JPS58165396A - Method of producing printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a method for manufacturing a printed board, and particularly to an improvement in a method for forming a conductor layer.

(2) Background of the technology When manufacturing printed circuit boards that constitute various electronic enclosures, the positions, dimensions, and wiring patterns of through holes are determined based on the circuit draft drawings, taking into consideration the components to be mounted, wiring paths, etc. The data regarding the through-holes and nine turns of the wiring are encoded and recorded on a drill tape and a connection tape made of cassette tape or magnetic tape. Using this drill tape, a numerical control device 2) Printed circuit board (pot-strapped laminate board) K through-holes are punched, and a connection tape is used to create a negative film for forming a wiring pattern on the numerical control device. Wiring nocturne on printed board Apply resist using aI/f turn mask, etching 1! !
It is formed through force.

(3) Conventional technology and problems In the conventional printed circuit board manufacturing method, electrochemical processing such as through-hole plating processing to form a conductor layer in through-hole portions or rounding etching processing to form a conductor layer for no-turn wiring is performed. There are nine problems with pollution caused by harmful wastewater.

(4) - Purpose of the invention The present invention has been made in view of the above points, and is a method for manufacturing a printed circuit board in which conductor layers in through-hole portions and wiring pattern portions can be formed without performing electrical green treatment. The purpose is to provide.

(5) Structure of the Invention In order to achieve this object, in the printed board manufacturing apparatus according to the present invention, a conductor layer on the inner surface of the through-hole and a conductor on the through-hole land are formed by a conductor tube with seven runs fitted into the through-hole. A conductive circuit pattern is formed by forming a layer, forming a groove in advance on a printed circuit board according to the wiring pattern pattern, and placing a wire in the groove.

(6) Embodiments of the invention Examples of the invention will be explained below based on the drawings. FIG. 1 is a sectional view of a through-hole portion of a printed board using the method of the present invention. A conductor tube 18 having seven rungs 18 m is inserted from both sides of a through hole 17 of a printed circuit board 16 made of an insulating resin material such as glass epoxy. Top and bottom 29°4□18yu3. -1. -2.7 It is fixed. In this way, :, i□i□ body tube 18
A conductive layer on the inner surface of the through-hole 17 and a conductive layer on the through-hole land are formed. Note that the conductor tube 18 may be provided only on the upper side or the lower side. A groove is provided on the other side of the printed circuit board 16 in accordance with the wiring pattern thread path to be formed, and when a wire is placed in this groove, a wiring pattern is formed.

It is desirable that the cross-sectional shape of this groove 20 corresponds to the cross-sectional shape of the wiring wire 9, as shown in Figures 2 to 4. The connection between each wire 9 and the seven rungs 18m of the conductor tube 18 constituting the through-hole land or the connection between the wires is performed by welding or flat-hammering*.

FIG. 5 is a block diagram of a rounding device for mounting the conductor tube into a through hole according to the present invention.
is set. Through-holes are previously drilled at predetermined positions tK in this printed circuit board 16 using the aforementioned drill tape using a numerically controlled single plate. f-lint board 16
'-Conductor pipe press-fit mechanism at opposing positions 1° on both sides m + 2 b
will be provided. 3m and 3b are conductor tube housing cases, and 4 is a control circuit. A through-hole data signal is input to the interface 5 from the terminal A using a drill tape that records data such as the position and dimensions of the through-hole. Based on this through-hole data signal, a central control unit 8 having a read-only memory 6 and a random access memory 7 similar to a known numerical control unit controls the press-fitting of the conductor pipe via a digital output circuit 13. The diameter and pressing force are instructed to the control circuit 4, and the scooping conductor pipes to be press-fitted in the conductor pipe press-fitting mechanisms 2m and 2b are set, and the pressure of the press-fitting compressor (not shown) is set. In addition, the i4 motor 10 is driven via the digital output circuit 9 to drive the X-direction drive mechanism 11 and the Y-direction drive mechanism 12.
Move the y-table 1 and set the printed circuit board 16 in a predetermined position. The position of the XY table l and the set pressure input etc. are detected by a sensor (not shown), and this detection number 41 is sent to the central control pusher 8 via a digital input circuit 14.15.
feedback control. When the press-fitting pressure, setting of the conductor tube, and setting of the printed circuit board in the specified position are completed, the conductor tube □ is connected to the conductor tube press-fitting mechanism 2 m + 2
It is squeezed out from the pressout port at the tip of b and fits into the through hole 17 of the printed circuit board 16 as shown in FIG.

FIG. 6 shows an apparatus for forming grooves on a printed circuit board according to wiring patterns. /# of wiring pattern thread path, shape, etc.
The main turn data signal is inputted to the terminal A side interface 5 using the aforementioned connecting tape on which the turn R-Y is recorded. Based on this pattern data signal, the cutter 2
Similar to the apparatus shown in FIG. 5, grooves are automatically formed on the printed circuit board in accordance with the wiring lines based on the data signals of the connecting tape.

In order to form a wire on a cylinder substrate and embed the wire in a circular groove, use a cutter 2 in a device having a configuration similar to that shown in FIG.
Instead, a wire nozzle and wire cutter connected to a predetermined wire spool similar to a known wire spool can be provided, and the wire can be placed along the groove based on the data signal of the connecting tape.

(7) As described in detail of the invention, in the method for manufacturing a glint plate according to the present invention, the conductor layer on the inner surface of the through-hole and the conductor layer on the through-hole land are formed by fitting the flanged conductor tube into the through-hole. Since the conductor circuit pattern is formed by forming a conductor circuit pattern and placing wires along the grooves pre-prepared on the printed circuit board, there is no need for electrochemical processing processes such as plating and etching. Pollution problems will disappear. See you again! The formation of 9 turns by press-fitting L-shaped conductor pipes and wire arrangement can be performed automatically by a numerical control device using drill tape and connecting tape by preparing the specified conductor pipes and wires. I can,
In addition, a photomask forming process and the like are not required, and the efficiency of the print-manufacturing process is improved. ”:□“:Mountain:].

4. Brief explanation of the drawing: Vinegar.

FIG. 1 is a sectional view of a through-hole portion of a printed board using the method of the present invention, and FIGS. 2, 3, and 4 each show different shapes of wires and grooves of the printed board according to the present invention. A sectional view, FIG. 5 is a block diagram of a conductor tube press-fitting device according to the present invention, and FIG. 6 is a block diagram of a device for forming grooves in @4 printed board according to the present invention.

1...xy table, 2...cutter, 2m, 2b
...Conductor tube press-fitting mechanism, 4...Control circuit, 16...
Printed circuit board, 17... Through hole, 18... Conductor tube, 18m... Flange, 19... Wire, 20
···groove.

patent applicant Fujitsu Denso Co., Ltd. patent application agent ,1 patent attorney ! Ki Akira Patent attorney Kazuyuki Akane ,・□ Patent attorney... 1) Yukio Patent attorney Akira Yamaguchi

Claims (1)

[Claims] 1. Form a conductor layer on the inner surface of the through hole and a conductor layer on the through hole land using a conductor tube with 7 runs fitted into the through hole, form #1 on the printed circuit board in advance according to the wiring/f turn, and A method of manufacturing a printed board in which a conductor circuit glossy turn is formed by arranging wires.