JPS58189370A - スパツタ装置 - Google Patents

スパツタ装置

Info

Publication number
JPS58189370A
JPS58189370A JP7024582A JP7024582A JPS58189370A JP S58189370 A JPS58189370 A JP S58189370A JP 7024582 A JP7024582 A JP 7024582A JP 7024582 A JP7024582 A JP 7024582A JP S58189370 A JPS58189370 A JP S58189370A
Authority
JP
Japan
Prior art keywords
target
sputtering
magnetic field
magnetic
generating means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7024582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6343465B2 (enExample
Inventor
Sadao Kadokura
貞夫 門倉
Kazuhiko Honjo
和彦 本庄
Masahiko Naoe
直江　正彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teijin Ltd
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Priority to JP7024582A priority Critical patent/JPS58189370A/ja
Publication of JPS58189370A publication Critical patent/JPS58189370A/ja
Publication of JPS6343465B2 publication Critical patent/JPS6343465B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP7024582A 1982-04-28 1982-04-28 スパツタ装置 Granted JPS58189370A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7024582A JPS58189370A (ja) 1982-04-28 1982-04-28 スパツタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7024582A JPS58189370A (ja) 1982-04-28 1982-04-28 スパツタ装置

Publications (2)

Publication Number Publication Date
JPS58189370A true JPS58189370A (ja) 1983-11-05
JPS6343465B2 JPS6343465B2 (enExample) 1988-08-30

Family

ID=13425982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7024582A Granted JPS58189370A (ja) 1982-04-28 1982-04-28 スパツタ装置

Country Status (1)

Country Link
JP (1) JPS58189370A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103014632A (zh) * 2011-09-26 2013-04-03 中国科学院金属研究所 一种电弧离子镀铁磁性复合结构靶材及其应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5347384A (en) * 1976-10-13 1978-04-27 Nec Corp Sputtering apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5347384A (en) * 1976-10-13 1978-04-27 Nec Corp Sputtering apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103014632A (zh) * 2011-09-26 2013-04-03 中国科学院金属研究所 一种电弧离子镀铁磁性复合结构靶材及其应用
CN103014632B (zh) * 2011-09-26 2015-12-09 中国科学院金属研究所 一种电弧离子镀铁磁性复合结构靶材及其应用

Also Published As

Publication number Publication date
JPS6343465B2 (enExample) 1988-08-30

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