JPS58162040A - 双脚型電子部品の洗浄又は乾燥装置における固定装置 - Google Patents

双脚型電子部品の洗浄又は乾燥装置における固定装置

Info

Publication number
JPS58162040A
JPS58162040A JP57046122A JP4612282A JPS58162040A JP S58162040 A JPS58162040 A JP S58162040A JP 57046122 A JP57046122 A JP 57046122A JP 4612282 A JP4612282 A JP 4612282A JP S58162040 A JPS58162040 A JP S58162040A
Authority
JP
Japan
Prior art keywords
shaft
rod
lever
rail
main shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57046122A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6316907B2 (en:Method
Inventor
Etsunori Fukuda
福田　悦教
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IDEYA KK
Original Assignee
IDEYA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IDEYA KK filed Critical IDEYA KK
Priority to JP57046122A priority Critical patent/JPS58162040A/ja
Priority to EP83102678A priority patent/EP0090286B1/en
Priority to DE8383102678T priority patent/DE3364325D1/de
Publication of JPS58162040A publication Critical patent/JPS58162040A/ja
Priority to US06/636,808 priority patent/US4526185A/en
Publication of JPS6316907B2 publication Critical patent/JPS6316907B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP57046122A 1982-03-23 1982-03-23 双脚型電子部品の洗浄又は乾燥装置における固定装置 Granted JPS58162040A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP57046122A JPS58162040A (ja) 1982-03-23 1982-03-23 双脚型電子部品の洗浄又は乾燥装置における固定装置
EP83102678A EP0090286B1 (en) 1982-03-23 1983-03-18 A holding apparatus for use in cleaner or dryer for dual pin type electronic parts
DE8383102678T DE3364325D1 (en) 1982-03-23 1983-03-18 A holding apparatus for use in cleaner or dryer for dual pin type electronic parts
US06/636,808 US4526185A (en) 1982-03-23 1984-08-03 Holding apparatus for use in cleaner or dryer for dual pin type electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57046122A JPS58162040A (ja) 1982-03-23 1982-03-23 双脚型電子部品の洗浄又は乾燥装置における固定装置

Publications (2)

Publication Number Publication Date
JPS58162040A true JPS58162040A (ja) 1983-09-26
JPS6316907B2 JPS6316907B2 (en:Method) 1988-04-11

Family

ID=12738181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57046122A Granted JPS58162040A (ja) 1982-03-23 1982-03-23 双脚型電子部品の洗浄又は乾燥装置における固定装置

Country Status (4)

Country Link
US (1) US4526185A (en:Method)
EP (1) EP0090286B1 (en:Method)
JP (1) JPS58162040A (en:Method)
DE (1) DE3364325D1 (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61212048A (ja) * 1985-03-18 1986-09-20 Ideya:Kk 電子部品の保持装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6136363U (ja) * 1984-07-31 1986-03-06 株式会社 タムラ製作所 被はんだ付け物整列支持用の治具
JPH0352204U (en:Method) * 1989-09-28 1991-05-21
US5531236A (en) * 1994-06-01 1996-07-02 Kempka; Steven N. Directed flow fluid rinse trough

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1884309A (en) * 1927-11-21 1932-10-25 Delcoremy Corp Machine for surfacing the rubbing blocks of the circuit breaker levers of ignition timers
US2156453A (en) * 1936-07-06 1939-05-02 Alfred E Hamilton Grinding machine
US2572364A (en) * 1948-03-31 1951-10-23 Ibm Automatic grinding machine
US2691254A (en) * 1950-03-16 1954-10-12 Robbins Edward Stanley Tile sizing machine and method
US2972997A (en) * 1956-04-09 1961-02-28 Libbey Owens Ford Glass Co Apparatus for cleaning surfaces
US3583363A (en) * 1969-03-05 1971-06-08 Air Reduction Substrate support apparatus
US3749058A (en) * 1971-07-26 1973-07-31 Ion Equipment Corp Rotary substrate holder assembly
DE3028536C2 (de) * 1980-07-28 1983-01-05 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur Halterung von kreisförmigen Substratscheiben und ihre Verwendung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61212048A (ja) * 1985-03-18 1986-09-20 Ideya:Kk 電子部品の保持装置

Also Published As

Publication number Publication date
EP0090286A1 (en) 1983-10-05
JPS6316907B2 (en:Method) 1988-04-11
US4526185A (en) 1985-07-02
DE3364325D1 (en) 1986-08-07
EP0090286B1 (en) 1986-07-02

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