JPS58189371A - スパツタ装置 - Google Patents

スパツタ装置

Info

Publication number
JPS58189371A
JPS58189371A JP7024682A JP7024682A JPS58189371A JP S58189371 A JPS58189371 A JP S58189371A JP 7024682 A JP7024682 A JP 7024682A JP 7024682 A JP7024682 A JP 7024682A JP S58189371 A JPS58189371 A JP S58189371A
Authority
JP
Japan
Prior art keywords
targets
target
substrate
opposing
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7024682A
Other languages
English (en)
Japanese (ja)
Other versions
JPH034621B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Sadao Kadokura
貞夫 門倉
Kazuhiko Honjo
和彦 本庄
Masahiko Naoe
直江　正彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teijin Ltd
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Priority to JP7024682A priority Critical patent/JPS58189371A/ja
Publication of JPS58189371A publication Critical patent/JPS58189371A/ja
Publication of JPH034621B2 publication Critical patent/JPH034621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
JP7024682A 1982-04-28 1982-04-28 スパツタ装置 Granted JPS58189371A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7024682A JPS58189371A (ja) 1982-04-28 1982-04-28 スパツタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7024682A JPS58189371A (ja) 1982-04-28 1982-04-28 スパツタ装置

Publications (2)

Publication Number Publication Date
JPS58189371A true JPS58189371A (ja) 1983-11-05
JPH034621B2 JPH034621B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-01-23

Family

ID=13426010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7024682A Granted JPS58189371A (ja) 1982-04-28 1982-04-28 スパツタ装置

Country Status (1)

Country Link
JP (1) JPS58189371A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953680A (ja) * 1982-09-21 1984-03-28 Teijin Ltd スパツタ装置
JPS61270369A (ja) * 1985-05-23 1986-11-29 Nec Corp 三極スパツタリングソ−ス
US4841908A (en) * 1986-06-23 1989-06-27 Minnesota Mining And Manufacturing Company Multi-chamber deposition system
JPH024964A (ja) * 1988-06-23 1990-01-09 Teijin Ltd 対向ターゲット式スパッタ装置
US5053625A (en) * 1988-08-04 1991-10-01 Minnesota Mining And Manufacturing Company Surface characterization apparatus and method
JP2008156743A (ja) * 2006-11-30 2008-07-10 Kobe Steel Ltd 対向ターゲットスパッタ装置及び対向ターゲットスパッタ方法
DE102008029379A1 (de) * 2008-06-23 2009-08-13 Von Ardenne Anlagentechnik Gmbh Anordnung zum Beschichten bandförmiger Foliensubstrate
EP3438322A4 (en) * 2016-03-30 2020-02-26 Keihin Ramtech Co., Ltd. SPUTTER CATHODE, SPUTTER DEVICE AND METHOD FOR PRODUCING A FILM SHAPED BODY

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS573831A (en) * 1980-06-10 1982-01-09 Matsushita Electric Ind Co Ltd Vacuum metallizing method
JPS5743986A (en) * 1980-08-30 1982-03-12 Shimadzu Corp Film forming apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS573831A (en) * 1980-06-10 1982-01-09 Matsushita Electric Ind Co Ltd Vacuum metallizing method
JPS5743986A (en) * 1980-08-30 1982-03-12 Shimadzu Corp Film forming apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953680A (ja) * 1982-09-21 1984-03-28 Teijin Ltd スパツタ装置
JPS61270369A (ja) * 1985-05-23 1986-11-29 Nec Corp 三極スパツタリングソ−ス
US4841908A (en) * 1986-06-23 1989-06-27 Minnesota Mining And Manufacturing Company Multi-chamber deposition system
JPH024964A (ja) * 1988-06-23 1990-01-09 Teijin Ltd 対向ターゲット式スパッタ装置
US5053625A (en) * 1988-08-04 1991-10-01 Minnesota Mining And Manufacturing Company Surface characterization apparatus and method
JP2008156743A (ja) * 2006-11-30 2008-07-10 Kobe Steel Ltd 対向ターゲットスパッタ装置及び対向ターゲットスパッタ方法
DE102008029379A1 (de) * 2008-06-23 2009-08-13 Von Ardenne Anlagentechnik Gmbh Anordnung zum Beschichten bandförmiger Foliensubstrate
EP3438322A4 (en) * 2016-03-30 2020-02-26 Keihin Ramtech Co., Ltd. SPUTTER CATHODE, SPUTTER DEVICE AND METHOD FOR PRODUCING A FILM SHAPED BODY

Also Published As

Publication number Publication date
JPH034621B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-01-23

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