JPH0463543B2 - - Google Patents
Info
- Publication number
- JPH0463543B2 JPH0463543B2 JP57061477A JP6147782A JPH0463543B2 JP H0463543 B2 JPH0463543 B2 JP H0463543B2 JP 57061477 A JP57061477 A JP 57061477A JP 6147782 A JP6147782 A JP 6147782A JP H0463543 B2 JPH0463543 B2 JP H0463543B2
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- lead frame
- resin
- lead
- flexible insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/453—Leadframes comprising flexible metallic tapes
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57061477A JPS58178545A (ja) | 1982-04-12 | 1982-04-12 | リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57061477A JPS58178545A (ja) | 1982-04-12 | 1982-04-12 | リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58178545A JPS58178545A (ja) | 1983-10-19 |
| JPH0463543B2 true JPH0463543B2 (enExample) | 1992-10-12 |
Family
ID=13172179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57061477A Granted JPS58178545A (ja) | 1982-04-12 | 1982-04-12 | リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58178545A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4862246A (en) * | 1984-09-26 | 1989-08-29 | Hitachi, Ltd. | Semiconductor device lead frame with etched through holes |
| JPH01183837A (ja) * | 1988-01-18 | 1989-07-21 | Texas Instr Japan Ltd | 半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5286365U (enExample) * | 1975-12-24 | 1977-06-28 |
-
1982
- 1982-04-12 JP JP57061477A patent/JPS58178545A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58178545A (ja) | 1983-10-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4774635A (en) | Semiconductor package with high density I/O lead connection | |
| US6482674B1 (en) | Semiconductor package having metal foil die mounting plate | |
| US5646831A (en) | Electrically enhanced power quad flat pack arrangement | |
| US4984059A (en) | Semiconductor device and a method for fabricating the same | |
| KR100294719B1 (ko) | 수지밀봉형 반도체장치 및 그 제조방법, 리드프레임 | |
| KR100226737B1 (ko) | 반도체소자 적층형 반도체 패키지 | |
| CN100414696C (zh) | 引线框及制造方法以及树脂密封型半导体器件及制造方法 | |
| US4903114A (en) | Resin-molded semiconductor | |
| EP0503769B1 (en) | Lead frame and resin sealed semiconductor device using the same | |
| US4987474A (en) | Semiconductor device and method of manufacturing the same | |
| KR920001689A (ko) | 반도체장치 및 그 제조방법 | |
| US5929513A (en) | Semiconductor device and heat sink used therein | |
| CN100527393C (zh) | 电路装置及其制造方法 | |
| US5296737A (en) | Semiconductor device with a plurality of face to face chips | |
| US6686651B1 (en) | Multi-layer leadframe structure | |
| JPS5998543A (ja) | 半導体装置 | |
| USRE36894E (en) | Semiconductor package with high density I/O lead connection | |
| JPH0463543B2 (enExample) | ||
| EP0474224B1 (en) | Semiconductor device comprising a plurality of semiconductor chips | |
| JP2691799B2 (ja) | リードフレームに接合された介在ダイ取付基板を有する集積回路パッケージ設計 | |
| JP2524482B2 (ja) | Qfp構造半導体装置 | |
| JPH0517709B2 (enExample) | ||
| JP3211116B2 (ja) | 電子部品及びそのモジュール構造 | |
| JPH07122701A (ja) | 半導体装置およびその製造方法ならびにpga用リードフレーム | |
| KR950003904B1 (ko) | 반도체 패키지 |