JPS58184745A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58184745A
JPS58184745A JP57067378A JP6737882A JPS58184745A JP S58184745 A JPS58184745 A JP S58184745A JP 57067378 A JP57067378 A JP 57067378A JP 6737882 A JP6737882 A JP 6737882A JP S58184745 A JPS58184745 A JP S58184745A
Authority
JP
Japan
Prior art keywords
resin
amorphous silica
cooling fin
semiconductor
silica grains
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57067378A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6322622B2 (cg-RX-API-DMAC7.html
Inventor
Isao Suzuki
功 鈴木
Masami Fujii
藤井　正己
Satoshi Mikami
三上　訓
Ryuichiro Sakai
酒井　隆一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57067378A priority Critical patent/JPS58184745A/ja
Publication of JPS58184745A publication Critical patent/JPS58184745A/ja
Publication of JPS6322622B2 publication Critical patent/JPS6322622B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57067378A 1982-04-23 1982-04-23 半導体装置 Granted JPS58184745A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57067378A JPS58184745A (ja) 1982-04-23 1982-04-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57067378A JPS58184745A (ja) 1982-04-23 1982-04-23 半導体装置

Publications (2)

Publication Number Publication Date
JPS58184745A true JPS58184745A (ja) 1983-10-28
JPS6322622B2 JPS6322622B2 (cg-RX-API-DMAC7.html) 1988-05-12

Family

ID=13343285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57067378A Granted JPS58184745A (ja) 1982-04-23 1982-04-23 半導体装置

Country Status (1)

Country Link
JP (1) JPS58184745A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057955A (ja) * 1983-09-09 1985-04-03 Internatl Rectifier Corp Japan Ltd 半導体装置の製造方法
WO2013100172A1 (ja) * 2011-12-27 2013-07-04 パナソニック株式会社 熱伝導性樹脂組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54181877U (cg-RX-API-DMAC7.html) * 1978-06-13 1979-12-22
JPS5621448U (cg-RX-API-DMAC7.html) * 1979-07-25 1981-02-25

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54181877U (cg-RX-API-DMAC7.html) * 1978-06-13 1979-12-22
JPS5621448U (cg-RX-API-DMAC7.html) * 1979-07-25 1981-02-25

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057955A (ja) * 1983-09-09 1985-04-03 Internatl Rectifier Corp Japan Ltd 半導体装置の製造方法
WO2013100172A1 (ja) * 2011-12-27 2013-07-04 パナソニック株式会社 熱伝導性樹脂組成物
JPWO2013100172A1 (ja) * 2011-12-27 2015-05-11 パナソニックＩｐマネジメント株式会社 熱伝導性樹脂組成物

Also Published As

Publication number Publication date
JPS6322622B2 (cg-RX-API-DMAC7.html) 1988-05-12

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