JPS60261123A - Method of producing electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing electronic components, and particularly to a method for soldering an external lead portion H to an external electrical conduit of a multilayer cephmic capacitor.

[Prior art]

In general, this type of multilayer cephmic capacitor has internal electrodes interposed between multiple cephmic layers in a staggered manner, an external electrode is formed on the exposed end surface of the internal electrode, and an external lead member is attached to the external electrode in the same direction. It is constructed by soldering so as to lead to the

By the way, soldering of the external lead member to the external electrode of the condenser tinop is performed, for example, as follows.

That is, first, external lead members fixed to a holder at regular intervals are mounted on a jig. Then, the capacitor chip is positioned between the ends of the pair of external lead members so that the external electrodes are in contact with the external lead members. In this state, each pair of external lead assembly is moved inward to sandwich the capacitor chip.

Next, while maintaining this state, the capacitor knob and jig are immersed in a molten solder bath controlled at 280 to 250°C for 2 to 5 seconds and pulled up to solder the external lead member to the external electrode. is being carried out.

However, when the capacitor chip and the jig are immersed in the molten solder bath, the solder temperature of the molten solder bath decreases due to the heat absorption effect of the jig, and the temperature decreases when the external lead member is soldered to the external electrode of the capacitor chip. This is a serious problem in mass production, as it takes a long time and significantly reduces workability.

Therefore, conventionally, even if the solder temperature drops due to immersion of the jig, the soldering temperature is set at a high enough temperature that no problem occurs in soldering. Such temperature control significantly improves the soldering properties of the external lead member to the external electrode, and eliminates problems in mass production.

However, by increasing the solder temperature in the molten solder bath, surface oxidation of the molten solder is significantly accelerated, which increases the amount of solder parts used more than necessary, which has a considerable negative impact on costs. Not only this, but also the thermal shock when the capacitor chip is immersed in the molten solder bath becomes extremely large, and the capacitor characteristics are likely to be impaired due to cracks and the like.

In particular, thermal shock can be mitigated against deterioration of capacitor characteristics by preheating the condenser/reach knob to a temperature difference within about 100°C before immersing it in a molten solder bath. A new heating device is required, and the process becomes complicated, which is undesirable.

For this purpose, the applicant previously filed a patent application No. 57-198640.
In the specification of this issue, we proposed a method for manufacturing electronic components, mainly a method for soldering external lead members to external electrodes in laminated semi-conductors and capacitors.

Specifically, after applying a paste-like solder material to the tip of the external lead member and drying it, the capacitor chip is held between the external lead member via the solder member, and in this state, the solder member is heated through heat treatment. The external lead member is melted and soldered to the external electrode of the capacitor chip.

According to this method, there is no thermal shock to the capacitor chip when it is immersed in the molten solder bath, so it is possible to effectively prevent the deterioration of capacitor characteristics caused by cracks, scratches, etc. The effect of ensuring reliable soldering of the external lead member to the external electrode without the problem of a drop in solder temperature can be expected.

[Problem that the invention seeks to solve]

However, in the above-mentioned technique, the solder member is attached to the outer lead member by dipping the outer lead member into a paste-like solder member and pulling it up. The amount of solder deposited largely depends on the viscosity of the solder material. For example, if the viscosity of the resin is high, the amount of adhesion will increase, and although it is possible to reliably solder the external lead part to the capacitor chip, the external form of the resin material may collapse or the size may increase. A problem occurs. On the other hand, if the viscosity is low, the amount of adhesion will be small, and the solderability of the external lead member to the capacitor chip will be reduced, making open defects more likely to occur during mounting on a printed board.

Moreover, since the solder material attached to the external lead member tends to be approximately spherical, if the capacitor chip is held between the external lead member, the stability of the holding state will be impaired. For this reason, a problem arises in that the capacitor tie is twisted and soldered to the external lead member, thereby damaging the exterior form.

Therefore, an object of the present invention is to be able to stabilize the amount of external lead members used when soldering them to a component body, and to
It is an object of the present invention to provide a method for manufacturing an electronic component that can also improve the ability to hold a component body by an external lead member.

[Means to solve the problem]

Therefore, in order to achieve such an object, the present invention includes the steps of: inserting the tip of an external lead member into a pipe-shaped solder member, and fixing the solder member to the external lead member;
A step of clamping a component body having external electrodes at both ends with an external lead member such that a solder member is interposed between the external electrode and the external lead assembly, and at least a portion of the component body held by the external lead member. This method utilizes a process in which the solder member is melted by heating and the external lead member is soldered to the external electrode of the component body.

[Effect]

According to this invention, a pipe-shaped solder member of a certain length is inserted and fixed at the tip of the external lead member, and then the component body is held between the external lead members and heat-treated.
Not only can the stability of the clamping state of the component body by the external lead member be improved, but also the soldering state of the external lead member to the external electrode can be made uniform.

〔Example〕

Next, an example of application of the present invention to a multilayer □ ceramic capacitor will be described with reference to FIGS. 1 to 5.

As shown in FIG. 1, a pipe-shaped solder member 3 of a certain length is inserted and crimped into the tip 2a of the external lead member 2 integrated with the holder 1 at a certain interval. Next, as shown in FIG. 2, the two holders 1.1 are overlapped, and the capacitor chip (component main body) 4 is positioned between the tips 2 (2, 212) of the external lead member 2.2. , the holder 1 is slid slightly and the capacitor chip 4 is held between the tips 2a, 2a.
is constructed by disposing internal electrodes 6 between a plurality of ceramic layers 5, and forming external electrodes 7, 7 on the exposed end surfaces of the internal electrodes 6. In this state, the capacitor chip 4 is immersed in a Fufunox tank (not shown) and pulled up.

Next, as shown in Figure 3, these clamping structures were heated to 250°C.
When inserted into a heating furnace (not shown) whose temperature is controlled, the solder member 3 is melted, and the tip 2a of the external lead member 2 and the external chamber FM7 are soldered (3'). Then, the capacitor chip 4 is immersed in an organic solvent.

Remove dirt, etc. Next, as shown in FIG. 4, the circumferential surface of the capacitor chip 4 is covered with a resin material 8. Then, by cutting from the outer side of the lead member 2.2-qx-x, the laminated ceramic capacitor shown in FIG. 5 is obtained.

According to this embodiment, since the capacitor chip 4 is clamped by the external lead member 2.2 whose tip 2a is inserted and fixed into the pipe-shaped solder member 3, the stability of the clamping state can be improved. It is possible to reduce the incidence of appearance defects due to misalignment.

Further, since the solder member 8 is set to a constant length corresponding to the required amount, the utilization rate of the solder member 8 can be significantly increased compared to conventional molten solder.

FIG. 6 explains another method of attaching a solder member to an external lead member according to the present invention, in which a pipe-shaped solder member 3 is fixed to a holder 9 at the same pitch as the external lead member 2, This solder member 3 is attached to the tip 2 of the external lead member 2.
a, and insert the tip 2a into the solder member 3 by a certain length by moving it in one or both directions, and cut it from the Y-Y portion. According to this embodiment, the tip 2a is moved to either one or both of the solder members 3 External lead member 2
Multiple insertions can be performed at once, further improving mass productivity.

〔Effect of the invention〕

As described above, according to the present invention, a pipe-shaped semi-I11 member of a certain length corresponding to the required amount is inserted into the tip of the external lead member, so that when connecting with the component body, the solder member Not only can the utilization rate be significantly improved, but also the connection of the external lead member to the component body can be reliably achieved, and furthermore, defects in the exterior form due to misalignment of the external lead member with respect to the component body can be reduced.

In addition, in the present invention, the electronic component can be applied to general capacitors, resistors, varistors, etc. in addition to the laminated ceramic rift capacitor, and the solder member can also contain Fufusokunu in advance.

[Brief explanation of drawings]

The figures are explanatory diagrams of the method of the present invention, in which Fig. 1 is a front sectional view showing a state in which a solder member is fixed to an external lead member, and Fig. 2 is a front sectional view showing a state in which a component body is held by the external lead member. , FIG. 8 is a front sectional view showing the heated and melted state of the solder member,
FIG. 4 is a front sectional view showing the exterior state, FIG. 5 is a front sectional view showing the completed state, and FIG. 6 is a front sectional view illustrating another method of fixing the solder member to the external lead member. In the figure, 2 is an external lead member, 2a is a tip, 8 is a pipe-shaped solder member, 4 is a component body (capacitor chip), and 7
is the external electrode. Figure 1] Figure 2/b6 Figure 3 Figure 4 Figure 5 Figure 6]

Claims (1)

[Claims] (1+ step of inserting the tip of the external lead member into the pipe-shaped solder member and fixing the solder member to the external lead member; , a step of clamping the external electrode and the external lead member so that the solder member is interposed between the external electrode and the external lead member, and melting the solder member by heating at least the clamping portion of the component body by the row lead member; A method for manufacturing an electronic component, comprising the step of soldering a lead member to a column electrode of a component body. (2) Inserting an external lead member into a pipe-shaped solder member, and attaching the solder member to an external lead. A method for manufacturing an electronic component according to claim 1, characterized in that the electronic component is fixed to a member by crimping or welding. (3) Claim characterized in that the solder portion H contains flux. 2. A method for producing a 'snow-treated' product according to items 1 and 2.