JPS58174568A - 金属化合物被膜の形成方法 - Google Patents
金属化合物被膜の形成方法Info
- Publication number
- JPS58174568A JPS58174568A JP5723882A JP5723882A JPS58174568A JP S58174568 A JPS58174568 A JP S58174568A JP 5723882 A JP5723882 A JP 5723882A JP 5723882 A JP5723882 A JP 5723882A JP S58174568 A JPS58174568 A JP S58174568A
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- vapor deposition
- metal compound
- film
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000002736 metal compounds Chemical class 0.000 title claims description 13
- 230000015572 biosynthetic process Effects 0.000 title description 3
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 239000007789 gas Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000012495 reaction gas Substances 0.000 claims description 2
- 239000007795 chemical reaction product Substances 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 8
- 238000010891 electric arc Methods 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 5
- 239000001257 hydrogen Substances 0.000 abstract description 5
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 5
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 150000004767 nitrides Chemical class 0.000 abstract description 4
- 239000000919 ceramic Substances 0.000 abstract description 3
- 229910001507 metal halide Inorganic materials 0.000 abstract description 2
- 150000005309 metal halides Chemical class 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 238000007740 vapor deposition Methods 0.000 abstract 3
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/503—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using DC or AC discharges
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5723882A JPS58174568A (ja) | 1982-04-08 | 1982-04-08 | 金属化合物被膜の形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5723882A JPS58174568A (ja) | 1982-04-08 | 1982-04-08 | 金属化合物被膜の形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58174568A true JPS58174568A (ja) | 1983-10-13 |
JPS6134507B2 JPS6134507B2 (enrdf_load_stackoverflow) | 1986-08-08 |
Family
ID=13049944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5723882A Granted JPS58174568A (ja) | 1982-04-08 | 1982-04-08 | 金属化合物被膜の形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58174568A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62294160A (ja) * | 1986-06-13 | 1987-12-21 | バルツエルス アクチエンゲゼルシヤフト | 反応性気体プラズマ中での材料の熱化学的表面処理方法 |
CN113235069A (zh) * | 2021-05-11 | 2021-08-10 | 中国石油天然气集团有限公司 | 一种抗腐蚀的氮化钛耐磨涂层及其制备方法和包含该涂层的制品 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0722339A (ja) * | 1993-07-05 | 1995-01-24 | Toshiba Corp | 薄膜形成方法 |
JPH0719865U (ja) * | 1993-08-20 | 1995-04-07 | 日本コロムビア株式会社 | ディスク収納装置 |
-
1982
- 1982-04-08 JP JP5723882A patent/JPS58174568A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62294160A (ja) * | 1986-06-13 | 1987-12-21 | バルツエルス アクチエンゲゼルシヤフト | 反応性気体プラズマ中での材料の熱化学的表面処理方法 |
CN113235069A (zh) * | 2021-05-11 | 2021-08-10 | 中国石油天然气集团有限公司 | 一种抗腐蚀的氮化钛耐磨涂层及其制备方法和包含该涂层的制品 |
Also Published As
Publication number | Publication date |
---|---|
JPS6134507B2 (enrdf_load_stackoverflow) | 1986-08-08 |
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