JPH0135504B2 - - Google Patents
Info
- Publication number
- JPH0135504B2 JPH0135504B2 JP57046121A JP4612182A JPH0135504B2 JP H0135504 B2 JPH0135504 B2 JP H0135504B2 JP 57046121 A JP57046121 A JP 57046121A JP 4612182 A JP4612182 A JP 4612182A JP H0135504 B2 JPH0135504 B2 JP H0135504B2
- Authority
- JP
- Japan
- Prior art keywords
- claw plate
- claw
- clamp
- electronic components
- plate mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0007—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components using handtools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0447—Hand tools therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57046121A JPS58162096A (ja) | 1982-03-23 | 1982-03-23 | 双脚型電子部品のクランプ装置 |
| EP83102677A EP0089636B1 (en) | 1982-03-23 | 1983-03-18 | Apparatus for clamping dual pin type electronic parts |
| DE8383102677T DE3370271D1 (en) | 1982-03-23 | 1983-03-18 | Apparatus for clamping dual pin type electronic parts |
| HK437/90A HK43790A (en) | 1982-03-23 | 1990-06-07 | Apparatus for clamping dual pin type electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57046121A JPS58162096A (ja) | 1982-03-23 | 1982-03-23 | 双脚型電子部品のクランプ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58162096A JPS58162096A (ja) | 1983-09-26 |
| JPH0135504B2 true JPH0135504B2 (en:Method) | 1989-07-25 |
Family
ID=12738154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57046121A Granted JPS58162096A (ja) | 1982-03-23 | 1982-03-23 | 双脚型電子部品のクランプ装置 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0089636B1 (en:Method) |
| JP (1) | JPS58162096A (en:Method) |
| DE (1) | DE3370271D1 (en:Method) |
| HK (1) | HK43790A (en:Method) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61212047A (ja) * | 1985-03-18 | 1986-09-20 | Ideya:Kk | 電子部品のクランプ機構 |
| CN109273390B (zh) * | 2018-11-14 | 2023-08-29 | 中国电子科技集团公司第二十四研究所 | 一种双列直插类管壳通用旋转清洗夹具 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL241337A (en:Method) * | 1959-07-16 | |||
| US3538580A (en) * | 1968-03-04 | 1970-11-10 | Amp Inc | Tool for mounting and removing pluggable circuit components |
| US3640519A (en) * | 1969-08-13 | 1972-02-08 | William M Halstead | Handling and heat-dissipating device for electrical components |
| US3757406A (en) * | 1972-07-24 | 1973-09-11 | Techni Tool Inc | Tool for removing and inserting modules |
| US3874443A (en) * | 1973-07-16 | 1975-04-01 | Joseph V Bayer | Heat dissipator |
| JPS51110976A (en:Method) * | 1975-03-26 | 1976-09-30 | Kokusai Electric Co Ltd | |
| JPS5330086A (en) * | 1976-08-31 | 1978-03-20 | Toshiba Corp | Apparatus for inserting electric parts |
| JPS5336667A (en) * | 1976-09-17 | 1978-04-05 | Matsushita Electric Industrial Co Ltd | Automatic inserting device |
| JPS5443574A (en) * | 1977-09-12 | 1979-04-06 | Seiko Instr & Electronics | Electrical parts insertion device |
| DE2813481C2 (de) * | 1978-03-29 | 1980-03-13 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Vorrichtung zum Abziehen eines vielpoligen elektrischen Bauteils von einer Trägerplatte |
-
1982
- 1982-03-23 JP JP57046121A patent/JPS58162096A/ja active Granted
-
1983
- 1983-03-18 DE DE8383102677T patent/DE3370271D1/de not_active Expired
- 1983-03-18 EP EP83102677A patent/EP0089636B1/en not_active Expired
-
1990
- 1990-06-07 HK HK437/90A patent/HK43790A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE3370271D1 (en) | 1987-04-16 |
| JPS58162096A (ja) | 1983-09-26 |
| EP0089636A1 (en) | 1983-09-28 |
| EP0089636B1 (en) | 1987-03-11 |
| HK43790A (en) | 1990-06-15 |
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