JPH0141035B2 - - Google Patents
Info
- Publication number
- JPH0141035B2 JPH0141035B2 JP7935582A JP7935582A JPH0141035B2 JP H0141035 B2 JPH0141035 B2 JP H0141035B2 JP 7935582 A JP7935582 A JP 7935582A JP 7935582 A JP7935582 A JP 7935582A JP H0141035 B2 JPH0141035 B2 JP H0141035B2
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- brazing
- brazing material
- cut
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7935582A JPS58196043A (ja) | 1982-05-12 | 1982-05-12 | ろうつきリ−ドピンの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7935582A JPS58196043A (ja) | 1982-05-12 | 1982-05-12 | ろうつきリ−ドピンの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58196043A JPS58196043A (ja) | 1983-11-15 |
| JPH0141035B2 true JPH0141035B2 (enrdf_load_stackoverflow) | 1989-09-01 |
Family
ID=13687588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7935582A Granted JPS58196043A (ja) | 1982-05-12 | 1982-05-12 | ろうつきリ−ドピンの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58196043A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2685559B2 (ja) * | 1988-12-28 | 1997-12-03 | 株式会社徳力本店 | ろう材付リードピンの製造方法およびその製造装置 |
-
1982
- 1982-05-12 JP JP7935582A patent/JPS58196043A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58196043A (ja) | 1983-11-15 |
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