JPS58182846A - 半導体基板の移替え装置 - Google Patents

半導体基板の移替え装置

Info

Publication number
JPS58182846A
JPS58182846A JP6821582A JP6821582A JPS58182846A JP S58182846 A JPS58182846 A JP S58182846A JP 6821582 A JP6821582 A JP 6821582A JP 6821582 A JP6821582 A JP 6821582A JP S58182846 A JPS58182846 A JP S58182846A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
cassette
transfer
semiconductor substrates
transferring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6821582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6242380B2 (enrdf_load_stackoverflow
Inventor
Yoichi Mido
御堂　洋一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6821582A priority Critical patent/JPS58182846A/ja
Publication of JPS58182846A publication Critical patent/JPS58182846A/ja
Publication of JPS6242380B2 publication Critical patent/JPS6242380B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP6821582A 1982-04-21 1982-04-21 半導体基板の移替え装置 Granted JPS58182846A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6821582A JPS58182846A (ja) 1982-04-21 1982-04-21 半導体基板の移替え装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6821582A JPS58182846A (ja) 1982-04-21 1982-04-21 半導体基板の移替え装置

Publications (2)

Publication Number Publication Date
JPS58182846A true JPS58182846A (ja) 1983-10-25
JPS6242380B2 JPS6242380B2 (enrdf_load_stackoverflow) 1987-09-08

Family

ID=13367347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6821582A Granted JPS58182846A (ja) 1982-04-21 1982-04-21 半導体基板の移替え装置

Country Status (1)

Country Link
JP (1) JPS58182846A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61247047A (ja) * 1985-04-24 1986-11-04 Mitsubishi Electric Corp 円板状部材の整列装置
WO1987006566A1 (en) * 1986-04-22 1987-11-05 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus
US5098744A (en) * 1987-06-18 1992-03-24 Viking Corp. Method for cleaning metallic wheels
US5255792A (en) * 1990-10-22 1993-10-26 Hmt Technology Corporation Method and apparatus for sorting disks depending upon their thickness
US5291696A (en) * 1987-06-18 1994-03-08 Viking Corp. Apparatus for cleaning metallic wheels
EP0606655A1 (en) * 1993-01-14 1994-07-20 Applied Materials, Inc. Direct load/unload semiconductor wafer cassette apparatus and transfer system
US6961639B2 (en) 2002-01-29 2005-11-01 Recif, Societe Anonyme Apparatus and process for identification of characters inscribed on a semiconductor wafer containing an orientation mark
US7108476B2 (en) 1998-05-05 2006-09-19 Recif Technologies Sas Method and device for changing a semiconductor wafer position

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02108481U (enrdf_load_stackoverflow) * 1989-02-16 1990-08-29

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61247047A (ja) * 1985-04-24 1986-11-04 Mitsubishi Electric Corp 円板状部材の整列装置
WO1987006566A1 (en) * 1986-04-22 1987-11-05 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus
US4806057A (en) * 1986-04-22 1989-02-21 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus
US5098744A (en) * 1987-06-18 1992-03-24 Viking Corp. Method for cleaning metallic wheels
US5291696A (en) * 1987-06-18 1994-03-08 Viking Corp. Apparatus for cleaning metallic wheels
US5255792A (en) * 1990-10-22 1993-10-26 Hmt Technology Corporation Method and apparatus for sorting disks depending upon their thickness
EP0606655A1 (en) * 1993-01-14 1994-07-20 Applied Materials, Inc. Direct load/unload semiconductor wafer cassette apparatus and transfer system
US5387067A (en) * 1993-01-14 1995-02-07 Applied Materials, Inc. Direct load/unload semiconductor wafer cassette apparatus and transfer system
US7108476B2 (en) 1998-05-05 2006-09-19 Recif Technologies Sas Method and device for changing a semiconductor wafer position
US6961639B2 (en) 2002-01-29 2005-11-01 Recif, Societe Anonyme Apparatus and process for identification of characters inscribed on a semiconductor wafer containing an orientation mark

Also Published As

Publication number Publication date
JPS6242380B2 (enrdf_load_stackoverflow) 1987-09-08

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