JPS58170847U - 放熱フイン付き混成集積回路の構造 - Google Patents

放熱フイン付き混成集積回路の構造

Info

Publication number
JPS58170847U
JPS58170847U JP1982066777U JP6677782U JPS58170847U JP S58170847 U JPS58170847 U JP S58170847U JP 1982066777 U JP1982066777 U JP 1982066777U JP 6677782 U JP6677782 U JP 6677782U JP S58170847 U JPS58170847 U JP S58170847U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation fins
integrated circuit
board
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982066777U
Other languages
English (en)
Japanese (ja)
Other versions
JPS638142Y2 (enrdf_load_stackoverflow
Inventor
小崎　良一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1982066777U priority Critical patent/JPS58170847U/ja
Publication of JPS58170847U publication Critical patent/JPS58170847U/ja
Application granted granted Critical
Publication of JPS638142Y2 publication Critical patent/JPS638142Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1982066777U 1982-05-08 1982-05-08 放熱フイン付き混成集積回路の構造 Granted JPS58170847U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982066777U JPS58170847U (ja) 1982-05-08 1982-05-08 放熱フイン付き混成集積回路の構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982066777U JPS58170847U (ja) 1982-05-08 1982-05-08 放熱フイン付き混成集積回路の構造

Publications (2)

Publication Number Publication Date
JPS58170847U true JPS58170847U (ja) 1983-11-15
JPS638142Y2 JPS638142Y2 (enrdf_load_stackoverflow) 1988-03-10

Family

ID=30076629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982066777U Granted JPS58170847U (ja) 1982-05-08 1982-05-08 放熱フイン付き混成集積回路の構造

Country Status (1)

Country Link
JP (1) JPS58170847U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS638142Y2 (enrdf_load_stackoverflow) 1988-03-10

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