JPS58162642U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58162642U
JPS58162642U JP1982058888U JP5888882U JPS58162642U JP S58162642 U JPS58162642 U JP S58162642U JP 1982058888 U JP1982058888 U JP 1982058888U JP 5888882 U JP5888882 U JP 5888882U JP S58162642 U JPS58162642 U JP S58162642U
Authority
JP
Japan
Prior art keywords
lead piece
semiconductor device
resin
rectangular parallelepiped
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982058888U
Other languages
English (en)
Japanese (ja)
Other versions
JPS635240Y2 (enrdf_load_stackoverflow
Inventor
川口　晃充
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP1982058888U priority Critical patent/JPS58162642U/ja
Publication of JPS58162642U publication Critical patent/JPS58162642U/ja
Application granted granted Critical
Publication of JPS635240Y2 publication Critical patent/JPS635240Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1982058888U 1982-04-22 1982-04-22 半導体装置 Granted JPS58162642U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982058888U JPS58162642U (ja) 1982-04-22 1982-04-22 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982058888U JPS58162642U (ja) 1982-04-22 1982-04-22 半導体装置

Publications (2)

Publication Number Publication Date
JPS58162642U true JPS58162642U (ja) 1983-10-29
JPS635240Y2 JPS635240Y2 (enrdf_load_stackoverflow) 1988-02-12

Family

ID=30069241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982058888U Granted JPS58162642U (ja) 1982-04-22 1982-04-22 半導体装置

Country Status (1)

Country Link
JP (1) JPS58162642U (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414659U (enrdf_load_stackoverflow) * 1977-07-01 1979-01-30
JPS5572065A (en) * 1978-11-25 1980-05-30 Mitsubishi Electric Corp Plastic-molded type semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414659U (enrdf_load_stackoverflow) * 1977-07-01 1979-01-30
JPS5572065A (en) * 1978-11-25 1980-05-30 Mitsubishi Electric Corp Plastic-molded type semiconductor device

Also Published As

Publication number Publication date
JPS635240Y2 (enrdf_load_stackoverflow) 1988-02-12

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