JPS58118742U - 集積回路と基板の接続構造 - Google Patents
集積回路と基板の接続構造Info
- Publication number
- JPS58118742U JPS58118742U JP1538482U JP1538482U JPS58118742U JP S58118742 U JPS58118742 U JP S58118742U JP 1538482 U JP1538482 U JP 1538482U JP 1538482 U JP1538482 U JP 1538482U JP S58118742 U JPS58118742 U JP S58118742U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- board
- connection structure
- circuit board
- finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図、２図は従来のＩＣと基板の接続構造の断面図。
第３図は本発明によるＩＣと基板の接続構造の断面図。
１・・・ツール、３・・・フィンガー（パターン）、６
・・・ボンディングヘッド、７・・・バンプ、８・・・
絶縁板。
・・・ボンディングヘッド、７・・・バンプ、８・・・
絶縁板。
Claims (1)
- 集積回路のバンプと回路基板のフィンガーとの接続構造
において、少なくも一部が前記集積回路と重なる絶縁板
を前記回路基板に固定し、前記絶縁板のバネ力を利用し
て前記集積回路のバンプと回路基板のフィンガーとを接
続するよう構成したことを特徴とする、集積回路と基板
の接続構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1538482U JPS58118742U (ja) | 1982-02-05 | 1982-02-05 | 集積回路と基板の接続構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1538482U JPS58118742U (ja) | 1982-02-05 | 1982-02-05 | 集積回路と基板の接続構造 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58118742U true JPS58118742U (ja) | 1983-08-13 |
Family
ID=30027813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1538482U Pending JPS58118742U (ja) | 1982-02-05 | 1982-02-05 | 集積回路と基板の接続構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58118742U (ja) |
-
1982
- 1982-02-05 JP JP1538482U patent/JPS58118742U/ja active Pending
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