining a thin wire, in which the thin wire and the base material are joined via the dummy material by melting and joining a part of the base material.
細線に接触するようにダミー材を上記基材に巻きつけて
配置した特許請求の範囲第１項記載の細線の接合方法。(2) A method for joining thin wires according to claim 1, wherein a thin wire is wound around a base material and arranged, and a dummy material is wound around the base material and arranged so as to be in contact with the base material and the thin wire. .
請求の範囲第１項または第２項記載の細線の接合方法。(3) The method for joining thin wires according to claim 1 or 2, wherein the dummy material is an end portion of the thin wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58079546A JPS59206187A (en) | 1983-05-07 | 1983-05-07 | Joining method of fine wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58079546A JPS59206187A (en) | 1983-05-07 | 1983-05-07 | Joining method of fine wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59206187A true JPS59206187A (en) | 1984-11-21 |
Family
ID=13692993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58079546A Pending JPS59206187A (en) | 1983-05-07 | 1983-05-07 | Joining method of fine wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59206187A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5925269A (en) * | 1996-11-09 | 1999-07-20 | Xerox Corporation | Method of manufacture of corotron wire assembly |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010739A (en) * | 1973-06-04 | 1975-02-04 | ||
| JPS5127414A (en) * | 1974-08-30 | 1976-03-08 | Toyo Electric Mfg Co Ltd | |
| JPS5340069A (en) * | 1976-09-27 | 1978-04-12 | Toyota Motor Co Ltd | Mold for expansion molding |
| JPS5540069A (en) * | 1978-09-14 | 1980-03-21 | Matsushita Electric Ind Co Ltd | Seaming method of thin wire |
-
1983
- 1983-05-07 JP JP58079546A patent/JPS59206187A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010739A (en) * | 1973-06-04 | 1975-02-04 | ||
| JPS5127414A (en) * | 1974-08-30 | 1976-03-08 | Toyo Electric Mfg Co Ltd | |
| JPS5340069A (en) * | 1976-09-27 | 1978-04-12 | Toyota Motor Co Ltd | Mold for expansion molding |
| JPS5540069A (en) * | 1978-09-14 | 1980-03-21 | Matsushita Electric Ind Co Ltd | Seaming method of thin wire |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5925269A (en) * | 1996-11-09 | 1999-07-20 | Xerox Corporation | Method of manufacture of corotron wire assembly |
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