JPS58195435U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS58195435U JPS58195435U JP9156082U JP9156082U JPS58195435U JP S58195435 U JPS58195435 U JP S58195435U JP 9156082 U JP9156082 U JP 9156082U JP 9156082 U JP9156082 U JP 9156082U JP S58195435 U JPS58195435 U JP S58195435U
- Authority
- JP
- Japan
- Prior art keywords
- section
- semiconductor chip
- solder
- semiconductor equipment
- chip bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9156082U JPS58195435U (ja) | 1982-06-21 | 1982-06-21 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9156082U JPS58195435U (ja) | 1982-06-21 | 1982-06-21 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58195435U true JPS58195435U (ja) | 1983-12-26 |
JPH0222989Y2 JPH0222989Y2 (enrdf_load_stackoverflow) | 1990-06-21 |
Family
ID=30221567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9156082U Granted JPS58195435U (ja) | 1982-06-21 | 1982-06-21 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58195435U (enrdf_load_stackoverflow) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS548462A (en) * | 1977-06-21 | 1979-01-22 | Nec Home Electronics Ltd | Manufacture for semiconductor |
JPS5517488A (en) * | 1978-07-25 | 1980-02-06 | Sharp Corp | Electronic watch having another clock function |
JPS5753948A (ja) * | 1980-09-17 | 1982-03-31 | Toshiba Corp | Handotaisoshinomauntohoho |
-
1982
- 1982-06-21 JP JP9156082U patent/JPS58195435U/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS548462A (en) * | 1977-06-21 | 1979-01-22 | Nec Home Electronics Ltd | Manufacture for semiconductor |
JPS5517488A (en) * | 1978-07-25 | 1980-02-06 | Sharp Corp | Electronic watch having another clock function |
JPS5753948A (ja) * | 1980-09-17 | 1982-03-31 | Toshiba Corp | Handotaisoshinomauntohoho |
Also Published As
Publication number | Publication date |
---|---|
JPH0222989Y2 (enrdf_load_stackoverflow) | 1990-06-21 |
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