JPS58178545A - リ−ドフレ−ム - Google Patents

リ−ドフレ−ム

Info

Publication number
JPS58178545A
JPS58178545A JP57061477A JP6147782A JPS58178545A JP S58178545 A JPS58178545 A JP S58178545A JP 57061477 A JP57061477 A JP 57061477A JP 6147782 A JP6147782 A JP 6147782A JP S58178545 A JPS58178545 A JP S58178545A
Authority
JP
Japan
Prior art keywords
external lead
wirings
lead frame
lead
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57061477A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0463543B2 (enExample
Inventor
Sekiya Marutsuka
丸塚　碩也
Ryosuke Hosobane
細羽　良弼
Eiichi Tsunashima
瑛一 綱島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP57061477A priority Critical patent/JPS58178545A/ja
Publication of JPS58178545A publication Critical patent/JPS58178545A/ja
Publication of JPH0463543B2 publication Critical patent/JPH0463543B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57061477A 1982-04-12 1982-04-12 リ−ドフレ−ム Granted JPS58178545A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57061477A JPS58178545A (ja) 1982-04-12 1982-04-12 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57061477A JPS58178545A (ja) 1982-04-12 1982-04-12 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS58178545A true JPS58178545A (ja) 1983-10-19
JPH0463543B2 JPH0463543B2 (enExample) 1992-10-12

Family

ID=13172179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57061477A Granted JPS58178545A (ja) 1982-04-12 1982-04-12 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS58178545A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862246A (en) * 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
US5075760A (en) * 1988-01-18 1991-12-24 Texas Instruments Incorporated Semiconductor device package assembly employing flexible tape

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5286365U (enExample) * 1975-12-24 1977-06-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5286365U (enExample) * 1975-12-24 1977-06-28

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862246A (en) * 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
US5075760A (en) * 1988-01-18 1991-12-24 Texas Instruments Incorporated Semiconductor device package assembly employing flexible tape

Also Published As

Publication number Publication date
JPH0463543B2 (enExample) 1992-10-12

Similar Documents

Publication Publication Date Title
US4984059A (en) Semiconductor device and a method for fabricating the same
KR100294719B1 (ko) 수지밀봉형 반도체장치 및 그 제조방법, 리드프레임
US5373188A (en) Packaged semiconductor device including multiple semiconductor chips and cross-over lead
US5800958A (en) Electrically enhanced power quad flat pack arrangement
US4774635A (en) Semiconductor package with high density I/O lead connection
KR100226737B1 (ko) 반도체소자 적층형 반도체 패키지
KR100328143B1 (ko) 계층화된 도전 평면을 갖는 리드 프레임
US5563443A (en) Packaged semiconductor device utilizing leadframe attached on a semiconductor chip
JPH11150225A (ja) リードフレームベースの垂直相互接続パッケージ
US6791166B1 (en) Stackable lead frame package using exposed internal lead traces
US6686651B1 (en) Multi-layer leadframe structure
JPS5998543A (ja) 半導体装置
USRE36894E (en) Semiconductor package with high density I/O lead connection
JPS58178545A (ja) リ−ドフレ−ム
JP2691799B2 (ja) リードフレームに接合された介在ダイ取付基板を有する集積回路パッケージ設計
JPH0517709B2 (enExample)
JPS63146453A (ja) 半導体パツケ−ジおよびその製造方法
JP3053013B2 (ja) 半導体集積回路装置
JPH0817960A (ja) Ｑｆｐ構造半導体装置
JPH07122701A (ja) 半導体装置およびその製造方法ならびにｐｇａ用リードフレーム
JPS62226649A (ja) ハイブリツド型半導体装置
CN111341748B (zh) 选择性图案镀层的引线框
JPS6112053A (ja) リ−ドフレ−ム
JP2883065B2 (ja) 半導体装置
JPH0750315A (ja) 半導体装置の実装方法