JPS6213118B2 - - Google Patents
Info
- Publication number
- JPS6213118B2 JPS6213118B2 JP57219973A JP21997382A JPS6213118B2 JP S6213118 B2 JPS6213118 B2 JP S6213118B2 JP 57219973 A JP57219973 A JP 57219973A JP 21997382 A JP21997382 A JP 21997382A JP S6213118 B2 JPS6213118 B2 JP S6213118B2
- Authority
- JP
- Japan
- Prior art keywords
- thin wire
- flat plate
- joining
- cut
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005304 joining Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 13
- 238000010894 electron beam technology Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 description 9
- 230000004927 fusion Effects 0.000 description 4
- 210000001503 joint Anatomy 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/26—Seam welding of rectilinear seams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/32—Wires
Description
【発明の詳細な説明】
この発明は、レーザ溶接、電子ビーム等の溶融
溶接による平板への細線の接合方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for joining a thin wire to a flat plate by laser welding, electron beam fusion welding, or the like.
従来、細線と平板とのレーザ溶接、あるいは電
子ビーム溶接による接合においては、第１ａ図に
示すように、平板２上に細線１を載置してレーザ
ビームまたは電子ビーム３を矢印方向から照射し
て行なう重ね継手が一般に使用されているが、こ
のように平板２上に細線１を単に載置しただけで
は、該細線が平板上の所定位置に固定されていな
いために、前記ビームの照射される位置がばらつ
く欠点があり、また特に該ビームの照射を平板側
からではなしに、第１ａ図に示すように細線１の
側から行なう場合、特にこれを細線の中心線へ向
けて施すと、前記ビームが細線を貫通して接合面
に到達するようにビームエネルギを増大させる必
要があるために、細線のビーム照射面が溶融過大
となつて窪みを生起し、極端な場合には平板との
接合前に細線が溶断してしまい、さらにはスパツ
タの発生することも多い。前述の不具合を避ける
ために、第１ｂ図に示すように、ビーム３の照射
位置を平板２に対して斜め上方にして矢印の方向
から行なう方式があるが、これはビームの焦点を
定めるのが困難であつて常に安定した良好な溶接
部を得難いとされ、また平板２側からビーム照射
を行なわんとすると、細線と平板との接触部が判
定し難いために、該ビームを接触部に適確に指向
することが困難である欠点がある。 Conventionally, in joining a thin wire and a flat plate by laser welding or electron beam welding, as shown in Fig. 1a, a thin wire 1 is placed on a flat plate 2 and a laser beam or an electron beam 3 is irradiated from the direction of the arrow. Generally, lap joints are used, but simply placing the thin wire 1 on the flat plate 2 in this way does not allow the thin wire to be fixed at a predetermined position on the flat plate, so the beam irradiation does not occur. There is a drawback that the position of the beam varies, and especially when the beam is irradiated not from the flat plate side but from the thin wire 1 side as shown in FIG. Since it is necessary to increase the beam energy so that the beam penetrates the thin wire and reaches the joint surface, the beam irradiated surface of the thin wire becomes excessively melted, creating a depression, and in extreme cases, the beam irradiation surface of the thin wire may become dented. The thin wires often melt and break before joining, and spatter often occurs. In order to avoid the above-mentioned problems, there is a method in which the irradiation position of the beam 3 is set diagonally above the flat plate 2 in the direction of the arrow, as shown in Fig. 1b. It is said that it is difficult to always obtain a stable and good welded part, and if you try to irradiate the beam from the flat plate 2 side, it is difficult to judge the contact area between the thin wire and the flat plate, so it is difficult to apply the beam to the contact area. It has the disadvantage that it is difficult to point accurately.
この発明は、上述した従来技術の欠点を解消す
るためになされたものであつて、平板の一部に突
出し部を加工し、該突出し部に細線を位置決めさ
せてその接触部にビーム照射を行なうことによ
り、良好な溶接部を安定して得られる細線の接合
方法を提供することを目的としている。 This invention has been made to solve the above-mentioned drawbacks of the prior art, and involves processing a protruding part on a part of a flat plate, positioning a thin wire on the protruding part, and irradiating the contact part with a beam. The object of the present invention is to provide a method for joining fine wires that can stably obtain a good welded part.
つぎに、この発明の実施例を図面によつて説明
すれば、第２ａおよび２ｂ図において、平板２の
端部に折曲げ部４を折曲げ加工し、該折曲げ部の
内面４ａに細線１を押し付けて位置決めをしてか
ら、該折曲げ部の先端の角隅部４ｂを指向してビ
ーム３を照射して前記細線と平板の折曲げ部とを
溶融接合するものである。 Next, an embodiment of the present invention will be described with reference to the drawings. In FIGS. 2a and 2b, a bent part 4 is bent at the end of the flat plate 2, and a thin wire 1 is formed on the inner surface 4a of the bent part. After positioning by pressing the wire, the beam 3 is directed toward the corner 4b at the tip of the bent portion to fuse and join the thin wire and the bent portion of the flat plate.
したがつて、この発明に係る接合方法によれ
ば、折曲げ部４の角隅部４ｂは位置センサ装置を
利用することによつて容易に確認することができ
るから、ビーム照射指向位置を高精度に決定する
ことが可能であり、例えば細線の直径が平板の板
厚よりもかなり大である場合に、前記角隅部を検
出した後、該角隅部から所定の距離だけほぼ細線
の側に寄つた位置にビーム照射を行なうことが容
易であり、細線と平板との確実な接合をなすこと
ができる。 Therefore, according to the joining method according to the present invention, the corner portion 4b of the bent portion 4 can be easily confirmed by using a position sensor device, so that the beam irradiation directional position can be determined with high precision. For example, if the diameter of the thin wire is considerably larger than the thickness of the flat plate, after detecting the corner, the wire can be determined to be approximately a predetermined distance from the corner on the side of the thin wire. It is easy to irradiate the beam at close positions, and the thin wire and the flat plate can be reliably joined.
また、この発明の他の実施例を示す第３ａおよ
び３ｂ図において、平板２の一部に切起し部５を
加工し、平板の長手方向に細線１を位置決めする
と共に該切起し部に細線１を押し付けて位置決め
した後に、前述した実施例と同様に切起し部角隅
部５ｂを指向してビーム３を照射し接合する方法
であり、この実施例に係る効果は前述の実施例に
係るものと全く変らない。 Further, in FIGS. 3a and 3b showing another embodiment of the present invention, a cut and raised portion 5 is formed in a part of the flat plate 2, and the thin wire 1 is positioned in the longitudinal direction of the flat plate, and the cut and raised portion is After pressing and positioning the thin wire 1, the beam 3 is irradiated to the corner 5b of the cut-and-raised portion to perform bonding, similar to the above-described embodiment, and the effects of this embodiment are the same as those of the above-described embodiment. It's no different from anything related to.
またさらに、この発明のさらに他の実施例を示
す第４ａおよび４ｂ図において、平板２の一部に
一対の切起し部５および５′をその間の溝に細線
１を抱けるように両側から加工切起し、該両切起
し部間に細線を上方から押し込んで位置決めした
後に、前述両実施例同様に両切起し部角隅部にビ
ーム３を指向して照射溶融接合するもので、この
方法によれば、前述の両実施例のように、細線の
位置決めに折曲げ部あるいは切起し部に対して細
線を横方向から加圧しつづけて行なう必要がない
上に、ビーム溶融接合が二点でなされるのでその
接合強度が大きい。なお、前述の実施例の切起し
部５、ならびにこの実施例の両切起し部５および
５′を平板２の端部に設けた場合について説明し
たが、平板の中央部に設けても効果が同様である
ことは詳述するまでもない。 Furthermore, in FIGS. 4a and 4b showing still another embodiment of the present invention, a pair of cut and raised portions 5 and 5' are formed on a part of the flat plate 2 from both sides so that the thin wire 1 can be held in the groove therebetween. After cutting and raising, and positioning by pushing a thin wire between the two cut and raised parts from above, the beam 3 is directed at the corner of both the cut and raised parts to perform irradiation melting and welding, as in the previous embodiments. According to this method, it is not necessary to continuously press the thin wire from the lateral direction against the bent part or the cut and raised part for positioning the thin wire, as in both of the above-mentioned embodiments. Since it is made at two points, the joint strength is high. Although the case where the cut-and-raised portion 5 of the above-mentioned embodiment and the cut-and-raised portions 5 and 5' of this embodiment are provided at the end of the flat plate 2 has been described, they may also be provided at the center of the flat plate. It goes without saying that the effects are similar.
さらに、前述の実施例において、第５図に図示
するように、細線１の直径l1と、平板２の折曲げ
部４（図示しないが切起し部）の高さl2との関係
を、l2＝0.4〜1.0l1の範囲に選択すると、スプラツ
シユの発生が極めて少なく良好な溶融接合が得ら
れることが実験的に確認された。 Furthermore, in the above-mentioned embodiment, as shown in FIG . , l 2 =0.4 to 1.0l 1 , it was experimentally confirmed that the occurrence of splash was extremely small and good fusion bonding could be obtained.
本発明による実施例を示せば以下の通りであ
る。 Examples according to the present invention are as follows.
細線：ニツケル、直径＝0.75mm
平板：SuS316、厚さ＝0.35mm、幅＝2.5mm折曲
げ部（切起し部）の高さ＝0.45mm（細線直径の
0.6倍）
溶接方法：YAGレーザ溶接
溶接条件：出力エネルギ＝4J／Ｐ、パルス幅＝
3.5msec
上記各条件にてエネルギを与えて溶融させたと
ころ、スプラツシユの発生がなく、細線と平板と
を良好に接合することができた。Thin wire: Nickel, diameter = 0.75mm Flat plate: SuS316, thickness = 0.35mm, width = 2.5mm Height of bent part (cut and raised part) = 0.45mm (thin wire diameter
0.6 times) Welding method: YAG laser welding Welding conditions: Output energy = 4J/P, pulse width =
When energy was applied for 3.5 msec under each of the above conditions for melting, no splash was generated, and the thin wire and the flat plate could be bonded well.
上述したように、この発明によれば、細線を平
板の所定位置に常に固定できる上、平板に加工し
た折曲げ部、または切起し部の先端の角隅部を検
出することによつて、ビーム照射位置を確認する
ことができるから、接合するべき所定位置にビー
ムを精度良く照射することができて細線と平板と
の良好な溶融溶接を確実に得られるとともに、そ
の接合部が突合せ継手となるために従来技術によ
る重ね継手に比較して小さなビームエネルギでの
溶接が可能となり、スプラツシユのない接合部が
得られ、さらに消耗品であるフラツシユランプの
長寿命化を実現できるなどの効果がある。 As described above, according to the present invention, the thin wire can always be fixed at a predetermined position on the flat plate, and by detecting the corner of the tip of the bent part or cut and raised part processed into the flat plate, Since the beam irradiation position can be confirmed, the beam can be accurately irradiated to the predetermined position to be joined, ensuring good fusion welding between the thin wire and the flat plate, and ensuring that the joint is a butt joint. This makes it possible to weld with a smaller beam energy than lap joints using conventional technology, resulting in spatter-free joints, and the ability to extend the life of the flash lamp, which is a consumable item. be.
第１ａおよび１ｂ図は、従来の重ね継手による
細線と平板とのビーム溶融接合を示す説明図、第
２ａおよび２ｂ図は、この発明の実施例を示す
夫々斜視および正面説明図、第３ａおよび３ｂ図
は、同じく他の実施例を示す斜視および正面視説
明図、第４ａおよび４ｂ図は、同じくさらに他の
実施例を示す夫々斜視および正面視説明図、第５
図は、同じく細線の直径と平板の折曲げ部の高さ
の関係を示す説明図である。
１は細線、２は平板、３はビーム、４は折曲げ
部、４ａは折曲げ部内面、４ｂは折曲げ部角隅
部、５および５′は切起し部、５ｂは切起し部角
隅部である。なお、図中、同一符号は、同一また
は相当部分を示すものとする。
Figures 1a and 1b are explanatory diagrams showing beam fusion joining of a thin wire and a flat plate using a conventional lap joint, Figures 2a and 2b are perspective and front explanatory diagrams showing an embodiment of the present invention, respectively, and Figures 3a and 3b are 4a and 4b are perspective and front view explanatory views showing still another embodiment, FIG.
The figure is also an explanatory diagram showing the relationship between the diameter of the thin wire and the height of the bent portion of the flat plate. 1 is a thin wire, 2 is a flat plate, 3 is a beam, 4 is a bent part, 4a is an inner surface of the bent part, 4b is a corner of the bent part, 5 and 5' are cut and raised parts, and 5b is a cut and raised part This is a corner. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
折曲げ加工を施して形成した折曲げ部に細線を押
し付けて位置決めをした後、該折曲げ部の先端部
と細線とにレーザビーム、電子ビーム等を照射し
て接合させることを特徴とする細線の接合方法。 ２ 平板の折曲げ部の高さを細線の直径の0.4〜
1.0倍の範囲にする特許請求の範囲第１項記載の
細線の接合方法。 ３ 細線と平板との接合において、平板の一部に
切起し加工を施して形成した切起し部に細線を押
し付けて位置決めをした後、該切起し部の先端部
と細線とにレーザビーム、電子ビーム等を照射し
て接合させることを特徴とする細線の接合方法。 ４ 平板の切起し部の高さを細線の直径の0.4〜
1.0倍の範囲にする特許請求の範囲第３項記載の
細線の接合方法。 ５ 細線と平板との接合において、平板の一部細
線を抱けるように両側から切起し加工を施して形
成した両切起し部間に細線を上方から押し込んで
位置決めした後、該両切起し部の先端部と細線と
にレーザビーム、電子ビーム等を照射して接合さ
せることを特徴とする細線の接合方法。 ６ 平板の両切起し部の高さを細線の直径の0.4
〜1.0倍の範囲にする特許請求の範囲第５項記載
の細線の接合方法。[Claims] 1. In joining a thin wire and a flat plate, after positioning the thin wire by pressing it against a bent part formed by bending one side of the flat plate, the tip of the bent part and the thin wire are aligned. A method for joining thin wires, characterized in that the wires are joined by irradiating them with a laser beam, an electron beam, etc. 2. Set the height of the bent part of the flat plate to 0.4 to the diameter of the thin wire.
A method for joining fine wires according to claim 1, wherein the range is 1.0 times. 3. In joining the thin wire and the flat plate, after positioning the fine wire by pressing it against the cut and raised part formed by cutting and raising a part of the flat plate, a laser is applied to the tip of the cut and raised part and the thin wire. A method for joining thin wires, which is characterized by joining by irradiation with a beam, an electron beam, etc. 4 Set the height of the cut and raised part of the flat plate to 0.4 to the diameter of the thin wire.
The method for joining fine wires according to claim 3, wherein the range is 1.0 times. 5. When joining a thin wire and a flat plate, after positioning the fine wire by pushing it from above between both cut and raised parts formed by cutting and raising from both sides so as to hold a part of the thin wire, A method for joining thin wires, characterized by irradiating a laser beam, an electron beam, etc. to the tip of a part and the thin wire to join them. 6 The height of both cut and raised parts of the flat plate is 0.4 of the diameter of the thin wire.
5. The method of joining fine wires according to claim 5, wherein the joining method is in the range of 1.0 times.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57219973A JPS59107786A (en) | 1982-12-13 | 1982-12-13 | Joining method of fine wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57219973A JPS59107786A (en) | 1982-12-13 | 1982-12-13 | Joining method of fine wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59107786A JPS59107786A (en) | 1984-06-22 |
| JPS6213118B2 true JPS6213118B2 (en) | 1987-03-24 |
Family
ID=16743926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57219973A Granted JPS59107786A (en) | 1982-12-13 | 1982-12-13 | Joining method of fine wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59107786A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4757179A (en) * | 1987-01-16 | 1988-07-12 | E. I. Du Pont De Nemours And Company | Laser welding method |
| US4774394A (en) * | 1987-09-02 | 1988-09-27 | E. I. Du Pont De Nemours And Company | Laser welding method |
| US4926022A (en) * | 1989-06-20 | 1990-05-15 | Digital Equipment Corporation | Laser reflow soldering process and bonded assembly formed thereby |
| JP3048485B2 (en) * | 1993-03-15 | 2000-06-05 | 矢崎総業株式会社 | Beam welding method of terminal and electric wire |
| JP4600319B2 (en) * | 2006-03-09 | 2010-12-15 | 株式会社デンソー | Method for manufacturing fluid control valve |
| US9728927B2 (en) | 2011-07-01 | 2017-08-08 | Delphi International Operations Luxembourge, Sarl | Method for welding a cable to a terminal |
| JP6090142B2 (en) * | 2013-12-12 | 2017-03-08 | 住友電装株式会社 | Terminal and wire connection method of the terminal |
-
1982
- 1982-12-13 JP JP57219973A patent/JPS59107786A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59107786A (en) | 1984-06-22 |
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