JPH0141035B2 - - Google Patents
Info
- Publication number
- JPH0141035B2 JPH0141035B2 JP7935582A JP7935582A JPH0141035B2 JP H0141035 B2 JPH0141035 B2 JP H0141035B2 JP 7935582 A JP7935582 A JP 7935582A JP 7935582 A JP7935582 A JP 7935582A JP H0141035 B2 JPH0141035 B2 JP H0141035B2
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- brazing
- brazing material
- cut
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000000945 filler Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 239000012298 atmosphere Substances 0.000 claims description 7
- 238000005253 cladding Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000005219 brazing Methods 0.000 description 40
- 239000000463 material Substances 0.000 description 19
- 239000000919 ceramic Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 229910000833 kovar Inorganic materials 0.000 description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、セラミツクス基板等への接合の為に
その端面にろう材を有する集積回路装置用リード
ピンの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a lead pin for an integrated circuit device having a brazing material on its end face for bonding to a ceramic substrate or the like.
一般にメタライズされたセラミツクス基板等に
リードピンをろう付する場合、第１図に示す如く
コバール又はFe−Ni合金より成るリードピン１
及びろう材２を、第２図に示す如くセラミツクス
基板３上に治具４を用いてセツトしてろう付が行
なわれていた。 Generally, when brazing lead pins to a metallized ceramic substrate, etc., the lead pin 1 is made of Kovar or Fe-Ni alloy as shown in Figure 1.
The brazing material 2 and the soldering material 2 are set on a ceramic substrate 3 using a jig 4 as shown in FIG. 2, and brazing is performed.
而して、第２図に示す様にセラミツクス基板３
にリードピン１をろう材２を介してろう付する場
合、ろう材の挿入を往々にして忘れることがあつ
た。これを防止する為に第３図に示す様に、予め
ろう材２をリードピン１に取り付けたリードピン
１′が用いられているが、リードピン１にろう材
２を取り付けるには、リードピン１とろう材２と
を重ねた状態で加熱し、ろう材２を溶融してリー
ドピン１にクラツドする所謂溶融クラツドにより
行なわれていた。 Thus, as shown in FIG. 2, the ceramic substrate 3
When brazing the lead pin 1 through the brazing material 2, insertion of the brazing material was often forgotten. In order to prevent this, a lead pin 1' is used in which the brazing material 2 is attached to the lead pin 1 in advance, as shown in Fig. 3. This is accomplished by heating the brazing filler metal 2 in a stacked state, melting the brazing filler metal 2, and cladding it to the lead pin 1.
然し乍ら、この様な方法では、第４図に示す如
くリードピン１のセラミツクス基板等との接合面
１ａ以外の部分即ちその側面１ｂにまでろう材２
が回り込んでしまう場合があつた。この様にろう
材２がリードピン１の側面１ｂにまで回り込んだ
状態でろう材２が溶融クラツドされると、セラミ
ツクス基板３とのろう付に必要な量だけしか使用
されていないろう材２が、接合面１ａ以外の不必
要な部分にろうが流れ、そのろう付強度が低下し
てしまうと共にその後の表面処理工程で事故を誘
発する場合があつた。 However, in such a method, as shown in FIG. 4, the brazing material 2 is applied to a portion of the lead pin 1 other than the bonding surface 1a with the ceramic substrate, etc., that is, to the side surface 1b thereof.
There were cases where the system went around. When the brazing filler metal 2 is melted and clad in a state in which the filler metal 2 has reached the side surface 1b of the lead pin 1 in this way, the amount of brazing filler metal 2 used is only the amount necessary for brazing with the ceramic substrate 3. In some cases, wax flows to unnecessary parts other than the joint surface 1a, reducing the brazing strength and causing accidents in the subsequent surface treatment process.
本発明は、上述した諸事情に鑑みて成されたも
のであり、ろう材がリードピンのセラミツクス基
板等との接合面以外の部分即ちリードピンの側面
にまで回り込むことのないろうつきリードピンの
製造方法を提供せんとするものである。 The present invention has been made in view of the above-mentioned circumstances, and provides a method for manufacturing a brazed lead pin in which the brazing material does not extend to the side surface of the lead pin other than the surface where the lead pin is bonded to a ceramic substrate, etc. This is what we intend to provide.
本発明はコバール又はFe−Ni合金等より成る
長尺の線材を酸化性雰囲気中にて加熱する工程
と、この線材を所定の長さに切断する工程と、切
断した線材の切断面に真空中若しくは不活性雰囲
気中でろう材を溶融クラツドする工程とから成る
ことを特徴とするものである。 The present invention involves a process of heating a long wire made of Kovar or Fe-Ni alloy in an oxidizing atmosphere, a process of cutting this wire into a predetermined length, and a process of heating a long wire made of Kovar or Fe-Ni alloy in a vacuum. Alternatively, it is characterized by comprising a step of melting and cladding the brazing filler metal in an inert atmosphere.
然るに第５図ａに示す如くコバール又はFe−
Ni合金等より成る線材５を長尺の状態で酸化性
雰囲気中に加熱することにより線材５の表面には
酸化皮膜６が生成されることになる。次にこの線
材５を第５図ｂに示す如く所定の長さに切断しリ
ードピン５′とする。その切断面５ａは酸化され
ておらず、その後この切断面５ａにろう材２を溶
融クラツドする場合その切断面５ａに容易にろう
材２を溶融クラツドすることが出来る。更にこの
時リードピン５′の側面には酸化皮膜６が生成さ
れている為にろう材２が側面に流れることがな
く、従つてろう材２はリードピン５′の切断面５
ａのみにクラツドすることが出来るものである。
尚、この時リードピン５′へのろう材２の溶融ク
ラツドを真空中若しくは不活性雰囲気中で行なう
のはリードピン５′の切断面５ａを酸化させずか
つ側面の酸化物を還元させない為である。 However, as shown in Figure 5a, Kovar or Fe-
By heating a long wire 5 made of Ni alloy or the like in an oxidizing atmosphere, an oxide film 6 is formed on the surface of the wire 5. Next, this wire 5 is cut into a predetermined length as shown in FIG. 5b to form a lead pin 5'. The cut surface 5a is not oxidized, and when subsequently melting and cladding the brazing material 2 to the cut surface 5a, the brazing material 2 can be easily melted and cladding to the cut surface 5a. Furthermore, at this time, since an oxide film 6 is formed on the side surface of the lead pin 5', the brazing material 2 does not flow to the side surface, so that the brazing material 2 does not flow to the cut surface 5 of the lead pin 5'.
It can be clad only in a.
At this time, the melting and cladding of the brazing material 2 onto the lead pin 5' is carried out in a vacuum or in an inert atmosphere in order to prevent the cut surface 5a of the lead pin 5' from being oxidized and the oxide on the side surface from being reduced.
次に本発明を更に明瞭ならしむるべく、その具
体的な実施例及び従来例について述べる。 Next, in order to further clarify the present invention, specific examples and conventional examples thereof will be described.
実施例
0.8mmφのFe−15％Niより成る線材５をコイル
状にて大気中500℃、５分間加熱することにより
第５図ａに示す如くその表面に酸化皮膜６を生成
させた。然る後この線材５を20mmの長さに切断し
て第５図ｂに示す如くリードピン５′とし、これ
をAg−28％Cuより成るろう材と２と一緒に専用
の治具に挿入し、N2雰囲気中850℃にて１分間加
熱することにより第５図ｃ示す如く一側端にろう
材２を溶融クラツドしたろうつきリードピン５″
を得た。Example A wire rod 5 made of Fe-15%Ni having a diameter of 0.8 mm was heated in a coiled state at 500 DEG C. for 5 minutes in the atmosphere to form an oxide film 6 on its surface as shown in FIG. 5a. Thereafter, this wire 5 was cut into a length of 20 mm to form a lead pin 5' as shown in Fig. 5b, and this was inserted into a special jig together with a brazing material 2 made of Ag-28% Cu. , by heating at 850°C for 1 minute in a N 2 atmosphere, a brazing lead pin 5'' with a solder metal 2 melted on one end as shown in Fig. 5c is produced.
I got it.
従来例
0.8mmφのFe−15％Niより成る線材を20mmの長
さに切断して第１図に示す如くリードピン１と
し、これをAg−28％Cuより成るろう材２と一緒
に専用治具に挿入しN2雰囲気中850℃、１分間加
熱することにより、当該リードピン１の一側端に
ろう材２を有するリードピン１′を得た。Conventional example A wire rod made of Fe-15%Ni with a diameter of 0.8mm is cut into a length of 20mm to make the lead pin 1 as shown in Fig. 1, and this is placed in a special jig together with the brazing material 2 made of Ag-28%Cu. The lead pin 1' having the brazing material 2 at one end of the lead pin 1 was obtained by inserting the lead pin into a tube and heating it at 850° C. for 1 minute in an N 2 atmosphere.
この様にして得られたろうつきリードピン各
1000個についてろう材のクラツド状態を調査した
ところ、本発明の製造方法にて得られたろうつき
リードピンに於いては、ろう材がその側面にまで
回り込んでいるものは皆無であつたが、従来の方
法にて得られたろうつきリードピンに於いては全
てろう材が側面にまで回り込んでいた。 Each brazed lead pin obtained in this way
When we investigated the cladding state of the brazing filler metal on 1000 pieces, we found that none of the brazing lead pins obtained by the manufacturing method of the present invention had the brazing filler metal wrapping around the sides, but compared to conventional In all of the brazed lead pins obtained by the method described above, the brazing metal went all the way to the sides.
尚、本発明によつて得られたろうつきリードピ
ンは、セラミツクス基板等とのろう付前あるいは
ろう付中に側面の酸化物を還元するようにして使
用すればより理想的である。 It is more ideal if the brazing lead pin obtained according to the present invention is used in such a way that the oxide on the side surface is reduced before or during brazing with a ceramic substrate or the like.
以上詳細に説明した通り本発明より成る製造方
法に於いては、長尺の線材の状態に於いてその表
面に酸化皮膜を生成させそれを切断し、その切断
面にろう材を溶融クラツドする為に、ろう材は酸
化皮膜が生成されているリードピンの側面に回り
込むことなく、セラミツクス基板との接合面のみ
にクラツドされることになり、セラミツクス基板
等とリードピンのろう付に於いて充分なるろう付
強度をもつろうつきリードピンが容易に得られ
る。 As explained in detail above, in the manufacturing method of the present invention, an oxide film is formed on the surface of a long wire, the film is cut, and the cut surface is covered with melted brazing material. In addition, the brazing material does not wrap around the sides of the lead pin where an oxide film is formed, but is clad only on the surface to be bonded to the ceramic substrate, ensuring sufficient brazing when brazing the ceramic substrate, etc. and the lead pin. A brazed lead pin with strength can be easily obtained.
第１図は従来のリードピン及びろう材の斜視
図、第２図は従来のリードピンのろう付直前の状
態を示す断面図、第３図は従来のリードピンの良
品を示す断面図、第４図は従来のリードピンの不
良品を示す断面図、第５図ａ乃至ｃは本発明の工
程を示す断面図である。
２……ろう材、５……線材、５ａ……切断面、
５′……リードピン、５″……ろう付リードピン、
６……酸化皮膜。
Figure 1 is a perspective view of a conventional lead pin and brazing material, Figure 2 is a sectional view of a conventional lead pin just before brazing, Figure 3 is a sectional view of a conventional lead pin in good condition, and Figure 4 is a sectional view of a conventional lead pin in good condition. FIGS. 5A to 5C are cross-sectional views showing a defective conventional lead pin, and FIGS. 5A to 5C are cross-sectional views showing the steps of the present invention. 2... Brazing metal, 5... Wire rod, 5a... Cut surface,
5'...Lead pin, 5''...Brazing lead pin,
6...Oxide film.
Claims (1)
程と、この線材を所定の長さに切断する工程と、
切断した線材の切断面に真空中若しくは、不活性
雰囲気中でろう材を溶融クラツドする工程とから
成ることを特徴とするろうつきリードピンの製造
方法。1. A step of heating a long wire rod in an oxidizing atmosphere, a step of cutting this wire rod into a predetermined length,
1. A method for manufacturing a brazed lead pin, comprising the step of cladding a cut surface of a cut wire with melting filler metal in a vacuum or an inert atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7935582A JPS58196043A (en) | 1982-05-12 | 1982-05-12 | Manufacture of brazed lead pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7935582A JPS58196043A (en) | 1982-05-12 | 1982-05-12 | Manufacture of brazed lead pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58196043A JPS58196043A (en) | 1983-11-15 |
| JPH0141035B2 true JPH0141035B2 (en) | 1989-09-01 |
Family
ID=13687588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7935582A Granted JPS58196043A (en) | 1982-05-12 | 1982-05-12 | Manufacture of brazed lead pin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58196043A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2685559B2 (en) * | 1988-12-28 | 1997-12-03 | 株式会社徳力本店 | Manufacturing method of lead pin with brazing material and manufacturing apparatus thereof |
-
1982
- 1982-05-12 JP JP7935582A patent/JPS58196043A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58196043A (en) | 1983-11-15 |
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